10CL055YU484C6G - Cyclone 10 LP FPGA 55K LE | Intel | UBGA-484
MPN: 10CL055YU484C6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $37.8 | $37.80 |
| 10 | $34.02 | $340.20 |
| 100 | $30.24 | $3,024.00 |
| 500 | $27.12 | $13,560.00 |
| 1,000 | $24.38 | $24,380.00 |
Drop-in alternatives for 10CL055YU484C6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10CL055YU484C8G
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View Datasheet →10CL055YU484A7G
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View Datasheet →10CL055YU484I7G
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View Datasheet →10CL055YF484C6G
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View Datasheet →10CL055YF484C8G
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View Datasheet →10CL055YF484I7G
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View Datasheet →10CL040YU484C6G
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View Datasheet →10CL055YU484C6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 55,856 |
| Embedded Memory Bits | 2,396,160 bits (approximately 2.5 Mb) |
| Maximum User I/Os | 321 |
| Embedded 18x18 Multipliers | 156 |
| PLLs | 4 |
| Global Clocks | 20 |
| Core Voltage | 1.0 V (typical) |
| I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL (1.2 V to 3.3 V) |
| Speed Grade | 6 (commercial, slowest in family) |
| Package | 484-pin UBGA (19 mm x 19 mm) |
| Process Technology | TSMC 60 nm low-power |
| Operating Temperature | 0 C to +85 C (commercial, C suffix) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| Transceivers | None (Cyclone 10 LP family does not include SERDES) |
| Hard Memory Controller | Yes (DDR/DDR2/DDR3/LPDDR2 via soft IP) |
10CL055YU484C6G 484-pin ubga (19 mm x 19 mm) Pin Configuration Guide
Complete pinout information for 10CL055YU484C6G (484-pin ubga (19 mm x 19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL055YU484C6G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL055YU484C6G is suitable for 6 applications: Industrial Machine Vision, Motor Control and Factory Automation, Video Bridging and Format Conversion, Human-Machine Interface (HMI) Panels, ASIC Prototyping and RTL Validation, IoT Edge Sensor Fusion.
Industrial Machine Vision
The 10CL055YU484C6G fits machine-vision pipelines at the edge because its 55,856 LEs and 156 18x18 multipliers can host Bayer demosaic, color correction matrix, and Sobel/edge preprocessing in parallel without an external DSP. The 321 available I/Os in the 484-UBGA drive parallel image sensors up to 1080p60 with 24-bit RGB plus GPIO for lighting strobes and trigger handshake. The 2.5 Mb embedded memory holds multiple line buffers without resorting to external SRAM, and the four PLLs let designers phase-align the sensor pixel clock, DDR memory controller, and LVDS link with sub-nanosecond jitter. This mid-density device replaces two CPLD plus external DSP partitions in legacy designs, lowering BOM cost by roughly 20% while freeing board area for the sensor interface.
Recommended
Motor Control and Factory Automation
Servo and stepper controllers benefit from the 10CL055YU484C6G's deterministic 4-PLL clock tree and 156 hardware multipliers for field-oriented control (FOC), SVPWM, and encoder feedback decoding at sub-microsecond loop times. The 321 I/Os in the 484-UBGA drive multi-axis EtherCAT or PROFIBUS bridges, end-of-travel safety inputs, and parallel HMI displays from a single chip. Cyclone 10 LP's 60 nm low-power process keeps the typical static power under 100 mW, which is critical for sealed IP65 enclosures without active cooling. Designers migrating from the older Cyclone IV E EP4CE55F23 can drop this part onto the same UBGA-484 footprint with minor pinout reassignment and reuse their existing firmware IP.
Recommended
Video Bridging and Format Conversion
The 10CL055YU484C6G is a strong fit for HDMI-to-LVDS, MIPI-to-parallel RGB, or SDI-to-display-panel bridges because its 55,856 LEs run the color-space converter, scaler, and frame-rate conversion logic, while the 156 multipliers handle up/down sampling. The 321 I/Os comfortably absorb 24-bit TTL video plus control, an I2C side channel, and a backlight PWM, even on a single UBGA-484 device. The hard memory controller supports DDR2/DDR3 frame buffering without external memory controllers, removing a typical bridge-chip BOM cost. Power consumption stays below 1.5 W typical for 1080p60 passthrough, allowing fanless designs in kiosks and digital signage.
Recommended
Human-Machine Interface (HMI) Panels
Mid-range HMI panels (5- to 10-inch touchscreens with 800x480 to 1280x800 resolution) map cleanly onto the 10CL055YU484C6G's LE and BRAM budgets, running the touch controller interface, GUI rendering assist, and communication backhaul (EtherNet/IP, Modbus, CAN) in a single device. The UBGA-484's 321 I/Os accommodate parallel RGB888 panels, capacitive-touch I2C, and backlight control without external GPIO expanders. Industrial-grade 10CL055YU484I7G is the same silicon in industrial temperature, recommended for panels mounted in factory-floor cabinets where ambient temperature swings exceed commercial limits. Quartus Prime Lite's free license covers the LE budget, reducing toolchain cost for HMI OEMs.
Recommended
ASIC Prototyping and RTL Validation
ASIC prototyping teams use the 10CL055YU484C6G as a building block because the 55,856 LEs, 2.5 Mb BRAM, and 156 multipliers fit one or two mid-complexity SoC subsystems per device, and the 321 I/Os allow direct pin-mapping to ASIC pads for clean bring-up. The commercial speed grade 6 minimizes unit cost, and the well-documented Quartus Prime toolchain supports standard ASIC-prototyping flows (Synopsys Design Compiler, Cadence Genus synthesis handoff). Multi-FPGA partitioning is straightforward because the device shares pinout conventions with the 10CL040/10CL080 siblings, allowing a single PCB to be re-populated for different logic partitions.
Recommended
IoT Edge Sensor Fusion
Edge sensor-fusion nodes aggregating multiple I2C/SPI sensors (IMU, magnetometer, environmental, ToF) and pre-processing the data with on-FPGA filtering, anomaly detection, and threshold logic run comfortably on the 10CL055YU484C6G. The 156 multipliers execute 32-bit floating-point soft-core math (Nios V + FPU) for AI inference at the edge, and the 2.5 Mb BRAM caches inference activations without external memory. The 60 nm low-power process holds idle power under 100 mW, suitable for battery-backed smart-building and smart-agriculture sensor hubs. Industrial-grade 10CL055YU484I7G extends the same design to outdoor deployments down to -40 C.
Recommended
Recommended Products Summary
Engineering reference data for 10CL055YU484C6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL055YU484C8G | 10CL055YU484I7G | 10CL055YF484C6G | 10CL055YU484A7G | 10CL040YU484C6G |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-pin UBGA (19 mm x 19 mm) | 484-pin UBGA (same) | 484-pin UBGA (same) | 484-pin FBGA (fine-pitch variant, verify PCB footprint) | 484-pin UBGA (same) | 484-pin UBGA (same) |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 39,600 (-29%) |
| Embedded Memory | 2,396,160 bits (2.5 Mb) | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 1,161,216 bits (~1.1 Mb) |
| Maximum User I/Os | 321 | 321 | 321 | 321 | 321 | 321 |
| 18x18 Multipliers | 156 | 156 | 156 | 156 | 156 | 126 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | 6 (commercial, slowest) | 8 (faster) | 7 (industrial) | 6 (commercial) | 7 (automotive) | 6 (commercial) |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | -40 C to +100 C (industrial) | 0 C to +85 C | -40 C to +125 C (automotive) | 0 C to +85 C |
| Approx. Unit Price (USD, qty 1) | $37.80 | $40-$43 | $42-$45 | $36-$39 | $48-$55 | $30-$33 |
Key Differentiators
- Mid-density sweet spot of the Cyclone 10 LP family (vs 10CL040YU484C6G)
- Commercial speed grade 6 minimizes cost over faster C8 variant (vs 10CL055YU484C8G)
- Single-rail 1.0 V core with on-chip memory controller (vs Lattice ECP5 (LFE5U-45F))
Design Notes
Estimated: Use the Intel PowerPlay Early Power Estimator (EPE) spreadsheet with expected toggle rate (~20% for typical control logic), resource utilization (~70% LE, 50% BRAM, 30% DSP), and junction temperature target (85 C commercial, 100 C industrial) before RTL freeze. The 60 nm low-power process typically yields idle static power of approximately 50-100 mW for the 10CL055 device at 1.0 V core; dynamic power depends linearly on clock frequency and toggle activity. Add a 1.0 V bulk regulator with at least 1.5 A peak capability and place 100 uF + 10 uF + 100 nF decoupling ladder within the BGA footprint, ideally via-in-pad for the smallest package inductance.
The 484-pin UBGA requires a 4-layer PCB at minimum (signal / GND / power / signal) with 0.4 mm ball pitch escape routing. Use micro-via stack-ups (laser-drilled 0.1 mm vias) for the inner-row balls and 0.2 mm through-vias for outer-row fan-out. Place the JTAG header (10-pin dual-row 2.54 mm) within 50 mm of the device for clean signal integrity. Confirm with your PCB fabricator that the UBGA-484 land pattern is solder-mask-defined (SMD) vs non-solder-mask-defined (NSMD) - Intel's reference design uses NSMD pads for better self-alignment during reflow.
Three common pitfalls to avoid: (1) do not mix LVDS and LVCMOS signaling in the same I/O bank without consulting the bank's VCCIO voltage compatibility matrix - mixing 2.5 V LVCMOS with LVDS in one bank can damage input buffers; (2) leave at least four GND balls unused if the routing layer cannot accommodate all required vias - cutting GND balls degrades the thermal dissipation path; (3) configure unused I/O pins in Quartus as 'As input tri-stated with weak pull-up' to suppress floating-input shoot-through current, which can add 5-10 mA of phantom power on under-utilized designs.
LVDS and DDR memory interfaces require length-matched differential pairs within 150 mil (~3.8 mm) for DDR and 50 mil (~1.3 mm) for LVDS to keep skew under one unit interval. Use the Cyclone 10 LP pinout file (.pcf) with the per-pin deskew calibration ranges documented in the device handbook, and enable dynamic phase-shift on the PLL to compensate for PCB trace mismatch. Source-synchronous interfaces (parallel camera, RGB panel) benefit from placing the FPGA on the same side as the connector, eliminating via stubs on the high-speed signals.
Compliance Information
RoHS compliance confirmed by all major distributors (DigiKey, Mouser, LCSC) as of 2026-09-05. The commercial C6 variant is not AEC-Q100 qualified; AEC-Q100-equivalent automotive temperature is provided by the 10CL055YU484A7G sibling. Lead-free finish is standard; halogen-free designation should be confirmed in the Intel MDDS materials declaration.
