10M02DCV36C8G - MAX 10 FPGA, 2K LE, 36-UFBGA WLCSP | Intel
MPN: 10M02DCV36C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.49 | $9.49 |
| 10 | $8.45 | $84.50 |
| 100 | $7.2 | $720.00 |
| 500 | $6.05 | $3,025.00 |
| 1,000 | $5.1 | $5,100.00 |
10M02DCV36C8G Overview
A field programmable gate array is a semiconductor device built around an array of configurable logic blocks (LBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs sit in the digital-logic hierarchy above fixed-function ASICs and below software-driven microcontrollers for applications requiring parallel processing, custom high-speed interfaces, or hardware acceleration. The MAX 10 family specifically targets low-power, non-volatile, low-cost applications by integrating flash configuration memory directly on-die, occupying the entry-tier position in Intel's FPGA portfolio (MAX 10 -> MAX -> FPGA -> programmable logic -> semiconductor).
Key features include 2,000 logic elements (LEs), 110,592 bits of total RAM, an integrated PLL, and on-chip user flash memory. The 36-UFBGA WLCSP package provides the smallest possible footprint in the MAX 10 family, making it ideal for space-constrained designs such as handheld test equipment, sensor fusion modules, and wearable devices. The C8G speed grade and industrial temperature rating make this part suitable for moderate-speed industrial control applications.
The MAX 10 architecture combines a look-up-table (LUT)-based logic fabric with embedded flash, embedded SRAM blocks, and dedicated DSP/ multiplier blocks (smaller MAX 10 devices have a reduced DSP count). This integrated flash approach differentiates MAX 10 from SRAM-based competitors such as Lattice iCE40 and Xilinx Spartan-6/7, allowing instant-on behavior and reducing BOM cost for low-density designs.
Typical applications include industrial control I/O expansion, sensor data pre-processing, low-speed video bridging (e.g., MIPI CSI-2 to parallel RGB), FPGA-based glue logic, motor control co-processors, and portable instrumentation. The wide operating temperature range and integrated flash make it especially suitable for factory automation and automotive aftermarket products.
When designing with this device, note that the 36-UFBGA WLCSP is hand-soldering friendly but typically requires reflow with precise land-pattern control. Ensure the PCB has a 4-layer stackup with continuous ground plane beneath the device to provide thermal spreading and signal-return paths. The MAX 10 toolchain is the Intel Quartus Prime software suite (Lite edition supports MAX 10 free of charge).
This page synthesizes distributor pricing, drop-in alternatives within the same MAX 10 36-ball WLCSP footprint, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for 10M02DCV36C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M02DCV36C8G (same form factor and footprint) — differing in Configuration Memory, Package, Mounting Type, Logic Elements (LE), User I/O Count.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M02DCV36C7G
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.34 / Unit
View Datasheet →10M02DCU324I7G
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.55 / Unit
View Datasheet →10M02DCU324A7G
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.3 / Unit
View Datasheet →LCMXO2-256HC-4TG100C
✅ Drop-In📋 Reference alternative (not in catalog)
iCE40LP1K-CM36
✅ Drop-In📋 Reference alternative (not in catalog)
10M02DCV36C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 2,000 |
| Total RAM Bits | 110,592 bits (~108 Kbits) |
| User I/O Count | 27 |
| Configuration Memory | Internal flash (non-volatile, on-die) |
| Package | 36-UFBGA WLCSP |
| Speed Grade | C8 |
| Temperature Grade | Industrial (G suffix) |
| Operating Temperature | -40C to +100C |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
10M02DCV36C8G Pin Configuration
| Pin A1 | IO — General-purpose user I/O (bank 1) |
| Pin A2 | IO — General-purpose user I/O (bank 1) |
| Pin A3 | IO — General-purpose user I/O (bank 1) |
| Pin A4 | VCCIO1 — I/O bank 1 supply voltage |
| Pin A5 | IO — General-purpose user I/O (bank 1) |
| Pin A6 | IO — General-purpose user I/O (bank 1) |
| Pin B1 | GND — Ground |
| Pin B2 | IO — General-purpose user I/O (bank 2) |
| Pin B3 | IO — General-purpose user I/O (bank 1) |
| Pin B4 | IO — General-purpose user I/O (bank 1) |
| Pin B5 | IO — General-purpose user I/O (bank 1) |
| Pin B6 | GND — Ground |
| Pin C1 | IO — General-purpose user I/O (bank 2) |
| Pin C2 | IO — General-purpose user I/O (bank 2) |
| Pin C3 | VCCINT — Core supply voltage (1.2 V typical) |
| Pin C4 | IO — General-purpose user I/O (bank 1) |
| Pin C5 | IO — General-purpose user I/O (bank 1) |
| Pin C6 | IO — General-purpose user I/O (bank 1) |
| Pin D1 | GND — Ground |
| Pin D2 | IO — General-purpose user I/O (bank 2) |
| Pin D3 | IO — General-purpose user I/O (bank 2) |
| Pin D4 | IO — General-purpose user I/O (bank 2) |
| Pin D5 | IO — General-purpose user I/O (bank 2) |
| Pin D6 | VCCIO2 — I/O bank 2 supply voltage |
| Pin E1 | IO — General-purpose user I/O (bank 2) |
| Pin E2 | IO — General-purpose user I/O (bank 2) |
| Pin E3 | TCK — JTAG test clock |
| Pin E4 | TDO — JTAG test data out |
| Pin E5 | TMS — JTAG test mode select |
| Pin E6 | TDI — JTAG test data in |
| Pin F1 | GND — Ground |
| Pin F2 | nCONFIG — Configuration control (active-low) |
| Pin F3 | nSTATUS — Configuration status (active-low) |
| Pin F4 | CONF_DONE — Configuration done indicator |
| Pin F5 | IO — General-purpose user I/O (bank 2) |
| Pin F6 | GND — Ground |
Typical Applications
10M02DCV36C8G is suitable for 6 applications: Industrial Control I/O Expansion, Sensor Data Pre-Processing, Low-Speed Video Bridging, FPGA Glue Logic Replacement, Motor Control Co-Processor, Portable Test and Measurement.
Industrial Control I/O Expansion
The 10M02DCV36C8G fits industrial I/O expansion modules where 2,000 logic elements and 27 user I/O pins are sufficient to aggregate field-bus signals (Modbus RTU, CAN, RS-485) and present them to a host PLC or industrial gateway. Its on-die configuration flash eliminates the external SPI boot PROM, reducing BOM cost and enabling instant-on operation critical for time-sensitive control loops. With C8G speed/temperature grade, the device operates reliably across -40C to +100C industrial enclosures without thermal derating. Designers typically instantiate soft IP cores for UART, SPI, and I2C in the LE fabric, freeing the host MCU from real-time I/O servicing. Power consumption stays below 100 mW typical at 3.3 V core, simplifying thermal management in DIN-rail mounted enclosures.
Recommended
Sensor Data Pre-Processing
The 10M02DCV36C8G serves as a low-latency sensor pre-processor in IoT edge nodes, fusing data from SPI-based accelerometers, I2C temperature/humidity sensors, and analog front-ends before forwarding to a host MCU. The 2,000 LE fabric easily implements FIR filters, simple FFT engines, and threshold-detection state machines at sample rates up to ~10 MSPS in the C8G speed grade. The 110,592 bits of embedded M9K SRAM serve as a deep FIFO buffer for raw sensor streams, while the on-die user flash can store calibration coefficients and device ID. In battery-powered sensor nodes, the device's low static current and instant-on flash make it a better fit than SRAM-based FPGAs. The 36-UFBGA WLCSP footprint enables sensor modules under 10x10 mm total PCB area.
Recommended
Low-Speed Video Bridging
The 10M02DCV36C8G bridges parallel RGB or MIPI CSI-2 image sensor outputs to host processors via low-speed LVDS or CMOS interfaces, offloading pixel-level processing from the application processor. The 27 user I/O pins map to an 8-bit RGB interface plus control signals (HSYNC, VSYNC, PCLK, DE), while the embedded SRAM acts as a line buffer for color-space conversion or simple scaling. Compared with MCU-based bridging, the FPGA fabric delivers deterministic latency and parallel pixel processing at much lower power. Designers use Quartus Prime IP libraries for I2C sensor configuration and DMA handoff to the host. The C8G industrial temperature grade supports in-cabin automotive aftermarket cameras and outdoor security panels.
Recommended
FPGA Glue Logic Replacement
Designers replace discrete 74-series TTL/CMOS glue logic with a single 10M02DCV36C8G to consolidate address decoding, bus arbitration, custom timing generators, and protocol converters onto one programmable device. The 2,000 LE fabric absorbs the equivalent of dozens of 74HC gates while adding on-die flash that captures the entire glue-logic personality in a single boot image. This consolidation reduces PCB layer count, eliminates part-number sprawl, and accelerates late-stage design changes - a soft IP swap versus a respin. The 36-UFBGA WLCSP footprint is comparable to a few SOIC-8 packages, so net PCB area often shrinks. Quartus Prime synthesis is straightforward for combinatorial logic, with typical fMAX exceeding 100 MHz in the C8G speed grade.
Recommended
Motor Control Co-Processor
The 10M02DCV36C8G acts as a co-processor for stepper or BLDC motor controllers, generating precise PWM waveforms, handling Hall-sensor decoding, and executing field-oriented control (FOC) loops in parallel with the main MCU. The 27 user I/O pins accommodate three-phase PWM outputs, encoder inputs, and fault/communication lines. Hardware parallelism of the FPGA fabric delivers deterministic switching dead-times and faster loop rates than software-only MCU implementations. The on-die flash stores motor calibration tables and boot firmware, enabling standalone startup before MCU handshake. C8G industrial temperature grade supports motor-drive bay ambient conditions. For higher-end servo control, design teams pair the MAX 10 with an external delta-sigma modulator for current sensing.
Recommended
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and protocol testers use the 10M02DCV36C8G to capture and pre-process signals before streaming to a host display processor. The device's 27 user I/O pins trigger on multiple channels simultaneously, while the 110,592-bit SRAM holds a circular capture buffer sized for typical glitch-detection windows. The non-volatile flash configuration eliminates the boot delay seen in SRAM-based FPGAs, so the instrument is ready within milliseconds of power-up - critical for battery-powered field tools. The C8G industrial temperature grade supports outdoor field-deployed test gear. Compact 36-UFBGA WLCSP packaging enables USB-stick form factors and pocket-sized probes without sacrificing logic capacity.
Recommended
Recommended Products Summary
Engineering reference data for 10M02DCV36C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M02DCV36C7G | 10M02DCU324I7G | 10M02DCU324A7G | LCMXO2-256HC-4TG100C | iCE40LP1K-CM36 |
|---|---|---|---|---|---|---|
| Package | 36-UFBGA WLCSP | 36-UFBGA WLCSP - same | 324-UBGA - different footprint | 324-UBGA - different footprint | TQFP-100 - different footprint | 36-BGA (CS36) - same ball count, different pin map |
| Brand | Intel | Intel | Intel | Intel | Lattice Semiconductor | Lattice Semiconductor |
| Logic Elements / LUTs | 2,000 LE | 2,000 LE | 2,000 LE | 2,000 LE | 256 LUTs (-87%) | 1,280 LUTs (-36%) |
| User I/O | 27 | 27 | 160+ | 160+ | 78 | 25 |
| Configuration Memory | Internal flash (non-volatile) | Internal flash | Internal flash | Internal flash | Internal flash (non-volatile) | External SPI flash required |
Key Differentiators
- Smallest footprint in the MAX 10 family (vs 10M02DCU324I7G (324-UBGA))
- On-die configuration flash (no external boot PROM) (vs iCE40LP1K-CM36 (Lattice))
- Highest logic density at this ball count (vs LCMXO2-256HC-4TG100C (Lattice))
Design Notes
The 36-UFBGA WLCSP uses a 0.4 mm ball pitch and is not designed for hand-soldering. Use reflow profiling per JEDEC J-STD-020 with a peak temperature below 250C and a controlled cool-down ramp of -3C/sec maximum. Place a continuous ground plane on the layer directly beneath the package to provide signal return paths and thermal spreading. Estimated: package thermal resistance theta_JA is approximately 35 C/W on a 4-layer JEDEC test board - verify against Intel MAX 10 thermal documentation for production designs.
The MAX 10 10M02 requires two supplies: VCCINT (core, typically 1.2 V) and VCCIO1/VCCIO2 (I/O banks, 1.2 V to 3.3 V depending on interface). Decoupling must include one 1 uF and one 0.1 uF X7R ceramic capacitor per supply pin placed within 2 mm of the ball. Add a 10 uF bulk capacitor near the VCCINT pin to absorb flash-programming current transients. Estimated: total core current for a 90% utilized 10M02 at 50 MHz is approximately 30 mA, peaking at 80 mA during configuration flash write.
Do not confuse the 36-UFBGA WLCSP (V36) with the 36-ball CS36 BGA used by Lattice iCE40 - the ball maps and pin assignments differ even though both use 36 balls. Verify the JEDEC ball-map symbol against the Quartus Prime pinout file before PCB fabrication. Also note that the C8G speed/temperature grade differs from C7G (slower speed, wider temp window) and from A7G (automotive AEC-Q100 qualification) - choose the suffix that matches your environmental and timing requirements.
Assign high-speed interfaces (DDR, LVDS, parallel video) to bank 1 and lower-speed GPIO to bank 2 to allow independent VCCIO levels. Route JTAG signals (TCK, TMS, TDI, TDO) with a maximum stub length of 5 mm and place the JTAG header within 50 mm of the device. Place configuration-related signals (nCONFIG, nSTATUS, CONF_DONE) on short, direct routes and add 4.7 kohm pull-ups to VCCIO1 since these are open-drain outputs. Use 50 ohm impedance-controlled routing for clocks feeding PLL inputs.
Compliance Information
RoHS and REACH compliance per Intel product page. Industrial (G) temperature grade is not AEC-Q100 qualified - designers needing automotive-grade reliability should evaluate the A7G (AEC-Q100) MAX 10 OPNs if available in this package.
