10M40DCF484C8G - MAX 10 FPGA, 40K LE, 484-FBGA | Intel / Altera
MPN: 10M40DCF484C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.75 | $6,475.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $53.9 | $53,900.00 |
Drop-in alternatives for 10M40DCF484C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M40DCF484C7G
✅ Drop-In✓ In Stock
$124.2 / Unit
View Datasheet →10M40DCF484I7G
✅ Drop-In✓ In Stock
$71.48 / Unit
View Datasheet →10M25DCF484C8G
✅ Drop-In✓ In Stock
$42.1 / Unit
View Datasheet →10M40DCF256C8G
✅ Drop-In✓ In Stock
$71.8 / Unit
View Datasheet →10M16DCF484C8G
✅ Drop-In✓ In Stock
$35.8 / Unit
View Datasheet →10M40DCF484C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Series | 10M40 |
| Device Logic Elements | 40000 |
| Embedded Memory (bits) | 1290240 |
| User I/O Count | 360 |
| Package | 484-FBGA (F484) |
| Package Code | F484 |
| Mounting Type | Surface Mount (BGA) |
| Pitch | 1.0 mm |
| Speed Grade | C8 |
| Temperature Grade | Commercial |
| Process Technology | 55 nm embedded flash |
| Configuration Memory | Internal non-volatile flash |
| On-chip ADC | 12-bit, up to 17 channels |
| RoHS Status | Compliant |
10M40DCF484C8G f484 Pin Configuration Guide
Complete pinout information for 10M40DCF484C8G (f484 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M40DCF484C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M40DCF484C8G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Video Interface Bridging, Portable Medical Instrumentation, ASIC Replacement / Low-Volume Production, Aerospace and Defense Subsystems.
Industrial Motor Control
The 10M40DCF484C8G's 40,000 logic elements and 360 user I/Os are well-matched to multi-axis industrial motor control. The device integrates a 12-bit ADC with up to 17 analog inputs for current sensing and back-EMF measurement, plus DSP blocks implementing field-oriented control (FOC) loops. Per the MAX 10 datasheet, the on-chip flash eliminates external boot memory, while the commercial C8 speed grade delivers sub-microsecond PWM update rates for closed-loop torque control. Compared to microcontroller-based solutions, the FPGA's deterministic parallel logic executes current loops in a single clock edge with no software jitter.
Recommended
Factory Automation I/O Expansion
In factory automation, the 10M40DCF484C8G serves as a deterministic I/O aggregator interfacing 24V industrial signals (24V-tolerant GPIO banks), RS-485 multi-drop buses, and EtherCAT/CAN-FD protocol stacks. The 360 user I/Os handle dense digital I/O without external bus expanders. Per Intel's MAX 10 reference designs, the non-volatile instant-on configuration is critical for production lines requiring immediate deterministic startup after power-on. Compared to discrete PLC cards, a single MAX 10 replaces multiple digital I/O modules.
Recommended
Video Interface Bridging
The 10M40DCF484C8G bridges legacy video interfaces (TTL/RGB, LVDS, MIPI-CSI) to modern displays and processors. Its 40K LEs implement color-space conversion, deinterlacing, and pixel-clock multiplication in parallel logic. The 360 user I/Os accept high-speed LVDS pairs at typical display resolutions. Per the MAX 10 datasheet, the integrated PLLs generate pixel clocks up to 150 MHz, sufficient for 1080p60 video. Compared to ASSP bridge chips, this FPGA supports multiple protocols via configuration changes without hardware redesign.
Recommended
Portable Medical Instrumentation
In portable medical devices, the 10M40DCF484C8G provides deterministic signal processing for ECG, pulse oximetry, and ultrasound front-end digitization. Its on-chip 12-bit ADC samples up to 17 analog channels for biosignal acquisition, and the DSP blocks implement digital filtering at sample rates exceeding 1 MSPS. Per Intel's MAX 10 datasheet, the embedded flash stores calibration coefficients and patient data securely. The non-volatile instant-on enables <10 ms boot, critical for emergency defibrillators and bedside monitors.
Recommended
ASIC Replacement / Low-Volume Production
For low-volume production runs (typically <10K units), the 10M40DCF484C8G serves as a cost-effective ASIC replacement. The 40K LEs accommodate gate-array-class designs that would not justify NRE on a custom ASIC. Per the MAX 10 datasheet, internal flash stores the design IP without external boot memory. Compared to ASIC NRE of $500K-$2M plus 6-month lead time, a single MAX 10 chip with $78 BOM at qty-1 reduces both NRE and time-to-market by 80-90%.
Recommended
Aerospace and Defense Subsystems
In aerospace and defense, the 10M40DCF484C8G provides deterministic logic with MIL-spec traceability through authorized distributors like FPGAX. Its non-volatile instant-on configuration is critical for avionics requiring guaranteed startup latency. Per Intel's MAX 10 datasheet, the device supports secure configuration via on-chip flash bitstream authentication. The 360 user I/Os interface to avionics buses (ARINC 429, MIL-STD-1553) and sensor arrays. Compared to ASICs, the FPGA offers field-upgradable IP for evolving requirements.
Recommended
Recommended Products Summary
Engineering reference data for 10M40DCF484C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M40DCF484C7G | 10M40DCF484I7G | 10M25DCF484C8G | 10M40DCF256C8G | 10M16DCF484C8G |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 256-FBGA (F256) - smaller | 484-FBGA (F484) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40000 | 40000 | 40000 | 25000 | 40000 | 16000 |
| User I/Os | 360 | 360 | 360 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | C8 | C7 (faster) | I7 (industrial) | C8 | C8 | C8 |
| Temperature Grade | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Commercial | Commercial |
| Embedded Memory (bits) | 1290240 | 1290240 | 1290240 | [DATA_NEEDED] | 1290240 | [DATA_NEEDED] |
| Configuration Memory | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) |
Key Differentiators
- Largest logic density in MAX 10 family at C8 speed grade (vs 10M25DCF484C8G)
- Non-volatile instant-on configuration (vs 10M40DCF256C8G)
- Commercial temperature grade for cost-optimized designs (vs 10M40DCF484I7G)
Design Notes
The 484-FBGA at 1.0 mm ball pitch requires HDI PCB stack-ups with laser-drilled microvias. Per the MAX 10 hardware design guide, use at minimum a 4-layer 1+N+1 stack-up with 0.5 mm microvia pads. Full ground and power planes must be unbroken beneath the BGA to maintain power integrity and reference plane continuity for high-speed LVDS pairs. Estimated: BGA escape routing at 4 mil trace/space requires a 0.4 mm microvia capture pad - verify with PCB fabricator capability.
Decouple the 10M40DCF484C8G with bulk capacitors (47 uF or higher) per each power rail (VCCINT, VCCIO, VCCA, VCCPLL). Place 0.1 uF and 1 nF ceramic bypass capacitors within 100 mil of every power pin. Per Intel's MAX 10 pin connection guidelines, each VCCIO bank should have its own decoupling network. PLL analog supplies (VCCA_PLL) require ferrite-bead filtering from the corresponding VCCINT rail to minimize jitter.
Common pitfalls when designing with the 10M40DCF484C8G include: (1) failing to assign all unused I/O pins to a defined state (input tri-stated with weak pull-up) to avoid floating inputs during configuration; (2) neglecting JTAG chain integrity - the TCK line must be clean with proper termination; (3) exceeding the maximum LVDS data rate per I/O bank without proper slew rate and pre-emphasis configuration; (4) ignoring dual-purpose configuration pin requirements (e.g., nCONFIG, nSTATUS, CONF_DONE) which must be pulled to defined states during power-up.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page. AEC-Q100 not applicable - this is a commercial-grade FPGA. Halogen-free requires IMDS verification from Intel. Conflict minerals compliance verified via Intel's CMRT filing.
