10M50DCF484C8G - MAX 10 FPGA, 50K LE, 484-FBGA | Intel
MPN: 10M50DCF484C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $119.39 | $119.39 |
| 10 | $113.7 | $1,137.00 |
| 100 | $108.29 | $10,829.00 |
| 500 | $107 | $53,500.00 |
| 1,000 | $106.16 | $106,160.00 |
| 10,000 | $106.16 | $1,061,600.00 |
Drop-in alternatives for 10M50DCF484C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M50DCF484C7G
✅ Drop-In✓ In Stock
$48.9 / Unit
View Datasheet →10M40DCF484C8G
✅ Drop-In✓ In Stock
$53.9 / Unit
View Datasheet →10M40DCF484C7G
✅ Drop-In✓ In Stock
$124.2 / Unit
View Datasheet →10M25DCF484C8G
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$42.1 / Unit
View Datasheet →10M16DCF484C8G
✅ Drop-In✓ In Stock
$35.8 / Unit
View Datasheet →10M50DCF484C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 50000 |
| Embedded Memory (bits) | 1677312 |
| Maximum User I/O | 360 |
| Process Technology | 55 nm CMOS |
| Core Voltage | 1.2 V |
| Speed Grade | 8 |
| Operating Temperature | 0C to +85C (commercial) |
| Configuration Memory | On-chip flash (non-volatile) |
| Package | 484-ball FBGA (FineLine BGA), 23 × 23 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| I/O Standards Supported | LVCMOS, LVTTL, LVDS, SSTL, differential pairs |
10M50DCF484C8G 484-ball fbga (fineline bga), 23 × 23 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10M50DCF484C8G (484-ball fbga (fineline bga), 23 × 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DCF484C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50DCF484C8G is suitable for 6 applications: Industrial Motor Control, Video Bridging and Image Processing, Factory Automation I/O Expansion, CPLD Bridge Replacement, Low-Cost Prototyping, Industrial Communication Gateways.
Industrial Motor Control
The 10M50DCF484C8G fits industrial motor control designs because its 50K logic elements and 18×18 hardware multipliers support high-resolution SVPWM calculations and field-oriented control (FOC) loops in a single device. The 360 user I/O pins accommodate multi-axis encoder feedback (LVDS), PWM channels, and current-sense ADC routing without external bus expanders. On-chip flash eliminates external configuration memory, reducing BOM count and improving mean time between failures (MTBF) in harsh factory environments. Compared with discrete MCU + CPLD architectures, integrating the control loop in this MAX 10 part reduces propagation delay for torque-loop updates below 10 µs, enabling higher switching frequencies for low-inductance PMSM motors.
Recommended
Video Bridging and Image Processing
The 10M50DCF484C8G's embedded M9K memory blocks (1,677,312 bits total) and hardware multipliers are well matched to mid-resolution video bridging designs such as HDMI-to-MIPI, dual-camera aggregation, and machine-vision preprocessing pipelines. The integrated DDR3 controller sustains line-buffer bandwidths up to 303 MHz without requiring an external memory controller FPGA. Designers typically instantiate color-space conversion, scaling, and frame-rate conversion in fabric while offloading simple overlay planes to dedicated logic. Compared with a microcontroller + GPU split architecture, this MAX 10 device consolidates bridging logic and color processing on one die, simplifying PCB layout and reducing EMI from high-speed parallel buses.
Recommended
Factory Automation I/O Expansion
With 360 user I/O pins supporting LVCMOS 1.2V through 3.3V and LVDS, the 10M50DCF484C8G serves as a programmable I/O aggregator in factory automation PLCs and distributed I/O blocks. Its non-volatile configuration means the device boots instantly on power-up with no external flash, critical for deterministic industrial protocols such as PROFINET, EtherCAT, and EtherNet/IP. The on-die ADC blocks and hardware PLLs simplify sensor conditioning for analog temperature, pressure, and flow inputs. Compared with discrete 74-series logic and CPLDs, consolidating I/O expansion in this MAX 10 part reduces board area by roughly 40% while supporting real-time protocol timestamp stamping at sub-microsecond resolution.
Recommended
CPLD Bridge Replacement
The 10M50DCF484C8G is widely used as a drop-in upgrade for aging CPLD-based glue-logic boards. With 50K logic elements versus typical 5K-LE CPLD densities, designers can consolidate multiple CPLDs into a single device while adding soft-core processors (Nios V) and protocol IP. The integrated flash and on-chip ADC blocks remove several companion ICs from the BOM. Compared with legacy MAX II/MAX V CPLD designs, porting to this MAX 10 part typically reduces component count by 30-50% and enables in-system reprogramming via JTAG without external proms. Designers should re-validate pin assignments in the CF484 ball-map because MAX 10 bank voltages differ from legacy CPLD families.
Recommended
Low-Cost Prototyping
For prototype builds and university teaching labs, the 10M50DCF484C8G's combination of high logic density, DDR3 support, and free Quartus Prime Lite software makes it an excellent learning platform. Students can implement RISC-V soft cores, simple video pipelines, or DSP algorithms without investing in expensive high-speed transceivers found in larger Cyclone or Arria families. The non-volatile flash allows instant-on demonstrations without bootloader delays. Compared with ASIC prototyping on Cyclone V or Stratix 10, this MAX 10 part is roughly one-tenth the unit cost, making it ideal for classroom use where dozens of boards are deployed simultaneously.
Recommended
Industrial Communication Gateways
The 10M50DCF484C8G is well suited for industrial protocol gateway designs (Modbus TCP, PROFINET, EtherCAT, and serial-to-Ethernet conversion). Its 50K logic elements allow simultaneous instantiation of multiple protocol stacks with hardware-accelerated CRC engines, while 360 I/O pins support RS-485, RS-232, CAN, and Ethernet PHY connections without external transceivers. The integrated flash and hardened PLLs enable deterministic boot times under 50 ms, essential for hot-swap industrial backplane applications. Compared with discrete MCU + ASIC gateway designs, this MAX 10 device consolidates routing, protocol bridging, and timestamping in a single programmable device, reducing certification effort for IEC 61508 SIL 2 designs.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DCF484C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DCF484C7G | 10M40DCF484C8G | 10M40DCF484C7G | 10M25DCF484C8G | 10M16DCF484C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (CF484) | 484-FBGA (CF484) - same | 484-FBGA (CF484) - same | 484-FBGA (CF484) - same | 484-FBGA (CF484) - same | 484-FBGA (CF484) - same |
| Logic Elements | 50000 | 50000 | 40000 | 40000 | 25000 | 16000 |
| Speed Grade | 8 | 7 | 8 | 7 | 8 | 8 |
| Maximum User I/O | 360 | 360 | 360 | 360 | 360 | 360 |
| Embedded SRAM (bits) | 1677312 | 1677312 | 1340928 | 1340928 | 837888 | 536256 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
Key Differentiators
- Highest-density MAX 10 variant in the 484-FBGA package (vs 10M40DCF484C8G)
- Pin-compatible down-grade path for cost-sensitive designs (vs 10M25DCF484C8G)
- Non-volatile on-chip flash eliminates external configuration memory (vs CPLD-based legacy designs)
Design Notes
Use a minimum of six PCB layers for the 10M50DCF484C8G with dedicated ground and 1.2V core power planes. Route all 360 user I/O signals on inner layers with continuous reference planes to maintain return-path continuity. Place all decoupling capacitors (100 nF, 10 µF bulk) within 5 mm of the BGA balls to suppress transient inrush during configuration. The 1.0 mm ball pitch requires laser-drilled micro-vias and 0.4 mm pad-to-pad clearance for reliable assembly.
Although MAX 10 devices do not have explicit junction-to-ambient thermal resistance data sheets in the public datasheet, estimated power consumption at 50% toggle rate is 1.2W typical. Estimated: with ambient 25C and TJ max 100C commercial, the minimum required thermal resistance is roughly 62.5 C/W. For enclosed industrial enclosures, provide at least 4 CFM of forced airflow or attach a small top-side heatsink.
Do not assume the 10M50DCF484C8G and 10M50DCF484C7G are bit-identical timing parts. Speed grade 8 is slower than speed grade 7 in MAX 10 nomenclature, so maximum Fmax targets must be re-validated using Quartus Prime TimeQuest. Also note that the 'I' suffix (industrial, -40C to +100C) is NOT pin-compatible with the 'C' suffix without re-checking I/O bank voltage limits; industrial parts often have different VCCIO tolerances than commercial parts.
Compliance Information
RoHS compliant per Intel product page. Not AEC-Q100 qualified - this is an FPGA, not an automotive-grade analog IC. Industrial-temperature variants (suffix 'I') are available for harsh-environment applications but are NOT AEC-Q100 certified.
