EP1S20F672I5N - 18,460 Logic Elements Stratix FPGA, 672-FBGA | Intel
MPN: EP1S20F672I5N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $261.5 | $2,615.00 |
| 100 | $232.75 | $23,275.00 |
| 500 | $210.4 | $105,200.00 |
| 1,000 | $188.9 | $188,900.00 |
Drop-in alternatives for EP1S20F672I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S20F672C7N
✅ Drop-In✓ In Stock
$109.2 / Unit
View Datasheet →EP1S20F672C7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1S20F672C6N
✅ Drop-In✓ In Stock
$68.9 / Unit
View Datasheet →EP1S20F672C6
✅ Drop-In✓ In Stock
$470 / Unit
View Datasheet →EP1S20F672I6N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S20F672I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EP1S20F672I5N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 18,460 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Embedded Memory (TriMatrix) | 1,638,400 bits (1.6 Mbit) |
| Maximum Operating Frequency | 500 MHz (internal logic) |
| DSP Blocks | Yes (variable-width multipliers) |
| PLLs | Yes (on-chip) |
| Package | 672-ball FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm |
| Speed Grade | -5 (industrial) |
| Operating Temperature (Industrial) | -40 C to +100 C ambient |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant (lead-free FBGA) |
EP1S20F672I5N 672-ball fbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1S20F672I5N (672-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S20F672I5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S20F672I5N is suitable for 6 applications: Telecommunications Line Card Processing, ASIC Prototyping and Emulation, Industrial Motor Control and Drives, Video and Image Processing Pipelines, Test and Measurement Instrumentation, Aerospace and Defense Signal Processing.
Telecommunications Line Card Processing
The EP1S20F672I5N fits telecommunications line cards because it delivers 18,460 LEs of programmable logic with embedded TriMatrix memory and DSP blocks on a 130 nm process, all packaged in a 672-ball FBGA that supports multi-lane LVDS I/O for backplane interconnect. The DSP blocks accelerate FEC (forward error correction), echo cancellation, and channel equalization functions that previously required ASSP silicon. Designers map multi-channel processing onto parallel logic structures, achieving deterministic latency far below that of a CPU-based approach. At 500 MHz internal operation the device can sustain OC-48 (2.5 Gbps) aggregate throughput when LVDS pairs are aggregated.
Recommended
ASIC Prototyping and Emulation
The EP1S20F672I5N is widely used for ASIC prototyping because its 18,460 LEs combined with 1.6 Mbit of TriMatrix memory can host sub-blocks of larger ASIC designs mapped via synthesis. Quartus II supports rapid place-and-route iteration, and the FPGA can be linked through a Multi-FPGA partitioner to scale to multi-million-gate ASIC prototypes. Its industrial temperature rating lets the same prototype board move between development labs and field trials without re-qualifying thermal margins. The 672-ball FBGA exposes abundant user I/O, allowing designers to break out ASIC pins to external logic analyzers and oscilloscopes for real-time debug.
Recommended
Industrial Motor Control and Drives
The EP1S20F672I5N suits industrial motor control because its industrial temperature rating (-40 C to +100 C) survives factory-floor environments and the 18,460 LEs run encoder decoding, current-loop control, and space-vector PWM generation in parallel hardware. DSP blocks accelerate Park/Clark transforms and sensorless estimators, while the PLL-rich clock network synchronizes PWM to back-EMF sampling. The 672-ball FBGA exposes sufficient I/O to drive multiple power stages and feedback channels. Migration to newer Cyclone III/IV devices is recommended for new designs, but the Stratix I remains a long-life choice for installed equipment platforms.
Recommended
Video and Image Processing Pipelines
The EP1S20F672I5N is a strong fit for video processing pipelines because its DSP blocks accelerate FIR filters, color-space conversion, and discrete-cosine transform stages that form the core of video codec implementations. The 1.6 Mbit embedded memory acts as line buffers for HD resolution streams, and the 672-ball FBGA exposes LVDS pairs for camera sensor and display panel interconnects. Engineers implement ITU-R BT.656, BT.1120, or HDMI bridge logic in parallel fabric with deterministic timing. Industrial temperature rating allows the design to live in outdoor digital signage and surveillance enclosures.
Recommended
Test and Measurement Instrumentation
The EP1S20F672I5N is ideal for test and measurement instruments because the parallel fabric drives real-time waveform capture, trigger logic, and DSP-based signal analysis at speeds unattainable by microcontrollers. 18,460 LEs implement complex triggering state machines and on-the-fly FFT/Goertzel analysis, while TriMatrix memory stores sample buffers. The industrial temperature grade allows portable instruments to operate from -40 C in field work, and the FBGA package provides ample LVDS for parallel ADC/DAC interfaces. Replacement parts for legacy instruments are critical, and Stratix I remains in long-term supply via last-time-buy channels.
Recommended
Aerospace and Defense Signal Processing
The EP1S20F672I5N has historically served aerospace and defense applications where deterministic latency and high logic density in an industrial-temperature BGA are mandatory. The 18,460 LEs implement radar pulse compression, beamforming weights, and digital IF stages in parallel fabric, while TriMatrix memory acts as a fast scratchpad for FFT stages. Its 1.5 V core and proven 130 nm process technology have flown in numerous deployed systems over two decades. New programs should consider radiation-hardened Microsemi/PolarFire or newer Intel Stratix V/V10 parts, but legacy systems rely on Stratix I for the rest of their lifecycle.
Recommended
Recommended Products Summary
Engineering reference data for EP1S20F672I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S20F672C7N | EP1S20F672C7 | EP1S20F672C6N | EP1S20F672C6 | EP1S20F672I6N | EP1S20F672I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA (FineLine BGA) | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 | 18,460 |
| Speed Grade | -5 | -7 (fastest) | -7 (fastest) | -6 | -6 | -6 | -7 (fastest industrial) |
| Operating Temperature | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded Memory | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix | 1.6 Mbit TriMatrix |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
| Packaging Carrier | Tray (N suffix = tape & reel) | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel | Tape & Reel |
Key Differentiators
- Industrial temperature rating at speed grade -5 (vs EP1S20F672C7N)
- Drop-in compatible with all 672-ball Stratix I variants (vs EP1S20F672C6)
- Slowest speed grade offers cost advantage in non-timing-critical designs (vs EP1S20F672I7N)
Design Notes
Estimated: at 100% LE utilization running at 300 MHz with toggling I/O, the EP1S20F672I5N dissipates roughly 2.5 W. The 672-ball FBGA's theta_JA is approximately 18 C/W with a 1-oz 4-layer JEDEC test board, so junction temperature rises about 45 C above ambient. Designers must keep ambient below +55 C to stay within the +100 C industrial ceiling, or attach a heatsink spreader through the central ball grid for high-thermal-load designs.
The 672-ball FBGA uses 1.0 mm pitch - plan a 6-layer stack-up with 0.5 oz copper on outer layers and 1 oz on inner planes. Use 0.2 mm laser-drilled microvias or via-in-pad technology with copper-filled plating because dog-bone fan-out exceeds escape routability for 0.15 mm trace/space rules. Provide continuous GND and PWR planes under the BGA to minimize inductance for the multi-rail decoupling network (VCCINT, VCCIO banks, VCC_PLL, VCC_CLK).
LVDS pairs and DDR interfaces require matched-length routing within 50 ps skew per byte group. Use 100-ohm differential impedance for LVDS with broadside-coupled stripline routing on inner layers; SSTL I/O for DDR requires 50-ohm single-ended impedance plus external VTT termination. Always reference the Stratix I device handbook Pin Connection Guidelines because some balls are reserved (no-connect) and others are power/ground depending on configuration scheme.
Do not confuse speed grade -5 with temperature grade I: I5 = industrial temperature, speed grade -5. The C7/C6 variants are commercial-temperature. Substituting I5N with C7N drops the operating temperature range from -40C/+100C to 0C/+85C, which may fail field deployments. Also confirm Quartus II version compatibility - versions older than 13.0 SP1 may not support the latest Stratix I errata fixes.
Compliance Information
RoHS compliant per FBGA lead-free termination; reach compliant per Intel product declarations; AEC-Q100 not applicable for industrial-grade FPGAs (this part is industrial, not automotive qualified).
