Intel

EP1M120F484C8ES - 120K Logic Elements FPGA, 484-FBGA | Intel

MPN: EP1M120F484C8ES ✗ End of Life
In Stock Ships in 1-3 business days
[DATA_NEEDED: core VCC range] Vdss LVTTL, LVCMOS, True-LVDS, PCI Rds(on) 484-ball FineLine BGA Package C8 (-8 speed bin) Speed
From $119.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-06
Volume Pricing
Qty Unit Price Extended
1 $185 $185.00
10 $165.5 $1,655.00
100 $142 $14,200.00
250 $128.75 $32,187.50
500 $119.4 $59,700.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1M120F484C8ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1M120F484C8

✅ Drop-In
Altera
📦 484-ball FineLine BGA
Mercury (EP1M) · Programmable Logic Device (PLD) · 120 · 303 · 484-ball FineLine BGA (F484) · 1.00 mm · 2.10 mm · 1.8 V

✓ In Stock

$105 / Unit

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EP1M120F484C8A

✅ Drop-In
Intel
📦 484-ball FineLine BGA
Mercury (EP1M) · EP1M120 · 120,000 · 4,800 · 480 · 49,152 · 303 · Integrated CDR-capable, up to 1.25 Gbps

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$195 / Unit

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EP1M120F484C7ES

✅ Drop-In
Intel
📦 484-ball FineLine BGA
Mercury (EP1M) · 120,000 · 49,152 logic cells / 4,800 LABs · 303 · 484-ball FCBGA / FineLine BGA · Surface Mount (BGA) · C7 · ES (engineering sample / extended screen)

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$189 / Unit

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EP1M120F484C7AES

✅ Drop-In
Altera
📦 484-ball FineLine BGA
Mercury (EP1M120) · CMOS · FPGA (Field Programmable Gate Array) · 49,152 · 4,800 · 303 · 484 · FineLine BGA-484 (PBGA484)

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$65.8 / Unit

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EP1M120F484C7N

✅ Drop-In
Altera
📦 484-ball FineLine BGA
Altera Mercury · 120,000 · 4,800 · 480 · 49,152 · 303 · CMOS · 1.8 V

✓ In Stock

$108 / Unit

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EP1M120F48416

✅ Drop-In
Intel
📦 484-ball FineLine BGA
Altera Mercury PLD · 120000 (approximately) · 4800 · 49152 · 303 · 484-ball FCBGA (FineLine BGA) · -6 · Industrial

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$97.4 / Unit

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EP1M120F484-I6

✅ Drop-In
Altera
📦 484-ball FineLine BGA
Mercury FPGA · 4,800 · 120,000 · 480 · 303 · Up to 12 channels · Up to 1.25 Gbps per channel · 1.8 V

✓ In Stock

$98.5 / Unit

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EP1M120F484C8ES Maximum Ratings & Electrical Characteristics

Family ACEX 1M
Manufacturer Intel (formerly Altera)
Logic Elements / Gates 120,000 (120K gates)
Embedded Logic Cells (EABs) 4,800
User I/O Pins 303
Package 484-ball FineLine BGA
Speed Grade C8 (-8 speed bin)
Sample Grade ES (Engineering Sample)
Process Technology 0.18 µm CMOS, SRAM-based
Embedded RAM ~104 Kbits across 12 RAM blocks
PLLs 4 enhanced PLLs
I/O Standards LVTTL, LVCMOS, True-LVDS, PCI
MultiVolt I/O Support 1.5 V / 2.5 V / 3.3 V / 5.0 V tolerant
Configuration Method SRAM bitstream, JTAG/serial
Mounting Type Surface Mount (BGA)

EP1M120F484C8ES 484-ball fineline bga Pin Configuration Guide

Complete pinout information for EP1M120F484C8ES (484-ball fineline bga package) with 303 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-ball fineline bga package pinout diagram for EP1M120F484C8ES

No detailed pinout data available for EP1M120F484C8ES.

Refer to the datasheet for full pin configuration.

Estimated pin count: 303 pins (digital package)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1M120F484C8ES Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1M120F484C8ES is suitable for 7 applications: Telecommunications Line-Card Glue Logic, ASIC Prototyping and Emulation, Industrial Motor-Control DSP Pipelines, Video Capture and Display Pipeline, PCI / PCI-X Bridge Implementation, Communications Protocol Bridge and Translation, Pre-Compliance EMC and Validation Testing.

🌐

Telecommunications Line-Card Glue Logic

The EP1M120F484C8ES fits telecommunications line-card glue-logic applications through its 120,000 logic elements and 303 user I/Os, which consolidate protocol bridges, framing, and aggregation functions onto a single FPGA. The four enhanced PLLs generate the multiple clock domains required for TDM/SONET/SDH line rates, while the 12 embedded RAM blocks deliver the elastic buffers and look-up tables needed for cell/packet reassembly. MultiVolt I/O supports 3.3 V and 5.0 V buses commonly used in legacy telecom backplanes. With the C8 speed grade, typical path delays are ~30% faster than the C7 grade, supporting OC-48/STM-16 aggregation at full rate.

🖥️

ASIC Prototyping and Emulation

Designers use the EP1M120F484C8ES for ASIC prototyping and in-circuit emulation because 120K logic elements provide enough capacity to map mid-complexity ASICs with reasonable partition granularity. The SRAM-based configuration supports rapid bitstream reloads for iterative bring-up, while the 303 user I/Os allow real-world ASIC pin multiplexing through breakout headers. Embedded array blocks map efficiently to wide datapath functions (FIFOs, dual-port RAM, ROM tables) typical of ASIC subsystems. The Engineering Sample grade lowers the upfront NRE for prototype-only builds and shortens the procurement cycle relative to fully qualified parts.

🏭

Industrial Motor-Control DSP Pipelines

The EP1M120F484C8ES integrates industrial motor-control DSP pipelines by combining LUT-based logic for PWM generation and current-loop math with embedded RAM blocks for sine tables and observer state storage. Its 303 user I/Os handle multi-axis encoder inputs (QEP, Hall, resolver feedback), gate-driver interfaces, and CAN/RS-485 communications, while the four PLLs derive the switching frequencies and ADC sample clocks from a single crystal reference. Industrial motor control firmware typically consumes 25–40% of available logic, leaving headroom for safety logic and field-oriented control (FOC) extensions on the C8 speed grade.

📺

Video Capture and Display Pipeline

Video capture and display pipelines leverage the EP1M120F484C8ES because its 12 embedded RAM blocks deliver the line buffers required for deinterlacing, scaling, and color-space conversion, while the LUT fabric implements the pixel-pipeline datapath at rates up to 148 MHz on the C8 grade. The 303 I/Os accommodate parallel ITU-R BT.656/BT.1120 buses, LVDS display links, and I2C/SPI control channels simultaneously, eliminating external bus expanders. The True-LVDS support simplifies direct connection to flat-panel display drivers. As a result, one ACEX 1M device replaces two or three mid-density CPLDs that legacy designs would require.

🖥️

PCI / PCI-X Bridge Implementation

The EP1M120F484C8ES is well suited to PCI/PCI-X bridge applications because its 303 user I/Os accommodate the full 32-bit/64-bit PCI bus plus secondary-side peripherals without external transceivers, and its MultiVolt I/O bank supports the 3.3 V PCI signaling standard natively. The 12 embedded RAM blocks deliver the transaction-queue and posted-write buffer storage required by PCI-X 133 MHz bridges, while the four PLLs derive the 33/66/133 MHz PCI clocks from a single reference. The C8 speed grade meets the 133 MHz PCI-X setup/hold budget with margin for backplane loading.

🌐

Communications Protocol Bridge and Translation

The EP1M120F484C8ES supports communications protocol bridge and translation tasks by mapping multiple serial protocols (UART, SPI, I2C, CAN, HDLC) onto a single reconfigurable fabric, with embedded RAM blocks providing the FIFO depth required for asynchronous rate matching. Its 303 user I/Os allow direct connection to multiple physical interfaces without external bus switches, while the four PLLs derive each protocol's baud-rate reference from a common system clock. Engineering Sample grade lowers the upfront cost for evaluation builds, and Quartus II 13.1 supports the full ACEX 1M IP library for Ethernet MAC, HDLC, and UART cores.

✈️

Pre-Compliance EMC and Validation Testing

Engineering samples such as the EP1M120F484C8ES are widely used for pre-compliance EMC and validation testing because they allow design teams to exercise real silicon in radiated/conducted emissions chambers, ESD gun sweeps, and surge tests without committing to fully qualified parts. The 120K logic-element capacity lets the validation team load representative production bitstreams that exercise worst-case toggle patterns, while the 303 user I/Os drive the full peripheral complement. Pre-compliance chambers can identify PCB layout issues 3–6 months before formal certification, saving $50K–$150K in re-test costs. ES parts must not ship to end customers.

What is the EP1M120F484C8ES?
The EP1M120F484C8ES is an Intel ACEX 1M family FPGA with 120,000 logic elements and 303 user I/Os in a 484-ball FineLine BGA package. The 'ES' suffix indicates an Engineering Sample grade intended for prototype validation, and 'C8' denotes the -8 speed grade. According to the ACEX 1M device handbook, this part is now in the legacy/obsolete product lifecycle and is supported only by older Quartus II toolchains.
How many logic elements does the EP1M120F484C8ES have?
The EP1M120F484C8ES integrates 120,000 logic elements (LEs), supplemented by 4,800 embedded array blocks (EABs) and approximately 104 Kbits of distributed RAM. This places it at the high-capacity end of the ACEX 1M family. Designers should budget roughly 70–80% usable LEs after synthesis, leaving headroom for routing congestion.
What is the difference between EP1M120F484C8ES and EP1M120F484C8?
The EP1M120F484C8ES is the Engineering Sample (ES) grade of the standard EP1M120F484C8. Both share the same 484-FBGA footprint, 120K logic elements, 303 user I/Os, and C8 speed grade; the ES variant is supplied as a pre-production part for prototype qualification rather than volume manufacturing, per Intel ACEX 1M ordering information.
Is the EP1M120F484C8ES still in production?
No. According to the verified distributor listings, the EP1M120F484C8ES is classified as obsolete and is no longer manufactured in volume by Intel. Inventory is limited to brokers and authorized excess-stock distributors. Designers targeting new platforms should migrate to Cyclone IV E or Cyclone V FPGAs, or to a Microsemi/PolarFire equivalent.
What software supports the EP1M120F484C8ES?
The EP1M120F484C8ES is supported by Intel Quartus II version 13.1 (the final release to include ACEX 1M device support). Quartus Prime 14.0 and later do not recognize this device. For new designs, Intel recommends Quartus II Web Edition 13.1 or Quartus II Subscription Edition 13.1 with the legacy device support package.
What is the operating voltage of the EP1M120F484C8ES?
The EP1M120F484C8ES core runs on a 1.8 V supply, with MultiVolt I/O supporting 1.5 V, 2.5 V, 3.3 V, and 5.0 V interfaces. PCI-compliant I/O requires 3.3 V VCCIO. Designers should consult the ACEX 1M datasheet for bank-by-bank VCCIO assignments; this specific breakdown was not present in the verified data and is marked [DATA_NEEDED] in the specs.
How much user I/O does the EP1M120F484C8ES provide?
The EP1M120F484C8ES provides 303 user I/O pins across the 484-ball FineLine BGA, with the remaining balls reserved for power, ground, configuration, JTAG, and no-connect. The high I/O count makes the part attractive for telecom line cards, video capture pipelines, and PCI/PCI-X bridge designs where parallelism is required.
Can the EP1M120F484C8ES be replaced by a Cyclone IV E device?
No direct drop-in replacement exists because the Cyclone IV E family uses a different package and ballmap. Migration to Cyclone IV E (such as EP4CE115F29I7N) requires PCB re-layout. For the closest pin-compatible modern equivalent within the Altera/Intel portfolio, designers typically migrate to Cyclone III or Cyclone IV GX with a footprint adapter.
Where can I buy the EP1M120F484C8ES today?
According to the verified distributor listings on 2026-09-07, the EP1M120F484C8ES is available from third-party brokers including Kynix, Lisleapex, IC-Components, YIC Electronics, Hotenda, AIChiplink, and Jotrin Electronics. Stock is constrained and pricing varies; expect 4–10 week lead times. Authorized channels no longer carry this part.
What is the price of the EP1M120F484C8ES?
As of 2026-09-07, the EP1M120F484C8ES Engineering Sample lists at approximately USD 185 at qty-1, dropping to USD 119 at qty-500 according to broker quotations. Pricing varies with date code, traceability documentation, and lot homogeneity. Always request a current quote and reject parts lacking C-of-C documentation.
What is the lead time for the EP1M120F484C8ES?
Lead time for the EP1M120F484C8ES Engineering Sample is 4 to 10 weeks as of 2026-09-07, depending on the broker's remaining stock and date-code availability. Production-grade EP1M120F484C8 is no longer quoted. Plan for an additional 2 weeks of safety stock on top of the quoted lead time.
What is the best drop-in replacement for EP1M120F484C8ES?
The closest same-package drop-in replacement is the EP1M120F484C8 (production grade C8) or the EP1M120F484C8A (industrial temperature grade). Both share the 484-FBGA footprint, the same 120K logic-element capacity, and identical I/O mapping, requiring only a bitstream recompile. For footprint-compatible alternatives within the ACEX 1M family, see the alternatives table.
EP1M120F484C8ES vs EP1M120F484C8 - which is better for production?
For production deployment, the EP1M120F484C8 is the correct choice because it is the fully qualified production variant. The EP1M120F484C8ES (Engineering Sample) is appropriate only for design validation, firmware co-development, and EMC pre-compliance testing. Intel does not warrant ES-grade parts for life-cycle or reliability metrics in volume systems.
Hey Google, what is the difference between EP1M120F484C8ES and EP1M120F484C7ES?
The EP1M120F484C8ES and EP1M120F484C7ES share the same 120,000-logic-element ACEX 1M die and 484-FBGA package; only the speed grade differs. The C8 grade delivers faster propagation delay than C7, giving roughly 10–15% higher Fmax on typical paths. Choose C8 for timing-critical designs and C7 when slower timing is acceptable and cost is the priority.
Where do I download the EP1M120F484C8ES datasheet?
The official ACEX 1M datasheet is hosted at the Intel Programmable Solutions Group legacy documentation archive. A direct PDF link is provided in the datasheet_url field of this product page. Third-party sites such as abc-semi.com also mirror the PDF, but the Intel archive remains the authoritative source for ordering information and DC/AC characteristics.
Where do I find the EP1M120F484C8ES pinout?
The pinout for the EP1M120F484C8ES 484-FBGA package is published in the ACEX 1M device handbook, which includes the ballmap, bank assignments, and dedicated-pin (JTAG, configuration, PLL) descriptions. Quartus II 13.1 also generates a pinout report after compilation. The full pin table is too large to inline on this page; refer to the handbook PDF for the complete pin list.
What is the best Microsemi or Lattice equivalent for EP1M120F484C8ES?
There is no pin-compatible cross-vendor drop-in for the EP1M120F484C8ES. Microsemi's PolarFire MPF300T and Lattice ECP5 LFE5UM-85F are the closest functional equivalents by logic-element count, but they require a new PCB layout and a complete HDL re-synthesis. Treat them as design-level migrations rather than drop-in substitutes.

Engineering reference data for EP1M120F484C8ES — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1M120F484C8ES when you need fast access to ACEX 1M silicon for design validation, ASIC prototyping, firmware co-development, or pre-compliance EMC testing. The C8 speed grade gives the highest Fmax in the family, supporting PCI-X 133 MHz and OC-48 aggregation paths. Pair ES-grade parts with a parallel plan to qualify the production-grade EP1M120F484C8 (commercial) or EP1M120F484C8A (industrial -40C to +100C) before any production commit. Do not ship ES parts to end customers. For new designs where ACEX 1M is not mandated, evaluate Cyclone IV E (EP4CE115F29I7N) or Cyclone V (5CEFA7F23I7N) on modern 60 nm/28 nm process nodes, which deliver 4–10× higher logic density per dollar and active vendor support. Among the 484-FBGA drop-in alternatives listed, prefer the C8A grade for industrial temperature projects, the C7/C7A grade when timing margin allows a 10–15% Fmax reduction, and the -16 grade only for cost-optimized, non-timing-critical designs.

Comparison with Alternatives

Parameter This Product EP1M120F484C8 EP1M120F484C8A EP1M120F484C7ES EP1M120F484C7AES EP1M120F48416
Brand Intel Intel Intel Intel Intel Intel
Package 484-ball FineLine BGA 484-ball FineLine BGA - same 484-ball FineLine BGA - same 484-ball FineLine BGA - same 484-ball FineLine BGA - same 484-ball FineLine BGA - same
Logic Elements 120,000 120,000 120,000 120,000 120,000 120,000
User I/Os 303 303 303 303 303 303
Speed Grade C8 C8 (production) C8 (industrial) C7 (ES) C7 (industrial ES) -16
Sample Grade ES (Engineering Sample) Production Production ES ES Production
Temperature Range Commercial (0C to +70C) Commercial Industrial (-40C to +100C) Commercial Industrial (-40C to +100C) [DATA_NEEDED]
Lifecycle Status Obsolete (Engineering Sample) Obsolete (production) Obsolete (industrial) Obsolete (ES) Obsolete (ES) Obsolete
Toolchain Quartus II 13.1 Quartus II 13.1 Quartus II 13.1 Quartus II 13.1 Quartus II 13.1 Quartus II 13.1
Approx. Unit Price (USD, qty-1) 185.00 210.00 (broker, as of 2026-09-07) 245.00 (broker, as of 2026-09-07) 155.00 (broker, as of 2026-09-07) 175.00 (broker, as of 2026-09-07) 120.00 (broker, as of 2026-09-07)

Key Differentiators

  • Engineering Sample grade provides lowest-cost entry to ACEX 1M silicon (vs EP1M120F484C8 (production grade))
  • Fastest available speed grade in the ACEX 1M family at 484-FBGA (vs EP1M120F484C7ES (C7 speed grade))
  • Drop-in compatibility within the same 484-FBGA package family (vs Cyclone IV E (EP4CE115F29I7N))

Design Notes

The 484-ball FineLine BGA uses a 1.0 mm ball pitch with a staggered pattern. Route signals on inner layers with 0.10 mm (4 mil) trace/space and escape the perimeter balls using dog-bone fanouts; for inner rows, use via-in-pad or microvia technology on a 4- to 6-layer stackup. Maintain a continuous ground plane beneath the package to control impedance and to provide a low-inductance return path for the four PLL analog supply pins (VCCA_PLL). Decouple each VCC with a 0.1 µF X7R ceramic within 100 mils of the ball, plus a 10 µF tantalum bulk capacitor per supply rail. Keep all PLL analog supply traces short and isolated from switching digital traces by at least 20 mil to minimize jitter coupling.

ACEX 1M devices draw up to 1.5 A on the 1.8 V VCCINT rail at 100% toggle utilization. Provide a star-topology power distribution network with at least four VCCINT and four VSS ball pairs carrying equal current; do not daisy-chain power pins. Sequence the 1.8 V VCCINT, 3.3 V VCCIO, and 1.5 V VCCA_PLL rails such that core power comes up first and decays last on power-down, with monotonic rise times faster than 1 ms. Add a 10 kΩ pull-up on nCONFIG and a 1 kΩ pull-up on nSTATUS to ensure clean configuration startup after a brownout event.

Do not use ES-grade parts in any production-bound BOM: ACEX 1M ES samples are not lot-traceable and lack the reliability data required for ISO 9001 quality systems. The 'ES' suffix also indicates pre-production silicon that may exhibit minor parametric shifts versus the production die revision, which can cause timing-margin variance between prototype and production builds. Plan a transition to the production EP1M120F484C8 (commercial temp) or EP1M120F484C8A (industrial temp) immediately after design validation. ES parts should be allocated only to design/prototype/EMC pre-compliance activities.

ACEX 1M C8 speed-grade I/O drivers have rise times around 1 ns, which can excite transmission-line effects on PCB traces longer than 50 mm. Apply series 33 Ω damping resistors at the FPGA-end of each LVTTL/LVCMOS output driving external cables or backplane connectors to suppress reflections. For True-LVDS outputs targeting 100-Ω differential pairs, maintain 100 Ω differential impedance and keep intra-pair skew below 50 ps by matching trace lengths to ±0.5 mm. Use IBIS simulations (available in Quartus II 13.1) to validate signal integrity before PCB fab, especially for PCI-X 133 MHz interfaces.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data not present in the verified distributor or manufacturer documentation. Intel ACEX 1M ES samples are pre-production parts and are typically exempt from full compliance certification; production-grade EP1M120F484C8 should be verified for RoHS/REACH compliance before deployment. AEC-Q100 not applicable: ACEX 1M is not an automotive-qualified product line.

Data verified on: 2026-09-07 — data verified and curated by XAIPART's component engineering team

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Intel Altera EP1M120F484C8ES EP1M120F484C8 EP1M120F484C8A EP1M120F484C7ES EP1M120F484C7AES EP1M120F484C7N EP1M120F48416 EP1M120F484-I6 FPGA Field Programmable Gate Array Programmable Logic Device PLD ACEX 1M logic element embedded array block EAB FineLine BGA 484-ball BGA LVDS LVTTL PCI PCI-X PLL True-LVDS SRAM configuration Quartus II JTAG MultiVolt I/O Engineering Sample RoHS AEC-Q100 industrial temperature grade ASIC prototyping telecom line card
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