EP1K50VFC484-1 - ACEX 1K FPGA, 50K Gates, 484-BGA | Altera
MPN: EP1K50VFC484-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $41.5 | $415.00 |
| 100 | $37.8 | $3,780.00 |
| 500 | $33.2 | $16,600.00 |
| 1,000 | $29.5 | $29,500.00 |
Drop-in alternatives for EP1K50VFC484-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50FC484-1
✅ Drop-In✓ In Stock
$26.4 / Unit
View Datasheet →EP1K50FC484-1N
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View Datasheet →EP1K50FI484-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1K50FC484-2N
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View Datasheet →EP1K50FC484-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1K50FC484-3N
✅ Drop-In✓ In Stock
$19.5 / Unit
View Datasheet →EP1K100FC484-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$52.1 / Unit
View Datasheet →EP1K50VFC484-1 Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Logic Elements | 2,880 |
| Typical Gates | 50,000 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Array Blocks (EABs) | 10 |
| Total EAB Memory | 40,960 bits |
| Maximum User I/O Pins | 249 |
| Core Voltage | 2.5 V |
| I/O Standards Supported | 2.5 V / 3.3 V / 5.0 V (multi-voltage I/O) |
| Package | 484-ball FineLine BGA |
| Speed Grade | -1 |
| Configuration Method | SRAM-based, passive serial/parallel or JTAG |
| Operating Temperature | -40C to +85C (extended commercial) |
| Mounting Type | Surface Mount (BGA) |
EP1K50VFC484-1 484-ball fineline bga Pin Configuration Guide
Complete pinout information for EP1K50VFC484-1 (484-ball fineline bga package) with 249 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K50VFC484-1.
Refer to the datasheet for full pin configuration.
Estimated pin count: 249 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50VFC484-1 is suitable for 7 applications: Telecommunications Line Card Glue Logic, Industrial Control Board Custom Interface, Military / Aerospace Embedded Subsystem, Networking Router/Switch Parallel Backplane Bridging, Test and Measurement Custom Stimulus Generator, Legacy Industrial Printer Image Pipeline, Avionics Data Concentrator (Legacy Sustainment).
Telecommunications Line Card Glue Logic
The EP1K50VFC484-1's 2,880 logic elements and 249 user I/O pins make it well-suited for telecommunications line-card glue logic where parallel bus interfacing, custom framing/deframing state machines, and protocol conversion are required. Placed on the line card between the framer IC and the network processor, it absorbs asynchronous FIFOs, glue-level bus translation (3.3V to 5.0V through its multi-voltage I/O), and custom HDLC/PPP encoders. The 360 LABs and 10 EABs supply ample dual-port RAM for jitter buffers; 484-ball BGA keeps board density manageable in compact line-card formats.
Recommended
Industrial Control Board Custom Interface
Industrial controllers require custom parallel interfaces, encoder counters, and PWM generators that map naturally onto the EP1K50VFC484-1's 360 LAB fabric. Used between motor drivers and the host MCU, the FPGA absorbs quadrature decoder logic, multi-channel PWM generation, and fault-monitoring state machines. The device's industrial temperature option (-40C to +100C) supports factory-floor deployment; the multi-voltage I/O banks let the same part interface 3.3V MCUs with 5.0V legacy drivers without external level shifters.
Recommended
Military / Aerospace Embedded Subsystem
Legacy military and aerospace programs continue to use the ACEX 1K family for flight-control ancillary systems, instrumentation dataloggers, and sensor pre-processing units where long qualification cycles and configuration-file stability outweigh modern-device density. The EP1K50VFC484-1's extended commercial temperature grade, high I/O count (249 pins), and robust BGA package support vibration-tolerant assembly on rigid-flex or ceramic substrates. Existing verified firmware IP can be re-used without resimulation when porting from the -1 speed grade to other ACEX 1K speed bins.
Recommended
Networking Router/Switch Parallel Backplane Bridging
Routers and switches use the EP1K50VFC484-1 as a backplane-bridging device where multiple lower-speed ports converge onto a high-speed uplink bus. The dual-port EABs (10 EABs, 40,960 bits total) provide internal FIFOs that absorb packet bursts, while the 249 user I/Os fan out to multiple PHY interfaces. The -1 speed grade meets typical 100-MHz internal clocking requirements for bus-bridge pipelines, and the BGA package supports the multi-layer PCB stack-ups used in rack-mounted networking equipment.
Recommended
Test and Measurement Custom Stimulus Generator
ATE (Automatic Test Equipment) platforms require precise custom stimulus patterns, parallel data formatting, and timing-critical handshake generation that map onto the EP1K50VFC484-1's rich logic-element fabric. Used in conjunction with a host CPU, the FPGA delivers deterministic multi-channel stimulus waveforms and capture buffers using EAB-based memory. The 484-ball BGA offers the signal integrity required at 100 MHz edge rates, while the SRAM-based configuration supports in-system test-vector swaps via JTAG, accelerating calibration cycles.
Recommended
Legacy Industrial Printer Image Pipeline
Industrial printing controllers use the EP1K50VFC484-1 as the print-engine datapath: the FPGA accepts compressed raster data from the host, expands it through EAB-based line buffers, and drives the print-head driver bus at deterministic timing. With 2,880 LEs and 10 EABs (40,960 bits), the device fits line-buffer sizes for typical 32-bit-wide print heads while exposing 249 user I/Os for driver control. Existing field-deployed printers rely on the ACEX 1K family's long-term configuration-file stability to minimize firmware churn across printer generations.
Recommended
Avionics Data Concentrator (Legacy Sustainment)
Long-life avionics platforms sustain the EP1K50VFC484-1 as a data-concentrator for ARINC-429 buses, MIL-STD-1553 terminals, and discrete I/O aggregation where the device's multi-voltage I/O and high pin count (249) consolidate multiple slower buses onto a single host interface. The 2,880 LEs handle protocol encoding, while the 10 dual-port EABs implement efficient command/response buffers. The extended commercial temperature grade and BGA ruggedization satisfy cockpit-equipment environment requirements during sustainment phases.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50VFC484-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50FC484-1 | EP1K50FC484-1N | EP1K50FI484-2N | EP1K100FC484-1 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-ball FineLine BGA | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 4,992 |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 100,000 |
| LABs | 360 | 360 | 360 | 360 | 624 |
| EABs / EAB Memory | 10 EABs / 40,960 bits | 10 EABs / 40,960 bits | 10 EABs / 40,960 bits | 10 EABs / 40,960 bits | 12 EABs / 49,152 bits |
| Maximum User I/O | 249 | 249 | 249 | 249 | 333 |
| Speed Grade | -1 | -1 | -1 | -2 | -1 |
| Temperature Grade | Extended Commercial | Commercial | Commercial | Industrial | Commercial |
Key Differentiators
- Largest ACEX 1K family density available in 484-BGA with speed-grade -1 (vs EP1K50FC484-1)
- Higher density upgrade path on same 484-BGA footprint (vs EP1K100FC484-1)
- Compatible with standard ACEX 1K configuration memory family (vs EP1K50FI484-2N)
Design Notes
Decouple every VCCINT (2.5V core) and VCCIO (per-bank I/O) pin with a 0.1uF ceramic capacitor placed within 3mm of the BGA ball. Bulk-decoupling (10uF to 47uF tantalum or polymer) must be added per power plane. ACEX 1K VCCINT current is highly frequency-dependent - estimated ~1 mA per MHz of internal toggle activity at room temperature. For multi-bank designs, isolate each VCCIO bank with its own bulk capacitor to prevent switching noise injection into adjacent banks.
The 484-ball FineLine BGA requires a controlled-impedance, multi-layer PCB with microvia or stacked-via fanout to the inner escape layers. Use a 0.5mm or 0.8mm pitch BGA fanout (verify exact pitch from the package mechanical drawing). All signal layers under the BGA should reference a continuous ground plane to control impedance and reduce SSN. Manufacturing: ENIG or immersion-silver surface finish preferred; HASL may yield poor coplanarity on BGA pads.
ACEX 1K uses SRAM-based configuration that is volatile - the device loses its bitstream on power-down and requires a configuration device (EPC2, EPC4, EPC8, or EPC16) or external controller at every boot. Common pitfall: omitting the nCONFIG pull-up resistor causes the device to remain in reset after power-up. For JTAG programming, leave TCK, TMS, TDI, TDO routed to a header and include a 1kohm pull-up on TCK. Use Quartus II software (legacy version) or the Altera ByteBlaster / USB-Blaster programmer for in-system configuration.
The 249 user I/Os on the EP1K50VFC484-1 are organized into multiple voltage banks; each bank must be powered to a single VCCIO level - mixing 3.3V and 5.0V signals on the same bank is not allowed. Source-synchronous interfaces above 100 MHz require matched trace lengths within the bank. For LVDS or SSTL I/O standards, use differential pair routing with 100 ohm controlled impedance. Unused I/O pins should be configured as outputs driving ground, not left floating, to minimize quiescent current.
Estimated: power dissipation at maximum toggle rate with all I/Os switching is approximately 1.5W to 2W for the EP1K50VFC484-1; without thermal vias under the BGA thermal pad, junction temperature may exceed the extended commercial limit. Always verify the JTAG chain integrity before configuration: a mis-wired TCK / TMS pair prevents the device from configuring. Finally, when migrating ACEX 1K bitstreams between speed grades, regenerate place-and-route - timing closure does not transfer cleanly across speed bins.
Compliance Information
Compliance status not explicitly stated in verified web data for the legacy EP1K50VFC484-1. RoHS and lead-free finish depend on the specific date code / factory finish - the EP1K50FC484-1N variant carries the lead-free N finish. AEC-Q100 is not applicable (FPGAs typically do not carry automotive qualification unless explicitly noted).
