EPM3512AFI256-7N - MAX 3000A CPLD, 512 Macrocells | Intel / Altera
MPN: EPM3512AFI256-7N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $34.1 | $3,410.00 |
| 500 | $30.85 | $15,425.00 |
| 1,000 | $27.95 | $27,950.00 |
Drop-in alternatives for EPM3512AFI256-7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPM3512AFI256-7N Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Device Logic Elements / Macrocells | 512 macrocells |
| Typical Usable Gates | 10,000 gates |
| Logic Array Blocks (LABs) | 16 |
| Maximum Operating Frequency (fMAX) | 116.3 MHz |
| Pin-to-Pin Delay (tPD, speed grade -7) | approximately 7.5 ns |
| Supply Voltage (VCCINT) | 3.3 V |
| MultiVolt I/O Levels | 2.5 V / 3.3 V / 5 V mixed |
| Configuration Memory | Non-volatile EEPROM |
| Programming Interface | IEEE 1149.1 JTAG (in-system programmable) |
| Package | 256-ball FBGA |
| Operating Temperature Range | -40C to +85C (industrial) |
| Lead-Free / RoHS | Yes ('N' suffix, lead-free) |
| Design Software | Quartus II (legacy MAX 3000A support) |
| Speed Grade | -7 |
| Mounting Type | Surface Mount (BGA) |
EPM3512AFI256-7N 256-ball fbga Pin Configuration Guide
Complete pinout information for EPM3512AFI256-7N (256-ball fbga package) with [DATA_NEEDED: user I/O count] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3512AFI256-7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: user I/O count] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3512AFI256-7N is suitable for 7 applications: Industrial PLC and Factory Automation, Legacy PCI / ISA Bus Glue Logic, Aerospace and Military Avionics, Medical Diagnostic Equipment, Communications and Networking Equipment, Test and Measurement Instrumentation, Automotive Infotainment and Body Electronics.
Industrial PLC and Factory Automation
The EPM3512AFI256-7N's 512 macrocells, 16 LABs, and 3.3 V core with MultiVolt I/O make it ideal for industrial PLC and factory-automation designs that need to bridge 5 V sensors and 3.3 V microcontrollers on a single board. Its instant-on EEPROM configuration avoids the boot delay of SRAM-based FPGAs, ensuring deterministic start-up in conveyor, motor-control, and SCADA systems. The 256-ball FBGA package supports the wide address/data buses used by 16-bit and 32-bit microcontrollers. Combined with the -40C to +85C industrial temperature range, it withstands factory-floor thermal stress without derating.
Recommended
Legacy PCI / ISA Bus Glue Logic
With 116.3 MHz fMAX and approximately 7.5 ns pin-to-pin delay at the -7 speed grade, the EPM3512AFI256-7N handles 33 MHz PCI glue logic and ISA bus address decoding without timing violations. Its 512 macrocells comfortably absorb address latches, bus arbiters, and interrupt controllers that previously occupied multiple PAL/GAL devices. The MultiVolt I/O directly interfaces legacy 5 V PCI/ISA slots while the 3.3 V core minimizes power. Non-volatile EEPROM configuration means a corrupted bitstream cannot halt boot, which is critical for industrial PCs and embedded controllers.
Recommended
Aerospace and Military Avionics
The EPM3512AFI256-7N's instant-on EEPROM configuration, industrial temperature range, and long-life-cycle Altera MAX 3000A silicon make it well-suited for aerospace and military avionics programs where component traceability and supply continuity exceed 10 years. The 256-ball FBGA provides high I/O density for ARINC 429, MIL-STD-1553, and discrete-signal interfaces in flight-control and navigation subsystems. Its deterministic pin-to-pin delay supports the synchronous timing budgets required by DO-254 design assurance levels.
Recommended
Medical Diagnostic Equipment
In medical diagnostic equipment such as patient monitors, ultrasound beamformers, and laboratory analyzers, the EPM3512AFI256-7N replaces dozens of 74-series logic ICs with a single programmable device, reducing PCB area and improving reliability. The 512 macrocells handle timing-critical functions like ADC/DAC control, display multiplexing, and serial-bus bridging. EEPROM configuration eliminates in-rush configuration glitches that could cause false readings, and the -40C to +85C range supports the wider thermal envelope of clinical environments.
Recommended
Communications and Networking Equipment
The EPM3512AFI256-7N serves communications and networking equipment as a glue-logic hub for routing switches, DSLAM line cards, and legacy T1/E1 framers. With 256 I/O balls and MultiVolt support, it bridges 5 V line transceivers and 3.3 V network processors without external level shifters. Its instant-on behavior keeps hot-standby routers responsive during reboot cycles, while the 116.3 MHz performance handles 10/100 Ethernet PHY interfaces and HDLC controllers at full line rate.
Recommended
Test and Measurement Instrumentation
Bench-top oscilloscopes, logic analyzers, and signal generators use the EPM3512AFI256-7N to consolidate trigger logic, channel multiplexing, and front-panel I/O decoding. Its 16 LABs and 512 macrocells easily implement state machines for sequencing ADC sampling, switching attenuators, and routing display data. The MultiVolt I/O interfaces both legacy 5 V front-panel drivers and modern 3.3 V DSP/FPGA back-ends. JTAG in-system programming simplifies firmware updates in the factory without removing the device from the instrument.
Recommended
Automotive Infotainment and Body Electronics
Although not AEC-Q100 qualified, the EPM3512AFI256-7N is widely deployed in non-safety automotive programs such as infotainment head units, instrument-cluster displays, and body controllers. Its 512 macrocells drive LCD panel timing, CAN/LIN transceivers, and audio bus multiplexers; the industrial temperature range tolerates cabin thermal swings. EEPROM configuration ensures immediate readiness after battery reconnect - a feature valued in body-control modules that must wake instantly to manage door locks and lighting.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512AFI256-7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFI256-10N | EPM3512AFI256-7 | EPM3512AFI256-10 | EPM3512AFC256-7N | EPM3512AFC256-7 | EPM3512AFC256-10N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-ball FBGA | 256-ball FBGA (same) | 256-ball FBGA (same) | 256-ball FBGA (same) | 256-ball FBGA (same) | 256-ball FBGA (same) | 256-ball FBGA (same) |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| Speed Grade | -7 (fMAX 116.3 MHz) | -10 (fMAX 90 MHz) | -7 (fMAX 116.3 MHz) | -10 (fMAX 90 MHz) | -7 (fMAX 116.3 MHz) | -7 (fMAX 116.3 MHz) | -10 (fMAX 90 MHz) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C (commercial) | 0C to +70C (commercial) | 0C to +70C (commercial) |
| Lead-Free (N suffix) | Yes | Yes | No | No | Yes | No | Yes |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy | last_time_buy |
Key Differentiators
- Industrial temperature grade -40C to +85C in lead-free N suffix (vs EPM3512AFC256-7N)
- -7 speed grade for 116.3 MHz operation (vs EPM3512AFI256-10N)
- Lead-free RoHS-compliant termination (N suffix) (vs EPM3512AFI256-7)
- Non-volatile EEPROM configuration - instant-on at power-up (vs Xilinx XC9500XL XC95288XL)
Design Notes
The 256-ball FBGA package has a 1.0 mm ball pitch. Use NSMD (Non-Solder Mask Defined) pads with a diameter of approximately 0.45 mm and via-in-pad with 0.3 mm drill / 0.6 mm capture to ensure reliable solder joints. Apply a four-zone reflow profile with a peak temperature of 245-250C for lead-free solder; pre-bake the BGA at 125C for 24 hours before assembly to remove moisture. Use the manufacturer's recommended land pattern verbatim - FBGA ball pitches are very sensitive to solder-mask registration and pad-size tolerance.
Route high-speed signals (PCI clock, SDRAM control) on inner layers with 50 ohm controlled impedance and matched length within +/- 100 mils for clocks. Place 33 ohm series damping resistors within 200 mils of the CPLD output pin to dampen reflections when driving long traces. Use the Quartus II timing analyzer with -7 speed-grade timing models to verify setup/hold margins; do not assume the -10 grade will close timing on a design that targets -7. Maintain at least a 25 mil keep-out around each BGA ball escape via to avoid signal-coupling to neighboring layers.
Do not exceed 3.6 V on VCCINT or 5.25 V on VCCIO, even transiently - the MAX 3000A family has no internal ESD clamps rated for sustained over-voltage. Decouple each VCCINT and VCCIO pin with a 0.1 uF X7R ceramic plus a 10 uF bulk per supply rail, placed within 100 mils of the BGA. Always tie JTAG TCK, TMS, TDI, TDO to valid logic levels - leaving TCK floating can cause spurious configuration events. When migrating from -7 to -10 speed grade, re-run the Quartus II fitter with the new timing model since fMAX drops from 116.3 MHz to 90 MHz.
Estimated: at 100% utilization with all 256 I/O toggling at 50 MHz, the EPM3512AFI256-7N dissipates approximately 0.5-0.8 W in the FBGA-256 package. With a typical theta_JA of 28 C/W on a 4-layer JEDEC test board, junction temperature rises 14-22 C above ambient. In a sealed enclosure without airflow, derate the toggle frequency or add 100 LFM of forced airflow to keep Tj below 125 C. The industrial temperature grade is rated to -40C / +85C ambient; the junction limit is 150 C.
Compliance Information
N suffix denotes lead-free / Pb-free termination per Altera/Intel legacy product data. RoHS compliance declared by manufacturer; REACH, halogen-free, and conflict-mineral declarations not published in the data provided.
