5CSEBA6U23I7N - Cyclone V SE SoC, 110K LE, Dual A9, 672-UBGA | Intel
MPN: 5CSEBA6U23I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $73.78 | $73.78 |
| 10 | $67.5 | $675.00 |
| 100 | $60.2 | $6,020.00 |
| 250 | $55.4 | $13,850.00 |
| 500 | $51.8 | $25,900.00 |
Drop-in alternatives for 5CSEBA6U23I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSEBA6U23I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 |
| Process Technology | 28 nm TSMC low-power |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| DSP Blocks | 224 (variable-precision) |
| Embedded Memory | 5,662 Kbits (M10K + MLAB) |
| Maximum User I/O | 364 |
| Package | 672-UBGA (UBG A-672) 23x23 mm |
| Core Voltage | 1.1 V |
| Operating Temperature | -40C to +100C (industrial, junction) |
| Speed Grade | 7 |
| Temperature Grade | Industrial (I) |
| Lead-Free / RoHS | Yes (Pb-free, N suffix) |
| DDR Controller | 32-bit DDR3/LPDDR2 with ECC |
| Configuration | FPGA + HPS integrated SoC |
5CSEBA6U23I7N 672-ubga (ubg a-672) 23x23 mm Pin Configuration Guide
Complete pinout information for 5CSEBA6U23I7N (672-ubga (ubg a-672) 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA6U23I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA6U23I7N is suitable for 6 applications: Industrial Machine Vision, Motor Control and Industrial Drives, Software-Defined Radio Baseband, Broadcast Video Processing, Embedded Linux Compute Platform, Automotive Driver Assistance Prototyping.
Industrial Machine Vision
The 5CSEBA6U23I7N is well suited to industrial machine vision systems where FPGA parallelism must preprocess image streams before passing metadata to a Linux-capable host. The 224 variable-precision DSP blocks handle Bayer demosaic, color correction, and convolution kernels at full GigE Vision frame rates, while the dual Cortex-A9 at 800 MHz runs the vision stack (OpenCV, ROS 2) on the same die. The 110K logic elements and 5,662 Kbits of embedded memory absorb line buffers and feature buffers without external SRAM, and the industrial -40C to +100C junction range supports factory floor enclosures. Compared with a discrete CPU + FPGA board, this SoC cuts PCB area and BOM by roughly 40 percent while reducing inter-chip latency to tens of nanoseconds across the FPGA-to-HPS bridge.
Recommended
Motor Control and Industrial Drives
The 5CSEBA6U23I7N fits multi-axis motor control and industrial drive designs where deterministic FPGA logic must execute field-oriented control (FOC), PWM generation, and encoder decoding with sub-microsecond latency, while the Cortex-A9 subsystem runs the supervisory loop and Modbus/Profibus stack. The 110K logic elements accommodate 3-4 axis current-loop control and sigma-delta modulation, while the HPS handles slow tasks like HMI, diagnostics, and fieldbus communication. Industrial temperature operation (-40C to +100C junction) and the UBG A-672 robust package are well matched to drive cabinets. The integrated 32-bit DDR3 controller with ECC supports deterministic code execution even in high-vibration environments.
Recommended
Software-Defined Radio Baseband
The 5CSEBA6U23I7N supports software-defined radio baseband processing for narrow-band communications where FPGA fabric runs DDC/DUC, channelization, and modulation/demodulation blocks, while the Cortex-A9 subsystem runs the protocol stack (LTE, TETRA, or proprietary waveforms). The 224 variable-precision DSP blocks deliver ~50 GMAC of multiply-accumulate throughput, adequate for 20 MHz LTE physical-layer processing in single-antenna configurations. The 5,662 Kbits of embedded memory holds FFT windows and channel state buffers without external SRAM, reducing BOM cost. Note that the SE variant lacks dedicated high-speed transceivers - for designs requiring CPRI or JESD204B SerDes, migrate to the Cyclone V SX SoC family (different package, PCB redesign required).
Recommended
Broadcast Video Processing
The 5CSEBA6U23I7N is appropriate for broadcast video processing applications including multi-format format conversion, color space conversion, scalers, and overlay composition. The 110K logic elements and 5,662 Kbits of embedded memory handle 3G-SDI line buffers and 4:2:2 / 4:4:4 conversion pipelines at 1080p60 without external memory bandwidth bottlenecks. The dual Cortex-A9 subsystem runs the configuration and supervisory layer (control plane, SNMP, REST API) and handles firmware updates. The UBG A-672 industrial-grade package suits 24/7 broadcast equipment chassis where ambient temperatures inside enclosures exceed consumer-grade limits. The package's 23x23 mm footprint leaves board space for multiple SDI coax connectors and HDMI output stages.
Recommended
Embedded Linux Compute Platform
For embedded Linux compute platforms with FPGA-accelerated peripherals, the 5CSEBA6U23I7N provides 800 MHz dual Cortex-A9 cores with NEON SIMD, MMU, and a 32-bit DDR3 controller with ECC, sufficient to run Yocto/OpenWrt Linux with full networking, USB, and graphics stacks. The FPGA fabric implements custom high-speed peripherals (parallel ADC interfaces, proprietary bus protocols, hardware crypto engines) that offload the CPU. The 5,662 Kbits of embedded memory serves as DMA target for zero-copy data movement between HPS and FPGA over the ARM CoreLink bridge. Industrial temperature grade and lead-free UBG A-672 assembly suit industrial gateways, edge appliances, and fanless embedded PCs deployed in factory cabinets.
Recommended
Automotive Driver Assistance Prototyping
For pre-production prototyping of ADAS subsystems (front camera processing, surround-view fusion, sensor preprocessing), the 5CSEBA6U23I7N's industrial temperature grade and dual Cortex-A9 with NEON SIMD deliver enough compute for sensor fusion algorithms in bench-test environments. The 224 DSP blocks accelerate fixed-point image processing kernels, and the FPGA fabric absorbs MIPI-CSI-2 deserialization and custom sensor interfaces. Note: this is an industrial-grade (-40C to +100C) part, not AEC-Q100 qualified - for production automotive designs, migrate to AEC-Q100-qualified Cyclone V SE variants such as 5CSEBA6U23I7SN or contact Intel for the AEC-Q100 OPN. The UBG A-672 package supports the multi-sensor wiring typical of pre-production ADAS test racks.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U23I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA6U23I7SN | 5CSEBA6U23I7LN | 5CSEBA6U23C8N | 5CSEBA6U23C7N | 5CSEBA5U23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-UBGA (U23) 23x23 mm | 672-UBGA (U23) 23x23 mm - same | 672-UBGA (U23) 23x23 mm - same | 672-UBGA (U23) 23x23 mm - same | 672-UBGA (U23) 23x23 mm - same | 672-UBGA (U23) 23x23 mm - same |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | 110,000 | 85,000 (-23%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | 7 | 7 | 7 | 8 (~+15% Fmax) | 7 | 7 |
| DSP Blocks | 224 | 224 | 224 | 224 | 224 | 174 (-22%) |
| Embedded Memory | 5,662 Kbits | 5,662 Kbits | 5,662 Kbits | 5,662 Kbits | 5,662 Kbits | 4,462 Kbits (-21%) |
| HPS Maximum Frequency | 800 MHz dual A9 | 800 MHz dual A9 | 800 MHz dual A9 | 800 MHz dual A9 | 800 MHz dual A9 | 800 MHz dual A9 |
| RoHS / Lead-Free | Yes (Pb-free) | Yes (Pb-free, reflow-solder optimized) | Yes (Pb-free, lead-free variant) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
Key Differentiators
- Highest logic density in Cyclone V SE SoC U23 footprint (vs 5CSEBA5U23I7N)
- Industrial temperature grade versus commercial-only same-package variants (vs 5CSEBA6U23C8N)
- Fastest speed grade 7 with industrial temp envelope (vs 5CSEBA6U23I7N vs 5CSEBA6U23A7N (automotive AEC-Q100))
Design Notes
Cyclone V SE SoC devices require multiple power rails (1.1 V core VCC, 2.5 V/3.3 V VCCAUX, 1.5 V/1.8 V DDR VCCIO) plus dedicated VCCP_HPS for the Cortex-A9 subsystem. Sequence the rails per Intel's Cyclone V Hardware Design Guide to avoid latch-up; 1.1 V core must ramp last. A 6-layer PCB with dedicated power planes is strongly recommended. Estimated: a fully-utilized 5CSEBA6U23I7N at 800 MHz HPS plus 70% FPGA utilization can consume 5-8 W, so plan thermal dissipation accordingly.
Estimated: at full industrial junction temperature (-40C to +100C), the UBG A-672 (23x23 mm) has theta_JA of roughly 12 C/W with a 4-layer PCB and adequate via stitching under the package thermal balls. With 6-8 W dissipation typical for this device, junction rise above ambient is ~70-95 C, leaving little thermal headroom at 70 C ambient. For fanless industrial enclosures, mount the device on the bottom of the PCB with thermal vias to a copper pour on the inner/outer layers. Do NOT use the HPS at 800 MHz continuously in sealed enclosures - throttle based on the on-chip temperature sensor.
Route the DDR3 interface to the HPS as a matched-length 32-bit bus with trace impedance of 50 ohms single-ended and 100 ohms differential for DQS pairs. Keep length matching within 25 mils for data group, 50 mils for byte lane. Place the DDR3 chips within 1 inch of the HPS balls. Use a 4-layer stack with continuous GND plane under the DDR3 bus and stitch vias every 200 mils along the edges. Decoupling: 0.1 uF + 10 uF per power pin pair, placed within 100 mils of the package ball. The FPGA configuration flash (EPCQ) should be placed adjacent to the MSEL/AS pins on dedicated traces.
Common pitfalls with 5CSEBA6U23I7N designs: (1) Leaving unused FPGA user I/O pins floating - configure them as input tri-stated with weak pull-up to avoid leakage. (2) Forgetting to assert the HPS cold/warm reset before JTAG configuration - the HPS may boot in undefined state. (3) Not connecting the MSEL[4:0] pins correctly for AS x4 configuration mode - this is the most common configuration failure root cause. (4) Powering VCC_HPS before VCC - violates Intel's sequencing requirement and may damage the device. (5) Not programming the security fuse settings before locking the design - blocks future updates.
The 672-UBGA (U23) has 1.0 mm ball pitch with 26x26 ball matrix minus 4 corner exclusions. Use a microvia PCB process (8-layer stack-up minimum) for reliable assembly; standard via-in-pad or stacked microvia is recommended. Place decoupling capacitors on the OPPOSITE side of the PCB directly under their respective power balls, with power/ground via pairs adjacent. Critical high-speed signals (DDR3, transceivers if present on SX variant, GXB clocks) should route on the top layer above continuous GND plane. Maintain 3W spacing between DDR3 traces and other signals to avoid crosstalk. PCIe (on SX/ST variants) requires AC-coupling caps within 250 mils of the transmit pair.
Compliance Information
Industrial temperature grade (-40C to +100C junction). Lead-free / RoHS compliant per 'N' suffix. Not AEC-Q100 qualified - choose 5CSEBA6U23I7SN or contact Intel for AEC-Q100 OPN for automotive designs. Halogen-free status not explicitly stated in verified data.
