A3PE3000L-PQ208 - 3M Gate Low-Power Flash FPGA | Microchip
MPN: A3PE3000L-PQ208 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $388.37 | $388.37 |
| 10 | $368.95 | $3,689.50 |
| 100 | $349.53 | $34,953.00 |
| 500 | $330.11 | $165,055.00 |
| 1,000 | $310.69 | $310,690.00 |
Drop-in alternatives for A3PE3000L-PQ208 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE3000L-PQG208I
✅ Drop-In✓ In Stock
$48.9 / Unit
View Datasheet →A3PE3000L-1PQG208I
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000-1PQG208I
✅ Drop-In✓ In Stock
$59.9 / Unit
View Datasheet →A3PE3000-PQ208
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000L-PQ208 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (ProASIC3EL) |
| System Gates | 3,000,000 |
| Embedded SRAM | 504 kbits true dual-port |
| User I/Os (PQ208) | 147 |
| Core Voltage | 1.2 V |
| Supply Voltage | 1.5 V |
| Maximum Frequency | 781.25 MHz |
| Process Technology | 130 nm, 7-layer metal (6 copper) CMOS |
| Logic Family | CMOS |
| Program Type | Flash-based, In-System Programmable |
| Power-Up Behavior | Live At Power-Up Level 0 |
| Configuration | Single-chip solution (no external boot device) |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| Package | 208-BFQFP (PQ208), 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +70C |
| RoHS Status | RoHS Non-Compliant (contains lead) |
| Packaging | Tray |
A3PE3000L-PQ208 208-bfqfp (pq208), 1.0 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000L-PQ208 (208-bfqfp (pq208), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-PQ208.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-PQ208 is suitable for 6 applications: Industrial Automation Control, Networking and Communications Equipment, Avionics and Defense Subsystems, ASIC Prototyping and Replacement, Consumer and Display Electronics, Test and Measurement Instrumentation.
Industrial Automation Control
The A3PE3000L-PQ208 fits industrial control backplanes where programmable logic must be active the instant power is applied. Its flash fabric provides Live-At-Power-Up Level 0 behavior, eliminating the boot latency of SRAM FPGAs in safety-interlocked machinery. The 3M-gate capacity and 504 kbits of true dual-port SRAM handle motor sequencing, fieldbus framing, and FIFO buffering, while Schmitt-trigger input options on single-ended I/O improve noise margin near drives and contactors. Designers typically clock the fabric well below the 781.25 MHz maximum, so timing closure is straightforward, and the 147 user I/Os in the 208-QFP support parallel sensor and actuator interfaces without external glue logic.
Recommended
Networking and Communications Equipment
In line cards and control-plane boards, the A3PE3000L-PQ208 implements glue logic, bus bridging, and framing functions with a single flash chip - no external configuration PROM to fail or refresh. The 130-nm fabric supports the timing of legacy backplane standards, and 504 kbits of dual-port SRAM implement packet FIFOs and status look-up tables. The 1.2 V core reduces static power compared with the 1.5 V ProASIC3E, helping meet slot power budgets in dense chassis. The IEEE 1149.1 JTAG boundary-scan chain integrates with production ICT, and the single-chip flash solution simplifies field firmware updates via the JTAG port in deployed networking hardware.
Recommended
Avionics and Defense Subsystems
Flash FPGAs are favored in avionics because configuration data is immune to SEU-induced configuration loss, unlike SRAM-based fabrics that require continuous configuration scrubbing. The A3PE3000L-PQ208 provides 3M gates of instant-on logic for sensor interface conditioning, ARINC-style bus bridging, and built-in-test controllers. The single-chip solution reduces component count in conformal-coated assemblies, and the wide 1.2 V to 1.5 V core tolerance eases integration with aircraft power rails after DC-DC conversion. For flight programs, select the industrial-temperature A3PE3000L-PQG208I variant and follow Microchip's ProASIC3L reliability documentation for total-ionizing-dose and lifecycle planning.
Recommended
ASIC Prototyping and Replacement
The ProASIC3L family is positioned by Microchip as a cost-effective ASIC replacement for consumer, networking, computing, and avionics markets. With 3M system gates, the A3PE3000L-PQ208 absorbs moderate ASIC-scale netlists during prototyping or end-of-life ASIC replacement, avoiding mask NRE entirely. The flash fabric reprograms in-system via JTAG, enabling multiple RTL iterations on one PCB. True dual-port SRAM (504 kbits) substitutes for ASIC embedded memories up to modest depths, and 147 user I/Os accommodate parallel bus interfaces common in ASIC drop-ins. For designs outgrowing the die, migrate to the FG484/FG896 packages of the same family with minimal RTL change.
Recommended
Consumer and Display Electronics
Consumer platforms use the A3PE3000L-PQ208 where a single programmable device must handle board-level housekeeping, panel timing bridges, and peripheral control without boot delay. Live-at-power-up flash operation means display and appliance logic is functional before an application processor finishes booting, enabling standby features and fast wake. The 208-QFP package has 1.0 mm lead pitch that is hand-inspectable and reworkable on standard SMT lines, which suits mid-volume consumer manufacturing better than fine-pitch BGA alternatives. Note this specific part is RoHS non-compliant (contains lead); consumer designs shipping into RoHS markets should use the PQG208 green-package variants instead.
Recommended
Test and Measurement Instrumentation
Bench instruments and automated test equipment rely on the A3PE3000L-PQ208 for trigger logic, counter/timer arrays, and bus interface glue that must be operational at power-on so the instrument firmware can self-test immediately. The 3M-gate fabric implements multiple independent state machines, while 504 kbits of dual-port SRAM capture high-speed event traces. JTAG boundary scan (IEEE 1149.1) supports in-fixture interconnect testing of the surrounding board. Because timing requirements in instrumentation rarely approach the 781.25 MHz fabric limit, the slower speed grades of the same die offer further cost savings without functional loss, and the 208-QFP simplifies socketed prototyping adapters.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-PQ208 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-PQG208I | A3PE3000L-1PQG208I | A3PE3000-1PQG208I | A3PE3000-PQ208 |
|---|---|---|---|---|---|
| Package | 208-BFQFP (PQ208) | 208-BFQFP (PQ208) - same footprint | 208-BFQFP (PQ208) - same footprint | 208-BFQFP (PQ208) - same footprint | 208-BFQFP (PQ208) - same footprint |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology (Actel) |
| Family | ProASIC3L (low power) | ProASIC3L | ProASIC3L | ProASIC3E | ProASIC3E |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.5 V | 1.5 V |
| User I/O (PQ208) | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | Standard | Standard | -1 (slower) | -1 (slower) | Standard |
| Temperature Range | 0C to +70C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | [DATA_NEEDED] |
| RoHS Status | Non-Compliant (contains lead) | Green package (RoHS-friendly) | Green package (RoHS-friendly) | Green package (RoHS-friendly) | [DATA_NEEDED] |
| Unit Price (qty 1) | $388.37 as of 2026-09-01 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Low-power 1.2 V core in flash fabric (vs A3PE3000-PQ208)
- Single-chip instant-on operation (vs SRAM FPGAs (cross-architecture))
- Industrial-temperature green upgrade available (vs A3PE3000L-1PQG208I)
- QFP reworkability vs BGA density (vs A3PE3000L-FGG484)
Design Notes
Estimated: with a 1.2 V core, static power of the 3M-gate ProASIC3L die is substantially lower than the 1.5 V ProASIC3E equivalent, but dynamic power scales with toggle rate - at high activity the 147 user I/Os often dominate. Run Microchip Libero SmartPower with your actual RTL activity factors before fixing the core regulator rating, and budget I/O current per bank limits in the ProASIC3L datasheet (DS50003268).
The 208-pin QFP has 1.0 mm lead pitch with leads on all four sides. Fan out with 0.25 mm trace/0.25 mm space under the body, and provide at least two ground and one core-voltage via per power island. Place 0.1 uF decoupling capacitors within 3 mm of corner power pins and one bulk 10 uF per rail. The PQFP gull-wing leads tolerate rework better than BGA, but verify solder-joint inspection with angled AOI due to lead shadowing.
Three pitfalls recur with this part. First, the standard PQ208 is RoHS non-compliant and 0-70C only - new designs should use A3PE3000L-PQG208I. Second, the 'L' (1.2 V core) and non-L (1.5 V core) parts share the footprint but not the power rail; never swap without checking the core regulator. Third, configuration is flash-based, so no bitstream reload is needed at power-up, but JTAG security lockout will permanently block reprogramming if enabled without a recovery plan.
Enable the Schmitt-trigger option on single-ended inputs driven from slow or noisy sources (front-panel signals, relay contacts, optocoupler outputs) - the ProASIC3L datasheet confirms this option on the A3PE3000L. Keep clock routing on dedicated low-skew resources, and match trace lengths for parallel bus I/O to hold setup/hold margins. Unused I/O should be programmed to weak pull-up or grounded outputs per Microchip design guidelines to prevent floating-node EMI.
Compliance Information
Per digchip datasheet listing: Lead Free Status 'Contains Lead', RoHS Status 'RoHS Non-Compliant'. Green (PQG208) variants exist for compliant designs. AEC-Q100 qualification not stated for this commercial-grade FPGA.
