A3PE3000L-1PQ208 - ProASIC3L Flash FPGA 208-PQFP | Microchip
MPN: A3PE3000L-1PQ208 ✓ Active| Qty | Unit Price | Extended |
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| 500 | $0 | $0.00 |
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Drop-in alternatives for A3PE3000L-1PQ208 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-1PQG208
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000L-1PQ208I
✅ Drop-In✓ In Stock
$82 / Unit
View Datasheet →A3PE3000L-PQG208I
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$48.9 / Unit
View Datasheet →A3PE3000L-PQ208
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$310.69 / Unit
View Datasheet →A3PE3000-1PQG208I
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$59.9 / Unit
View Datasheet →A3PE3000L-1PQ208 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3M gates |
| Logic Elements | 35K LEs |
| User I/O | 147 |
| Core Voltage | 1.2 V |
| Core Voltage Range | 1.2 V to 1.5 V |
| Process Technology | 130 nm flash |
| Characteristic Frequency | 892.86 MHz |
| Configuration Memory | On-chip nonvolatile flash (Instant On) |
| Low Power Feature | Flash*Freeze technology |
| Package | 208-BFQFP (PQFP-208) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| MSL Level | 3 (168 hours) |
| ECCN | 3A001A7A |
| HTSUS | 8542.39.0001 |
A3PE3000L-1PQ208 208-bfqfp (pqfp-208) Pin Configuration Guide
Complete pinout information for A3PE3000L-1PQ208 (208-bfqfp (pqfp-208) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-1PQ208.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-1PQ208 is suitable for 6 applications: Battery-Powered Portable Instruments, Industrial Embedded Control and Interface Bridging, Secure Single-Chip Systems, Communications Line Cards and Backplane Glue, Aerospace and Defense Legacy Redesign, Test and Measurement Instrumentation.
Battery-Powered Portable Instruments
The A3PE3000L-1PQ208 fits portable, battery-operated instruments because its nonvolatile flash fabric is Instant On and its Flash*Freeze technology collapses dynamic power while preserving all register and I/O state, allowing the system to idle at micro-power and wake on external events. With a 1.2V core and roughly 35K LEs plus 147 user I/Os, it integrates glue logic, sensor interfaces, and display control that would otherwise require several discrete ICs whose combined quiescent current would exceed the FPGA's own budget. Implemented in the 208-PQFP package, the design gains a large, hand-solderable footprint suited to low-volume portable hardware. The trade-off versus an MCU solution is higher unit cost, repaid by true hardware-parallel datapaths in measurement engines.
Recommended
Industrial Embedded Control and Interface Bridging
In industrial controllers the A3PE3000L-1PQ208 serves as a single-chip bridge between legacy parallel buses, industrial field interfaces, and modern MCU or SoC hosts. Its 147 user I/Os support multiple voltage banks, letting one device span 3.3V, 2.5V, and 1.8V logic domains without level shifters, while the flash fabric starts executing instantly at power-up - important in factory equipment that must be productive the moment 24V backplane power is applied. The VersaTile architecture efficiently implements UART/SPI/I2C engines, encoders, and interlock logic with cycle-deterministic timing that software cannot match. Industrial temperature variants (A3PE3000L-1PQ208I) cover -40C to +100C cabinets, and the PQFP leads simplify rework on production lines.
Recommended
Secure Single-Chip Systems
ProASIC3L flash FPGAs are suited to designs where bitstream confidentiality matters: the configuration lives in on-chip nonvolatile flash, so there is no external configuration memory to intercept, and Microchip supports design security features against readback. The A3PE3000L-1PQ208's 3M gates implement crypto accelerators, secure boot front-ends, or authentication engines while the Instant On fabric enforces access policy from the first clock. Compared with an SRAM FPGA plus encrypted configuration flash, the single-chip approach removes an entire attack surface and a bill-of-materials line item. Designers should combine the device with Microchip's Libero security toolchain features and verify supply-chain integrity, since the mature 130nm part is also a counterfeit target on broker markets.
Recommended
Communications Line Cards and Backplane Glue
On communications line cards, the A3PE3000L-1PQ208 implements backplane glue logic: bus formatting, framing, interrupt aggregation, and LED/alarm handling around higher-assistance PHY and switch silicon. The 892.86MHz family characteristic figure reported by distributor data reflects internal routing performance class, while practical I/O toggling rates are limited by the PQFP package's lead inductance - designers should simulate bus turnaround for edges faster than roughly 1 ns. Instant On behavior means the card's housekeeping logic is alive before slot-level power sequencing completes, simplifying presence detection. With 147 I/Os the device absorbs the point-count that would otherwise sprawl across multiple CPLDs, consolidating timing closure into one constraint set in Libero SoC.
Recommended
Aerospace and Defense Legacy Redesign
Microsemi (now Microchip) flash FPGAs have a long heritage in aerospace and defense programs, and the A3PE3000L-1PQ208 is a rational target for redesigning legacy ASIC or antifuse logic into reprogrammable, nonvolatile fabric. The flash cell's inherent immunity to configuration upset (no external config memory) and secure programming suit environments where radiation-tolerant configuration storage is valued, while the commercial PQFP-208 suits ground-based and laboratory equipment. Engineering teams use Libero SoC with timing-constrained flows to port schematics from older MX or ProASIC PLUS families; Microchip migration application notes cover the VersaTile mapping strategy. For flight programs, pair this device with Microchip's qualified packaging and screening flows rather than catalog commercial grading.
Recommended
Test and Measurement Instrumentation
Bench and rack instruments use the A3PE3000L-1PQ208 for timing generators, trigger matrices, and probe-interface logic where deterministic hardware latency is essential. The VersaTile fabric builds wide counters and edge-detect comparators that sample trigger events with nanosecond determinism, something an embedded CPU alone cannot guarantee under interrupt load. Its 147 I/Os connect front-end analog boards to the digital core across several voltage banks, and Instant On operation lets calibration constants held in the flash fabric be available the moment power is applied, cutting boot time versus SRAM FPGA designs that wait for configuration. The tray-packed PQFP also suits instrument contract manufacturers doing low-volume, high-mix assembly with inspection-friendly gull-wing leads.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-1PQ208 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1PQG208 | A3PE3000L-1PQ208I | A3PE3000L-PQG208I | A3PE3000-1PQG208I |
|---|---|---|---|---|---|
| Package | 208-PQFP (BFQFP) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E |
| System Gates | 3M | 3M | 3M | 3M | 3M |
| User I/O | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -1 | -1 | -1 | std | -1 |
| Temperature Grade | Commercial | Commercial | Industrial | Industrial | Industrial |
| RoHS / Green Packaging | [DATA_NEEDED] | Yes (G suffix) | No (standard finish) | Yes (G suffix) | Yes (G suffix) |
Key Differentiators
- Flash*Freeze ultra-low-power mode (vs A3PE3000-1PQG208I)
- Green/RoHS packaging available in same footprint (vs A3PE3000L-1PQ208I)
- Instant On single-chip configuration (vs SRAM FPGA equivalents (Xilinx/Intel))
- Trade-off: mature 130nm process (vs A3PE3000-1PQG208I)
Design Notes
The 208-PQFP uses 0.5mm lead pitch with gull-wing leads. Design the land pattern per the Microchip PQFP-208 mechanical drawing, with solder-mask-defined pads slightly extended to improve self-alignment during reflow. Route JTAG (TDI/TDO/TMS/TCK) as a short daisy chain with series resistors near the header, since long TCK stubs on PQFP packages cause boundary-scan failures in production programming fixtures.
Provide a dedicated 1.2V core rail and per-bank I/O rails (VCCI). Decouple each VCC/VCCI pin pair with at least one 0.1uF ceramic placed within 3mm of the pin, plus bulk 10uF per rail corner of the package. Estimated: with ~35K LEs active at moderate toggle rates, core current can reach hundreds of milliamps - run Microchip's power estimator (in Libero SoC) with your actual design before sizing the 1.2V converter, rather than sizing from the family headline numbers.
PQFP lead inductance is several times higher than a comparable BGA, so simultaneous switching outputs on a 32-bit bus can generate measurable ground bounce. Stagger output edge rates using the I/O register slew settings in Libero, distribute bus outputs across multiple ground pins/quadrants of the package, and avoid routing clocks on corner pins. For any bank toggling above roughly 100 MHz, run IBIS simulation with the Microchip-supplied PQFP-208 model.
Do not confuse the commercial A3PE3000L-1PQ208 with the industrial A3PE3000L-1PQ208I when generating BOMs for wide-temperature products - the suffix is easily dropped during ECO edits. Also note third-party data marks the non-G version RoHS non-compliant; specify PQG208 for compliant assemblies. Finally, this MPN is a counterfeit target on broker markets: buy from authorized channels and verify date codes against Microchip shipment records.
Compliance Information
Third-party data (Quarktwin/Globalspec) lists A3PE3000L-1PQ208I as 'RoHS non-compliant' and 'REACH Unaffected' with MSL 3 (168 hours); use the 'G' suffix (PQG208) variant for RoHS-compliant green packaging. HTSUS 8542.39.0001, ECCN 3A001A7A.
