A54SX32A-FGG256A - 48K Gate SX-A FPGA 256-BGA | Microchip
MPN: A54SX32A-FGG256A ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $345.6 | $345.60 |
| 10 | $322.4 | $3,224.00 |
| 100 | $305.1 | $30,510.00 |
| 500 | $298.75 | $149,375.00 |
| 1,000 | $295.2 | $295,200.00 |
Drop-in alternatives for A54SX32A-FGG256A — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A54SX32A-1FGG256A
✅ Drop-In📋 Reference alternative (not in catalog)
A54SX32A-1FGG256I
✅ Drop-In✓ In Stock
$316.27 / Unit
View Datasheet →A54SX32A-2FGG256I
✅ Drop-In✓ In Stock
$368.59 / Unit
View Datasheet →A54SX32A-1FGG256
✅ Drop-In✓ In Stock
$1 / Unit
View Datasheet →A54SX32A-FGG256
✅ Drop-In📋 Reference alternative (not in catalog)
A54SX32A-1FGG256M
✅ Drop-In✓ In Stock
$62.5 / Unit
View Datasheet →A54SX32A-FGG256A Maximum Ratings & Electrical Characteristics
| Family | SX-A (Actel antifuse FPGA) |
| System Gates | 48000 gates |
| Typical Gates | 32000 gates |
| Register Cells (R-cells) | 2880 |
| User I/O | 203 |
| Supply Voltage (VCC) | 2.25 V to 2.75 V |
| Programming Technology | Antifuse (one-time programmable) |
| Speed Grade | Standard (A) |
| Operating Temperature | -40C to +125C |
| Mounting Type | Surface Mount (SMD/SMT) |
| Package | 256-BGA (FGG256), fine-pitch |
| Architecture | Sea-of-modules (C-cells and R-cells) |
| Non-volatile Configuration | Yes (antifuse, no external boot PROM) |
| Lead Free | Yes |
| RoHS Status | Compliant |
A54SX32A-FGG256A 256-bga (fgg256), fine-pitch Pin Configuration Guide
Complete pinout information for A54SX32A-FGG256A (256-bga (fgg256), fine-pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX32A-FGG256A.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX32A-FGG256A is suitable for 6 applications: Industrial Control and Automation, Aerospace and Defense Systems, Telecommunications and Networking Line Cards, Medical Instrumentation, Legacy System Sustainment and BOM Consolidation, Secure Boot and Data-Acquisition Control.
Industrial Control and Automation
The A54SX32A-FGG256A fits industrial control and factory automation systems that need deterministic glue logic, state machines, and interface bridging on a single chip. Its 48,000 system gates and 2,880 R-cells consolidate PLC I/O decoding, backplane interfacing, and sequencing logic that would otherwise occupy multiple CPLDs or hundreds of TTL devices. The 2.25-2.75 V core supply with low static power keeps cabinet thermal budgets manageable, while the -40C to +125C operating range tolerates harsh floor environments near drives and motors. Because the antifuse fabric is one-time programmed, deployed controllers boot instantly with no configuration device to fail, improving line availability. Place it between fieldbus PHYs and the main processor with the 203 user I/Os handling parallel data, address decoding, and handshaking at multi-tens-of-MHz speeds.
Recommended
Aerospace and Defense Systems
Aerospace and defense designers select the A54SX32A-FGG256A where configuration security and instant-on behavior are mandatory. The antifuse interconnect cannot be read back, so the implemented bitstream resists reverse engineering - a decisive advantage over SRAM FPGAs whose configuration files are exposed in external memories. The device powers up functional within microseconds with no boot PROM, suiting avionics modules, secure communications equipment, and satellite payload logic that must be live at power application. The extended -40C to +125C range and radiation-tolerant heritage of the Actel antifuse process support demanding environmental profiles, and the 256-ball BGA provides mechanical robustness under vibration. Typical uses include bus bridging (MIL-STD-1553 companion logic), telemetry formatting, and flight-critical state machines validated once and programmed permanently.
Recommended
Telecommunications and Networking Line Cards
In telecom and networking equipment, the A54SX32A-FGG256A implements line-card glue logic: frame formatting, backplane handshaking, LED drive sequencing, and address decode between PHY devices and network processors. The SX-A sea-of-modules fabric delivers C-cell/R-cell timing that supports system speeds up to 278 MHz on the -1 speed grade, comfortably covering T1/E1, SONET-overhead-adjacent, and backplane control paths. The 203 user I/Os accommodate wide parallel buses to switch fabric and processor interfaces, while the low static power of antifuse technology keeps dense shelf-level power budgets in check across dozens of cards. Because the configuration is fixed at programming, cards power up and pass traffic immediately - valuable in carrier equipment where boot delay translates to outage. The FGG256 BGA suits the fine-pitch, high-density layouts of modern line cards.
Recommended
Medical Instrumentation
Medical diagnostic and monitoring instruments benefit from the A54SX32A-FGG256A's deterministic, permanently programmed control logic. Patient-interface subsystems require precise timing for sensor multiplexing, acquisition-window generation, and front-end ADC control; the FPGA's R-cells provide registered timing with no configuration-load uncertainty, and the one-time-programmable fabric eliminates configuration-corruption faults over the instrument's service life - a consideration for devices subject to regulatory design controls. The 48,000-gate capacity implements acquisition sequencers, filter control, and interface logic to the host processor, while the 2.25-2.75 V supply and low static current reduce heat inside enclosed benchtop or portable housings. The FGG256 fine-pitch BGA supports the compact board areas of handheld diagnostic heads, and the wide temperature range accommodates autoclave-adjacent environments.
Recommended
Legacy System Sustainment and BOM Consolidation
The A54SX32A-FGG256A is a workhorse for legacy system sustainment: programs originally designed around Actel SX, SX-A, or multiple discrete logic devices can consolidate or replace failing silicon without board redesign, because the SX-A family has remained in production with Microchip. Its 48,000 system gates absorb ASIC replacement, obsolete-CPLD migration, and TTL consolidation, cutting BOM count and qualification burden. The antifuse fabric means the programmed design is frozen exactly as qualified - no firmware drift, no configuration device obsolescence - which simplifies configuration-management audits. Distributor listings show continued availability (with lead times up to 12 weeks), so sustainment teams should place factory orders aligned to maintenance schedules. Same-footprint speed/temperature variants allow lifetime buys across grades on one PCB layout.
Recommended
Secure Boot and Data-Acquisition Control
Data-acquisition and control systems that demand tamper-resistant logic use the A54SX32A-FGG256A as the configuration hub between analog front ends and host processors. Because the antifuse bitstream resides inside the die and cannot be dumped, proprietary acquisition algorithms and interface protocols implemented in the fabric are protected against extraction - unlike SRAM FPGAs that load plaintext configuration from external flash at every power-up. The device's 203 I/Os sequence ADCs, control gain stages, and timestamp events with registered precision, while the 2.5 V core keeps overall rail count low. Instant-on operation means the acquisition chain is armed before the host OS finishes booting, capturing events that software-controlled FPGAs would miss. Antifuse programming also removes the external configuration memory from the trusted-computing baseline.
Recommended
Recommended Products Summary
Engineering reference data for A54SX32A-FGG256A — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX32A-1FGG256A | A54SX32A-1FGG256I | A54SX32A-2FGG256I | A54SX32A-FGG256 |
|---|---|---|---|---|---|
| Package | 256-BGA (FGG256) | 256-BGA (FGG256) - same | 256-BGA (FGG256) - same | 256-BGA (FGG256) - same | 256-BGA (FGG256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 48000 | 48000 | 48000 | 48000 | 48000 |
| User I/O | 203 | 203 | 203 | 203 | 203 |
| Speed Grade | Standard (A) | -1 (up to 278 MHz system speed) | -1 | -2 (fastest) | Standard (A) |
| Supply Voltage | 2.25 V to 2.75 V | 2.25 V to 2.75 V | 2.25 V to 2.75 V | 2.25 V to 2.75 V | 2.25 V to 2.75 V |
| Operating Temperature | -40C to +125C | [DATA_NEEDED] | Industrial rating (I suffix) | Industrial rating (I suffix) | -40C to +125C |
| Programming Technology | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
Key Differentiators
- Fastest timing at the same footprint (vs A54SX32A-FGG256A)
- Configuration security over SRAM FPGAs (vs Comparable SRAM FPGAs (e.g., Xilinx Spartan-class))
- Industrial temperature with maximum speed (vs A54SX32A-2FGG256I)
Design Notes
Provide a clean 2.5 V core rail regulated within the 2.25 V to 2.75 V window. Although SX-A antifuse devices draw very low static current, dynamic current scales with clock frequency and toggle rate; size the regulator using Libero power estimation for your design, then derate 30%. Decouple each VCC ball with 0.1 uF ceramics placed on the BGA breakout vias, plus bulk 10 uF near the device. Verify I/O bank supply requirements against your chosen I/O standards in the SX-A datasheet power section.
Antifuse FPGAs are one-time programmable: a design error found after programming scrapes the device. Complete full functional simulation and static timing analysis (including worst-case speed-grade corners) in Libero before committing production parts. Lock your pin assignments early - the 256-BGA footprint is fixed, and 203 of 256 balls are user I/O, so pad migration options are limited. Buy a few spare units per panel for development programming on the A speed grade before ordering the full production lot.
The FGG256 fine-pitch BGA requires a controlled reflow profile and via-in-pad or dog-bone fanout on 0.8 mm-class ball pitch. Follow the SX-A datasheet thermal section: thermal performance depends on device, operating temperature, current, and board heat dissipation - use at least a 4-layer board with solid ground plane and thermal vias under the package for the +125C upper ambient corner. Inspect with X-ray or post-reflow AOI given the one-time-programmable die; a solder defect discovered later cannot be reworked without risking the programmed device.
Compliance Information
Distributor listings describe the part as lead free; the FGG256 package designation denotes lead-free balls. Formal REACH/halogen declarations should be requested from Microchip product compliance documentation.
