ATSAM3X4EA-CU - 84MHz Cortex-M3 MCU, 256KB Flash | Microchip
MPN: ATSAM3X4EA-CU β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.95 | $8.95 |
| 10 | $8.25 | $82.50 |
| 100 | $7.4 | $740.00 |
| 500 | $6.85 | $3,425.00 |
| 1,000 | $6.3 | $6,300.00 |
ATSAM3X4EA-CU Overview
A microcontroller (MCU) is a single-chip computer integrating a processor core, program memory, data memory, and a rich set of peripherals onto one silicon die. Within the power management IC and semiconductor hierarchy, MCUs sit at the heart of embedded systems, executing real-time control, communication, and human-interface tasks. The SAM3X/A family belongs to Microchip (formerly Atmel) ARM-based flash MCU portfolio, positioned above the smaller SAM3N series and alongside the USB-capable SAM3U series.
Key features of the ATSAM3X4EA-CU include the ARM Cortex-M3 revision 2.0 core with Thumb-2 instruction set, a Memory Protection Unit (MPU), a 24-bit SysTick timer, and Nested Vectored Interrupt Controller (NVIC) for deterministic interrupt handling. Connectivity peripherals span CAN, EBI/EMI external bus, Ethernet MAC, I2C, IrDA, LIN, and MMC/SD interfaces, making the device a strong fit for multi-protocol industrial nodes. The CMOS process platform delivers efficient power performance for always-on embedded applications.
Technically, the Cortex-M3 architecture provides 32-bit RISC throughput with low interrupt latency, while the peripheral DMA channels offload the CPU in high-bandwidth data paths such as Ethernet framing or CAN message queues. The industrial temperature grade (suffix -CU, green package, MRL A) supports harsh-environment deployment.
Typical applications include industrial automation controllers, CAN/Ethernet gateways, embedded networking equipment, test instruments, and motor control systems that require 32-bit compute with extensive communication interfaces.
A key design consideration is supply voltage: the device operates from a nominal 1.8 V core-class supply per distributor listings, so verify the exact I/O and VDDCORE ranges in the manufacturer datasheet before finalizing the power tree.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for ATSAM3X4EA-CU β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM3X4EA-CU (same form factor and footprint) β differing in Connectivity, Flash Memory, Memory Protection, Package, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATSAM3X8EA-CU
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$8.4 / Unit
View Datasheet βATSAM3U4EA-CU
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM3X4EA-CU Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M3 |
| Core Architecture | 32-bit RISC |
| Maximum Clock Speed | 84 MHz |
| Series | SAM3X |
| Flash Memory | 256 KB (256K x 8) |
| Connectivity | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC/SD |
| Peripherals | MPU, 24-bit SysTick, NVIC |
| Supply Voltage (Nominal) | 1.8 V |
| Operating Temperature | Industrial range (-40C to +85C) |
| Package | 144-LFBGA (13 x 13 mm) |
| Mounting Type | Surface Mount |
| Termination Form | Ball (LFBGA, square) |
| Number of Terminals | 144 |
| Package Color / Compliance Code | GREEN, MRL A |
| RoHS Status | RoHS Compliant (green package) |
| Instruction Set | Thumb-2 |
| Memory Protection | MPU (Memory Protection Unit) |
ATSAM3X4EA-CU green, mrl a Pin Configuration Guide
Pin configuration for ATSAM3X4EA-CU (green, mrl a package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM3X4EA-CU.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM3X4EA-CU is suitable for 6 applications: Industrial Automation Controllers, CAN / Ethernet Industrial Gateways, Embedded Networking Equipment, Test and Measurement Instrumentation, Motor Control Systems, IoT and Smart Building Nodes.
Industrial Automation Controllers
The ATSAM3X4EA-CU fits industrial automation controllers because its 84 MHz ARM Cortex-M3 core delivers deterministic real-time response while the integrated CAN controller and EBI/EMI external bus interface connect PLC-style logic to sensors, drives, and backplanes. In a typical controller, the MCU runs the control loop from internal Flash while the MPU isolates critical code regions, and the NVIC keeps interrupt latency low for time-critical I/O. The industrial temperature grade and green RoHS package suit factory deployments. Compared with a pure CAN node, this part adds Ethernet-class connectivity, letting one chip bridge fieldbus and supervisory networks without an external processor.
Recommended
CAN / Ethernet Industrial Gateways
Protocol gateways between CAN fieldbuses and Ethernet backbones benefit directly from the ATSAM3X4EA-CU, which integrates both a CAN controller and an Ethernet MAC on one 84 MHz Cortex-M3 die. The peripheral DMA offloads packet and message handling so the CPU concentrates on protocol translation, and 256KB Flash holds dual-protocol stacks with room for firmware updates. The EBI/EMI interface permits external memory expansion for message buffering. Because gateway products often run continuously in cabinets, the industrial temperature rating and low-power CMOS process help maintain reliability. Design the PHY and transceiver around the MAC and CAN peripherals per the manufacturer datasheet reference designs.
Recommended
Embedded Networking Equipment
For embedded networking equipment such as supervisory modules, routers' management planes, and industrial switches' control cards, the ATSAM3X4EA-CU provides the 32-bit compute, Ethernet MAC, and MMC/SD interface needed for configuration storage and remote management. Running at 84 MHz with Thumb-2 code density, the device executes TCP/IP stacks and device servers comfortably, while IrDA, LIN, and I2C peripherals support console and legacy links. The 144-ball LFBGA provides enough I/O for status, switching, and debug signals without glue logic. Firmware fits in the 256KB Flash; verify the SRAM capacity in the datasheet when sizing buffer pools for packet processing.
Recommended
Test and Measurement Instrumentation
Bench and field instruments use the ATSAM3X4EA-CU as the system controller, where its 84 MHz Cortex-M3 handles measurement sequencing, user interface, and communication simultaneously. The EBI/EMI external bus attaches memory-mapped front ends or displays, the 24-bit SysTick timer provides accurate timebases, and USB- or Ethernet-class connectivity exports results. The Memory Protection Unit isolates calibration routines from user firmware, improving data integrity. Because instruments require long service life, the RoHS green industrial package and stable Microchip supply chain are practical advantages. Keep analog domains separated from the digital rails and follow the datasheet layout guidance for best noise performance.
Recommended
Motor Control Systems
Motor drives and motion controllers exploit the ATSAM3X4EA-CU's 84 MHz real-time core, rich timers, and CAN connectivity for coordinated multi-axis control. The Cortex-M3 executes field-oriented control mathematics with deterministic interrupt timing managed by the NVIC, while CAN links the drive to a plant-wide automation network without an extra controller. The EBI/EMI interface can host external memory for trajectory tables, and LIN/IrDA peripherals support service-tool connections. Implement gate-driver interfacing with isolated drivers and follow the reference designs in the SAM3X/A documentation. Confirm PWM timer resources for this exact ordering code in the datasheet before committing the control architecture.
Recommended
IoT and Smart Building Nodes
Smart-building controllers and IoT edge nodes use the ATSAM3X4EA-CU when they need wired connectivity - Ethernet, CAN, or LIN - rather than only radio links. Its 84 MHz core runs lightweight network stacks, the MMC/SD interface stores local logs, and I2C connects environmental sensors. The CMOS process keeps standby power reasonable for always-on monitoring, and the 256KB Flash retains firmware plus a small data set without external memory. For battery-powered nodes, measure actual sleep-mode current against the datasheet electrical characteristics, since this part targets connected mains-powered equipment more than coin-cell endpoints. The industrial temperature grade also suits rooftop and mechanical-room installations.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM3X4EA-CU β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM3X8EA-CU | ATSAM3U4EA-CU |
|---|---|---|---|
| Package | 144-LFBGA (13x13 mm) | 144-LFBGA (13x13 mm) - same | 144-LFBGA (13x13 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit |
| Max Clock Speed | 84 MHz | 84 MHz | 84 MHz |
| Connectivity Focus | CAN, Ethernet, EMI, LIN, MMC | CAN, Ethernet, EMI, LIN, MMC | USB-focused HS device peripheral set |
Key Differentiators
- Balanced memory/cost point in the SAM3X family (vs ATSAM3X8EA-CU)
- Ethernet + CAN convergence on one chip (vs ATSAM3U4EA-CU)
- Industrial green package with MRL A (vs Consumer-grade MCU options)
Design Notes
The ATSAM3X4EA-CU is listed with a nominal 1.8 V supply class. SAM3X-family devices typically use separate VDDCORE, VDDIO, and VDDUSB domains, so design the power tree with distinct rails and proper sequencing. Verify exact min/max ranges in the SAM3X/A datasheet before finalizing regulators, and add 100 nF decoupling per power ball plus bulk capacitance near the die. Estimated: 0.1 uF x per-ball count plus a 10 uF bulk per rail is a practical starting point.
A 144-ball LFBGA at 13 x 13 mm normally requires a 4-layer or more PCB for ball fan-out: escape via-in-pad or dog-bone patterns on the outer layers with dedicated inner planes for power and ground. Follow ball pitch rules from the SnapEDA/Microchip footprint (verified via SnapEDA exports) and keep high-speed Ethernet PHY traces length-controlled. The center area of the ball array commonly carries power/ground balls - connect them to solid planes with multiple vias.
Do not assume SRAM size from the family name - confirm the exact on-chip SRAM for the SAM3X4E density code in the datasheet before allocating network buffers. Flash density (256KB) differs from SAM3X8 siblings, so firmware ported from larger parts can overflow silently. Also verify whether USB is supported on this exact ordering code, since peripheral sets vary across SAM3X speed/density grades.
Compliance Information
Mouser lists GREEN package with MRL A material restriction level for ATSAM3X4EA-CU, indicating RoHS compliance and lead-free construction. REACH, halogen-free, and conflict-minerals declarations were not found in the retrieved data.
