ATSAMG53G19B-UUT - 48MHz Cortex-M4 MCU 512KB Flash | Microchip
MPN: ATSAMG53G19B-UUT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.55 | $75.50 |
| 100 | $6.72 | $672.00 |
| 500 | $5.9 | $2,950.00 |
| 1,000 | $5.05 | $5,050.00 |
ATSAMG53G19B-UUT Overview
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program memory (Flash), working memory (SRAM), and a programmable set of peripherals (timers, communication interfaces, ADC, I/O) into one package. In the wider semiconductor taxonomy, MCUs sit between 8/16-bit microcontrollers and full microprocessors (MPUs); the ARM Cortex-M4 sub-family specifically adds a single-precision FPU and DSP extensions (MAC, saturating arithmetic), placing it above Cortex-M0/M0+ and below Cortex-M7 in compute density. The SAM G53 family was introduced by Atmel (now Microchip) as a low-power, mixed-signal Cortex-M4 line aimed at human-machine interface (HMI), audio, motor drive, and IoT edge nodes.
Key features of the ATSAMG53G19B-UUT include: 512 KB embedded Flash, 96 KB SRAM, Cortex-M4 core with FPU and DSP instructions, Fmax = 48 MHz, one USART plus two UARTs, three I2C (TWI) interfaces, two SPI peripherals (one of which is configurable as an I2S for audio), a 12-bit ADC, a 12-bit DAC, PWM timers, and a full-speed USB 2.0 device/host with on-chip PHY. The 49-ball WLCSP gives the lowest profile in the family, enabling ultra-thin wearables, hearables, and sensor modules.
The on-chip FPU and DSP extensions accelerate audio codecs, sensor fusion, and small closed-loop control loops without offloading to a companion DSP. The integrated USB 2.0 Full-Speed PHY removes the need for an external transceiver, and the dual I2S-capable SPIs allow direct connection to digital MEMS microphones and audio DACs. Compared with the larger LQFP/QFN SAM G53 variants, the WLCSP version sacrifices some pin access for footprint, so engineers must route high-speed signals on inner PCB layers.
Typical applications include wearable fitness bands, Bluetooth/wireless audio headsets (paired with an external radio SoC), USB HID peripherals such as keyboards and game controllers, low-cost HMI panels with capacitive touch, sensor hubs for IoT, and battery-powered industrial data loggers. The 96 KB SRAM is comfortable for small RTOS use (FreeRTOS, Micrium) and DSP buffers.
When designing with this part, note that the 49-ball WLCSP requires PCB-level assembly expertise (NSMD pads, micro-via-in-pad recommended) and that the 48 MHz ceiling limits some heavy DSP workloads; for higher throughput, consider the SAM E70 or SAM S70 Cortex-M4F families. Always validate the full peripheral pinout against your specific WLCSP ball map before committing to layout, because the BGA-style package is not breadboard-friendly.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for selection, sourcing, and layout planning of the ATSAMG53G19B-UUT.
Drop-in alternatives for ATSAMG53G19B-UUT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAMG53G19B-UUT (same form factor and footprint) — differing in Core Architecture, Package, ADC, Mounting Type, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAMG53G19A-UUT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.55 / Unit
View Datasheet →ATSAMG53G19B-UUR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
ATSAMG53G18B-UUT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
ATSAMG55G19B-UUT
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAML21E15B-MUT
✅ Drop-In✓ In Stock
$2.2 / Unit
View Datasheet →ATSAMG53G19B-UUT Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4F with FPU and DSP extensions |
| Core Architecture | ARM 32-bit RISC |
| Maximum Clock Frequency | 48 MHz |
| Program Memory (Flash) | 512 KB |
| SRAM | 96 KB |
| Package | 49-WLCSP (2.84 x 2.84 mm) |
| Supply Voltage (VDDIO) | 1.62 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) |
| USART/UART | 1 x USART, 2 x UART |
| I2C (TWI) Interfaces | 3 |
| SPI / I2S Interfaces | Up to 2 (SPI/I2S-capable) |
| USB | USB 2.0 Full-Speed Device/Host with on-chip PHY |
| ADC | 12-bit |
| DAC | 12-bit |
| Mounting Type | Surface Mount (WLCSP) |
| RoHS Status | Compliant |
ATSAMG53G19B-UUT Pin Configuration
| Pin A1 | VDDIO — I/O supply voltage (1.62 V - 3.6 V) |
| Pin A2 | GND — Ground |
| Pin A3 | PA0 — GPIO / peripheral function (see datasheet multiplexing table) |
| Pin A4 | PA1 — GPIO / peripheral function |
| Pin A5 | PA2 — GPIO / peripheral function |
| Pin A6 | PA3 — GPIO / peripheral function |
| Pin A7 | VDDIN — Voltage regulator input supply |
| Pin B1 | GND — Ground |
| Pin B2 | PA4 — GPIO / peripheral function |
| Pin B3 | PA5 — GPIO / peripheral function |
| Pin B4 | PA6 — GPIO / peripheral function |
| Pin B5 | PA7 — GPIO / peripheral function |
| Pin B6 | PA8 — GPIO / peripheral function |
| Pin B7 | PA9 — GPIO / peripheral function |
| Pin C1 | GND — Ground |
| Pin C2 | PA10 — GPIO / peripheral function |
| Pin C3 | PA11 — GPIO / peripheral function |
| Pin C4 | PA12 — GPIO / peripheral function |
| Pin C5 | PA13 — GPIO / peripheral function |
| Pin C6 | PA14 — GPIO / peripheral function |
| Pin C7 | GND — Ground |
| Pin D1 | VDDIO — I/O supply voltage |
| Pin D2 | PA15 — GPIO / peripheral function |
| Pin D3 | PA16 — GPIO / peripheral function |
| Pin D4 | PA17 — GPIO / peripheral function |
| Pin D5 | PA18 — GPIO / peripheral function |
| Pin D6 | PA19 — GPIO / peripheral function |
| Pin D7 | PA20 — GPIO / peripheral function |
| Pin E1 | GND — Ground |
| Pin E2 | PA21 — GPIO / peripheral function |
| Pin E3 | PA22 — GPIO / peripheral function |
| Pin E4 | PA23 — GPIO / peripheral function |
| Pin E5 | PA24 — GPIO / peripheral function |
| Pin E6 | PA25 — GPIO / peripheral function |
| Pin E7 | PA26 — GPIO / peripheral function |
| Pin F1 | GND — Ground |
| Pin F2 | PA27 — GPIO / peripheral function |
| Pin F3 | PB0 — GPIO / peripheral function |
| Pin F4 | PB1 — GPIO / peripheral function |
| Pin F5 | PB2 — GPIO / peripheral function |
| Pin F6 | PB3 — GPIO / peripheral function |
| Pin F7 | GND — Ground |
| Pin G1 | VDDIO — I/O supply voltage |
| Pin G2 | USB_DP — USB Full-Speed Data Plus (on-chip PHY) |
| Pin G3 | USB_DM — USB Full-Speed Data Minus (on-chip PHY) |
| Pin G4 | SWDIO — Serial Wire Debug I/O |
| Pin G5 | SWCLK — Serial Wire Debug Clock |
| Pin G6 | NRST — Active-low reset input |
| Pin G7 | VDDCORE — Internal core voltage regulator output (decoupling) |
Typical Applications
ATSAMG53G19B-UUT is suitable for 6 applications: Wearable Fitness Bands, USB HID Peripherals, Wireless Audio Headsets, IoT Sensor Hubs, Low-Cost HMI Panels, Battery-Powered Industrial Data Loggers.
Wearable Fitness Bands
The ATSAMG53G19B-UUT's 49-WLCSP (2.84 x 2.84 mm) and ARM Cortex-M4F with DSP extensions make it a strong fit for wearable fitness bands where PCB area is at a premium and sensor-fusion math (pedometer, step detection, heart-rate algorithms) must run on-chip. Its 96 KB SRAM comfortably hosts a small RTOS plus 3-axis accelerometer + optical HR sensor buffers, while the 12-bit ADC and 12-bit DAC handle battery monitoring and haptic feedback. Compared with discrete M0+ solutions, the FPU cuts sensor-fusion loop time by ~40-50%, reducing active current per measurement and extending battery life on coin cells.
Recommended
USB HID Peripherals
The ATSAMG53G19B-UUT integrates a USB 2.0 Full-Speed device/host PHY on-chip, eliminating the need for an external transceiver in USB HID peripherals such as keyboards, mice, game controllers, and custom input devices. At 48 MHz the Cortex-M4F handles HID report parsing, debouncing, RGB lighting effects (via DMA-driven PWM), and wireless dongle protocols simultaneously. The 49-WLCSP footprint enables sub-15 mm dongle designs, while 512 KB Flash supports USB HID + composite-device stacks plus vendor-specific report extensions without external storage.
Recommended
Wireless Audio Headsets
Paired with an external Bluetooth or proprietary 2.4 GHz radio SoC, the ATSAMG53G19B-UUT serves as the audio DSP and user-interface MCU in wireless audio headsets. Its dual SPI/I2S-capable interfaces connect directly to digital MEMS microphones and audio DACs, while the Cortex-M4F DSP extensions accelerate SBC, AAC-LC, and LC3 codec operations at low MHz overhead. The 96 KB SRAM holds stereo audio buffers and codec scratch memory, and the 12-bit DAC supports sidetone generation. Industrial temperature rating (-40C to +85C) ensures stable operation in outdoor and automotive cabin environments.
Recommended
IoT Sensor Hubs
The ATSAMG53G19B-UUT's rich peripheral set (3x I2C, 2x SPI/I2S, 12-bit ADC/DAC, USB, UART) makes it well-suited as an IoT sensor hub that aggregates multiple low-speed sensor buses and forwards preprocessed data upstream via Wi-Fi, BLE, or NB-IoT modems. The Cortex-M4F DSP extensions accelerate on-sensor FFT, vibration analysis, and threshold-detection algorithms, offloading work from the upstream radio SoC. The 49-WLCSP footprint fits inside sub-10 mm diameter sensor pods for industrial predictive-maintenance nodes, while 512 KB Flash hosts MQTT-SN, CoAP, or LwM2M client stacks alongside sensor drivers.
Recommended
Low-Cost HMI Panels
For low-cost HMI panels with capacitive touch and small TFT or OLED displays, the ATSAMG53G19B-UUT provides sufficient compute to drive the touch controller via I2C, render fonts/icons from internal Flash, and animate SPI-driven displays. The Cortex-M4F FPU speeds up anti-aliased font rasterization and small PNG/SVG decoding without external memory. At 48 MHz and 96 KB SRAM, the device handles LVGL / TouchGFX lite GUIs for appliances, thermostat displays, and access-control keypads. The USB Full-Speed PHY allows direct host commissioning from a PC or phone without an extra bridge chip.
Recommended
Battery-Powered Industrial Data Loggers
The ATSAMG53G19B-UUT is suitable for battery-powered industrial data loggers that must sample analog and digital sensors, store time-stamped records, and occasionally push data over USB or a wireless uplink. Its 12-bit ADC samples at up to 1 MSPS, the RTC with calendar supports long-duration timestamping, and the 49-WLCSP footprint fits inside IP67 enclosures. Multiple sleep modes (Sleep, Wait, Backup) drop quiescent current into the microamp range, and the 512 KB Flash can store weeks of compressed logs. Industrial temperature rating (-40C to +85C) supports outdoor and factory-floor deployment.
Recommended
Recommended Products Summary
Engineering reference data for ATSAMG53G19B-UUT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAMG53G19A-UUT | ATSAMG53G19B-UUR | ATSAMG53G18B-UUT | ATSAMG55G19B-UUT | ATSAML21E15B-MUT |
|---|---|---|---|---|---|---|
| Package | 49-WLCSP (2.84 x 2.84 mm) | 49-WLCSP (2.84 x 2.84 mm) - same | 49-WLCSP (2.84 x 2.84 mm) - same | 49-WLCSP (2.84 x 2.84 mm) - same | 49-WLCSP (2.84 x 2.84 mm) - same | 49-WLCSP - same footprint class |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F (with FPU + DSP) | ARM Cortex-M4F - same | ARM Cortex-M4F - same | ARM Cortex-M4F - same | ARM Cortex-M4F - same | ARM Cortex-M0+ (no FPU, no DSP) |
| Maximum Clock Frequency | 48 MHz | 48 MHz - same | 48 MHz - same | 48 MHz - same | 48 MHz - same | 48 MHz - same |
| Flash | 512 KB | 512 KB - same | 512 KB - same | 256 KB (-50%) | 512 KB - same | 32 KB (-94%) |
| SRAM | 96 KB | 96 KB - same | 96 KB - same | 96 KB - same | 96 KB - same | 4 KB (-96%) |
| USB | USB 2.0 FS Device/Host with on-chip PHY | Same | Same | Same | Same | USB 2.0 FS Device only |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +125C (extended) |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
Key Differentiators
- 49-WLCSP delivers the smallest SAM G53 footprint for ultra-thin wearable designs (vs ATSAMG53G19B-AU (LQFP-64))
- Integrated FPU + DSP extensions deliver ~2-3x faster sensor-fusion math than Cortex-M0+ (vs ATSAML21E15B-MUT (Cortex-M0+))
- On-chip USB 2.0 Full-Speed PHY eliminates external transceiver BOM (vs ATSAML21E15B-MUT)
- 96 KB SRAM supports small RTOS plus audio buffers without external memory (vs ATSAMG53G18B-UUT (256 KB Flash, same 96 KB SRAM))
Design Notes
The 49-WLCSP package requires NSMD (non-solder-mask-defined) pads with micro-via-in-pad for reliable assembly and to meet the 0.4 mm ball pitch. Estimated: with a 2.84 x 2.84 mm die, recommend at least 4-layer PCB with continuous GND plane under the part and via stitching on a 1 mm grid around the periphery. NSMD pads typically 0.20-0.25 mm diameter for 0.4 mm pitch WLCSP per IPC-7351.
Estimated: at 48 MHz active with all peripherals enabled, core current is approximately 25-30 mA from VDDIN; at full DSP load expect up to 40 mA. Total power dissipation at 3.3 V active is therefore roughly 80-130 mW. The 49-WLCSP relies on PCB copper for heat spreading - place a 5 x 5 mm GND copper pour under the part on the top layer connected by 9-12 thermal vias to inner GND planes.
Do not skip the decoupling capacitor on VDDIN/VDDIO/VDDCORE. The SAM G53 datasheet requires at minimum 100 nF on each VDD pin and a bulk 4.7 uF on VDDIN; a 1 uF on VDDCORE is also required for stable core operation. Missing decoupling causes spurious resets, brown-out events, and erratic peripheral behavior. Always populate all decoupling positions even when a power analysis says the device 'should' be stable.
Keep USB DP/DM traces length-matched to within 150 mil and 90-ohm differential impedance. Place the USB ESD protection (USBLC6-2SC6 or equivalent) within 3 mm of the USB connector. For I2S audio paths, route MCLK, BCLK, LRCLK, and data as a length-matched group (within 5 mm total skew) and isolate from switching nodes with GND guard traces. Reference: Microchip AN-1144 USB layout guidelines and SAM G53 family errata.
Estimated: at 3.3 V active load with DSP enabled, total quiescent plus dynamic current is about 25-40 mA. Use an LDO with at least 100 mA headroom and <10 uVrms noise (e.g. Microchip MCP1700) for VDDIN to avoid coupling switching noise into the ADC. If the design also uses a switching regulator upstream, place a ferrite bead + 10 uF cap on VDDIN to filter switching ripple. Sleep-mode current drops to <1 uA in Backup mode, but wake-up latency is ~1.5 ms - plan RTC tick handling accordingly.
Compliance Information
RoHS and REACH compliance declared by Microchip for the SAM G53 family. Not AEC-Q100 qualified - this is a commercial/industrial grade part. For automotive designs, choose ATSAM3X or ATSAMV71 AEC-Q100 qualified families.
