CYBLE-012011-00 - BLE v4.1 Module, PSoC 4, 128KB Flash | Infineon
MPN: CYBLE-012011-00 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $15.89 | $15.89 |
| 10 | $14.3 | $143.00 |
| 100 | $12.71 | $1,271.00 |
| 500 | $11.45 | $5,725.00 |
| 1,000 | $10.2 | $10,200.00 |
CYBLE-012011-00 Overview
A Bluetooth Low Energy (BLE) module is a pre-engineered radio subsystem that bundles the transceiver IC, antenna, matching network, crystal oscillators, and required passive components into a single certified PCB module. By offloading the RF section, BLE modules let product teams focus on firmware, sensors, and application logic rather than impedance matching, shielding, and regulatory pre-compliance testing. Within the broader taxonomy, a BLE module sits above a bare BLE transceiver IC and below a fully integrated SoC-based product; it is part of the wireless module family within RF & Wireless and is closely related to other AIROC and EZ-BLE module families from Infineon/Cypress.
Key features of the CYBLE-012011-00 include a low deep-sleep current of 60 nA (with GPIO or XRES wakeup), programmable output power up to +9 dBm, and receive sensitivity of approximately -92 dBm in standard BLE mode. The onboard PSoC 4 BLE supports Cypress/PSoC Creator and ModusToolbox IDEs with a complete BLE Component and profile library. Integrated shield and regulatory certifications (FCC, IC, CE, MIC) eliminate the need for end-product RF testing for most regions.
The CYBLE-012011-00 shares its module pin footprint and PSoC 4 BLE silicon datasheet with the uncertified CYBLE-012012-10 variant; the 012012-10 omits the RF shield and Bluetooth SIG listing, exposing the same GPIOs and pinout, making it a drop-in footprint alternative for prototypes that will go through self-certification. The host interface uses standard UART, SPI, or I2C, and the module runs from a single 1.8 V to 5.5 V supply rail.
Typical applications include wireless sensor nodes for industrial IoT, BLE beacons for retail and asset tracking, fitness and medical wearables, smart-home hubs, remote controls, and HID peripherals such as mice, keyboards, and stylus devices. The 23 GPIOs and analog peripherals also support direct sensor readout without an external MCU. When replacing bare-chip designs with a module, expect to save 6-9 months of PCB iteration and regulatory certification effort, and budget approximately 200 mm² of host-board keep-out area for the antenna pattern.
Drop-in alternatives for CYBLE-012011-00 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
CYBLE-012012-10
✅ Drop-In📋 Reference alternative (not in catalog)
CYBLE-013025-00
✅ Drop-In📋 Reference alternative (not in catalog)
CYBLE-222005-00
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
CYBLE-013030-00
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
CYBLE-413055-02
✅ Drop-In📋 Reference alternative (not in catalog)
CYBLE-012011-00 Specifications (manufacturer-published)
| Module Type | Bluetooth Low Energy (BLE) Transceiver Module |
| Bluetooth Version | v4.1 (BLE stack supports Bluetooth 5.1 features with current firmware) |
| Operating Frequency | 2.4 GHz to 2.48 GHz (ISM band) |
| Integrated Component | Cypress/Infineon PSoC 4 BLE (ARM Cortex-M0) |
| Flash Memory | 128 KB |
| SRAM | 16 KB |
| Number of GPIOs | 23 |
| Antenna | Integrated PCB trace antenna |
| Receive Sensitivity | approximately -92 dBm (typical BLE mode) |
| Supply Voltage | 1.8 V to 5.5 V |
| Deep Sleep Current | 60 nA (GPIO or XRES wakeup) |
| Operating Temperature | -40 C to +85 C |
| Modulation | GFSK (Gaussian Frequency Shift Keying) |
| Host Interface | UART / SPI / I2C |
| Regulatory Certifications | FCC, IC, CE, MIC, Bluetooth SIG |
| Package / Mounting | Surface-mount module with integrated antenna |
| RoHS Status | Compliant |
CYBLE-012011-00 Interfaces & Connectors
CYBLE-012011-00 exposes the following interfaces and connectors as published by the manufacturer: Bluetooth, Power Input. Expansion header pinout, connector pin numbering, and electrical limits are defined in the manufacturer documentation.
| Bluetooth | v4.1 (BLE stack supports Bluetooth 5.1 features with current firmware) |
| Power Input | 1.8 V to 5.5 V |
Refer to the manufacturer documentation for the full expansion header pinout and connector pin numbering.
Power & Thermal Characteristics
| Power Input | 1.8 V to 5.5 V |
| Operating Temperature | -40 C to +85 C |
Power input and thermal parameters for CYBLE-012011-00 as published by the manufacturer.
Typical Applications
CYBLE-012011-00 is suitable for 7 applications: Industrial IoT Wireless Sensor Nodes, BLE Beacons and Asset Tracking, Wearable Fitness and Medical Devices, Smart Home Hubs and Bridges, Remote Controls and HID Peripherals, Medical and Healthcare Monitoring, Industrial Automation and Lighting Controls.
Industrial IoT Wireless Sensor Nodes
The CYBLE-012011-00's 60 nA deep-sleep current and ARM Cortex-M0 with CapSense-capable GPIOs make it well-suited for battery-powered industrial sensor nodes that report temperature, vibration, or pressure over BLE advertisements. Its 128 KB flash is ample for sensor fusion and over-the-air firmware updates; the 23 GPIOs let the same module drive analog front-ends, interrupt lines, and a UART to an external sensor hub. Pre-certified FCC/IC/CE/MIC compliance shortens industrial product launches by avoiding per-region RF retesting.
Recommended
BLE Beacons and Asset Tracking
The CYBLE-012011-00's small footprint and integrated trace antenna are well matched to coin-cell-powered BLE beacons for retail proximity marketing and indoor asset tracking. With approximately -92 dBm receive sensitivity and configurable TX power up to +9 dBm (verify in datasheet), the module achieves 30-50 m line-of-sight link budget typical for BLE 1M PHY, and the BLE 5 long-range PHY in current firmware extends range further. Low deep-sleep current and programmable advertisement intervals yield 2-3 year battery life on a CR2032 cell.
Recommended
Wearable Fitness and Medical Devices
Wearable fitness bands, hearable accessories, and low-power medical wearables pair well with the CYBLE-012011-00 thanks to its sub-microamp deep-sleep and integrated ADC channels for direct sensor readout (heart rate, SpO2, motion). The 23 GPIOs interface to I2C sensors (e.g., accelerometers, PPG sensors) without an external host MCU. Pre-certified FCC/IC/CE/MIC and Bluetooth SIG qualification reduces regulatory burden for medical wearables that target multiple geographies on a single SKU.
Recommended
Smart Home Hubs and Bridges
The CYBLE-012011-00 provides pre-certified BLE connectivity for smart-home hubs, light switches, door locks, and bridges that connect Zigbee or Wi-Fi networks to BLE peripherals. The 128 KB flash is enough for vendor-specific mesh support, vendor-provisioning flows, and OTA update staging. Up to 23 GPIOs drive triac/relay controls, button inputs, and indicator LEDs directly; CapSense replaces mechanical buttons on most switch designs.
Recommended
Remote Controls and HID Peripherals
Voice remote controls, presentation clickers, mice, keyboards, and stylus devices benefit from the CYBLE-012011-00's low latency, integrated CapSense, and ability to wake from a mechanical keypress into a BLE connection within milliseconds. The chip's low deep-sleep current and ability to run directly from coin cells keeps remote-control BOM cost low. The royalty-free stack supports HID-over-GATT and consumer-control profiles out of the box.
Recommended
Medical and Healthcare Monitoring
Connected glucose meters, pulse oximeters, and continuous monitoring patches use the CYBLE-012011-00 as a drop-in pre-certified BLE radio that interfaces with hospital gateways and consumer smartphones. The 23 GPIOs route to ADC inputs for analog sensor front-ends (e.g., optical PPG), and the integrated crystal plus regulator design eliminates an external LDO. Infineon's documentation suite and CE/FCC pre-certification help healthcare OEMs reach ISO 13485 review boards faster.
Recommended
Industrial Automation and Lighting Controls
Bluetooth Mesh-enabled luminaires, occupancy sensors, and building-automation bridges pair well with the CYBLE-012011-00 thanks to its GPIO-controlled PWM outputs for LED drivers and 60 nA deep-sleep for always-on battery installations. The module's runtime is firmware-defined to support vendor Mesh or proprietary control stacks; the 128 KB flash accomodates mesh provisioning and on-board lighting logic without an external MCU.
Recommended
Recommended Products Summary
Engineering reference data for CYBLE-012011-00 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | CYBLE-012012-10 | CYBLE-013025-00 | CYBLE-222005-00 | CYBLE-013030-00 | CYBLE-413055-02 |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package / Footprint | EZ-BLE module, trace antenna | EZ-BLE module (no shield) | EZ-BLE module | EZ-BLE module, compact height | EZ-BLE module | AIROC module |
| BLE Version | v4.1 (BLE stack 5.1 features) | v4.1 (BLE stack 5.1 features) | v5.0 | v4.2 | v5.0 | v5.2 |
| Flash / SRAM | 128 KB / 16 KB | 128 KB / 16 KB | 128 KB / 16 KB | 128 KB / 16 KB | 256 KB / 32 KB | 256 KB / 64 KB |
| GPIOs | 23 | 23 | 23 | 16 | 26 | 32 |
| Regulatory Certified | Yes (FCC/IC/CE/MIC/SIG) | No (uncertified) | Yes | Yes | Yes | Yes |
| Deep-Sleep Current | 60 nA | 60 nA | 40 nA | 60 nA | 40 nA | 30 nA |
| Approx. Unit Price (USD, qty 1) | $15.89 | $13.10 | $12.40 | $11.85 | $14.50 | $17.20 |
Key Differentiators
- Fully certified vs uncertified variant (vs CYBLE-012012-10)
- Lower deep-sleep current than newer modules (vs CYBLE-413055-02)
- Single SKU spanning consumer and industrial (vs CYBLE-013025-00)
Design Notes
Provide a continuous GND pour under and around the module, with no copper traces or components inside the antenna keep-out area specified in the Infineon module datasheet. The trace antenna radiates best with at least 5 mm of clearance from the module edge to ground/other metal. Place the module at the corner of the host PCB with the antenna edge facing the outside of the enclosure, or the antenna efficiency will drop 6-10 dB.
Add a 10 uF ceramic decoupling capacitor close to the module's VDD pin and a separate 0.1 uF capacitor for high-frequency noise bypass. Wire both capacitors with short traces directly back to the adjacent GND pin. Estimated: at TX peak current (transient up to ~25 mA depending on TX power) the regulator needs to maintain <50 mV sag to avoid BLE link loss - a low-ESR 10 uF MLCC is recommended.
Do not route digital signal traces (UART, SPI, I2C) underneath the antenna region. Avoid placing the module near switching DC-DC converters or high-current traces - radiated harmonics can desensitize the receiver by 5-10 dB. Confirm the final enclosure material is plastic or another RF-friendly material; metal enclosures require a dedicated antenna aperture or an external antenna variant. Always re-run radio regulatory pre-scan if the host PCB layout changes after initial certification.
Compliance Information
RoHS and REACH compliant per Infineon/Cypress material declaration. Pre-certified to FCC, IC, CE, MIC, and Bluetooth SIG. Not AEC-Q100 qualified; for automotive BLE modules consider other members of the Infineon AIROC family.
