DSPIC30F2012-20E/ML - 16-bit DSC 20 MIPS 12KB Flash QFN-28 | Microchip
MPN: DSPIC30F2012-20E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.89 | $5.89 |
| 10 | $5.42 | $54.20 |
| 100 | $4.85 | $485.00 |
| 500 | $4.36 | $2,180.00 |
| 1,000 | $3.92 | $3,920.00 |
DSPIC30F2012-20E/ML Overview
A digital signal controller combines the compute capability of a digital signal processor with the peripheral set and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits between general-purpose MCUs and dedicated DSPs: it executes real-time control loops, filters, and transform math while retaining on-chip flash, GPIO, and communication peripherals. The dsPIC30F family from Microchip pioneered this combined 16-bit MCU/DSP architecture.
Key features of the DSPIC30F2012-20E/ML include a modified Harvard 16-bit core with DSP engine (barrel shifter, 17-bit x 17-bit multiplier, 40-bit accumulator), 20 MIPS execution at 3.3V to 5V supply, and the -20E speed/temperature grade supporting extended operation down to -40C. The 24-bit instruction word width matches the dsPIC30F family standard, and the device is supported by the MPLAB XC-DSC C/C++ compiler.
Technically, the dsPIC30F core uses a modified Harvard architecture with separate program and data buses and multiple internal bus pathways, enabling single-cycle MAC operations essential for digital filtering and motor-control algorithms. The 40MHz-class internal clocking yields the rated 20 MIPS throughput.
Typical applications include sensorless and sensored motor control (BLDC, PMSM, AC induction), digital power conversion, and embedded industrial control requiring DSP-class math in a small 6x6 mm QFN footprint.
Design consideration: the exposed pad on the 28-QFN should be soldered to a grounded copper pour for thermal and signal-integrity performance.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC30F2012-20E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC30F2012-20E/ML (same form factor and footprint) — differing in Package, Core Architecture, RoHS Status, Communication Interfaces, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC30F2012-20I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC30F2011T-20E/ML
✅ Drop-In✓ In Stock
$3.68 / Unit
View Datasheet →DSPIC30F3012-20E/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.42 / Unit
View Datasheet →DSPIC30F2012-20E/SO
✅ Drop-In✓ In Stock
$2.85 / Unit
View Datasheet →DSPIC30F2012-20E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC30F modified Harvard |
| Max CPU Speed | 20 MIPS |
| Clock Frequency | 40 MHz |
| Program Memory | 12 KB (4K x 24) Flash |
| Instruction Width | 24-bit |
| Supply Voltage Minimum | 3 V |
| DSP Engine | 17x17 multiplier, 40-bit accumulator, barrel shifter |
| Package | 28-QFN (6x6 mm) Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (E grade) |
| Minimum Supply at 15 MHz | 3 V |
| Technology | CMOS |
| Compiler Support | MPLAB XC-DSC C/C++ |
| Status | In Production |
DSPIC30F2012-20E/ML 28-qfn (6x6 mm) exposed pad Pin Configuration Guide
Pin configuration for DSPIC30F2012-20E/ML (28-qfn (6x6 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC30F2012-20E/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC30F2012-20E/ML is suitable for 6 applications: BLDC Motor Control, Digital Power Conversion, Sensor Signal Conditioning with DSP Filtering, Industrial Automation Nodes, Automotive Auxiliary Control, Consumer Appliance Control.
BLDC Motor Control
The DSPIC30F2012-20E/ML fits brushless DC motor control because its dsPIC30F DSP engine executes single-cycle 17x17 MAC operations for FOC and commutation math, while the 20 MIPS core closes current loops at typical 20 kHz PWM frequencies with ample margin. The DSC drives a three-phase inverter through its PWM outputs, sampling phase currents via the on-chip ADC and updating duty cycles each cycle. Placed on a compact 6x6 mm QFN-28 footprint, it replaces discrete MCU-plus-DSP solutions and reduces BOM cost; the trade-off is 12KB flash, sufficient for commutation plus basic protection but not for complex field-weakening tables.
Recommended
Digital Power Conversion
In digital switch-mode power supplies, the DSPIC30F2012-20E/ML implements voltage-mode or average-current-mode control loops in firmware. Its 16-bit core with 40-bit accumulator maintains numerical precision through the PID/filter chain without the truncation errors that plague 8-bit controllers, and 20 MIPS execution supports loop rates up to several hundred kHz on simpler topologies. The controller sequences soft-start, monitors feedback via ADC, and implements protection (overcurrent, overvoltage) faster than analog comparators alone. The extended -40C to +125C E grade suits industrial power stages; designers should budget flash carefully since compensation and protection code converge in the 12KB space.
Recommended
Sensor Signal Conditioning with DSP Filtering
The DSPIC30F2012-20E/ML conditions industrial sensor signals by combining ADC sampling with on-chip DSP filtering (FIR/IIR via the hardware multiplier and barrel shifter). A typical chain samples a bridge or current-sensor output, applies a 32-tap FIR for noise rejection, and transmits the result over UART or SPI. Compared with a general-purpose MCU plus external filter ICs, the DSC performs the math in silicon at 20 MIPS with deterministic cycle counts, important for real-time loops. The 28-QFN package keeps the signal chain compact near the sensor; the 12KB flash accommodates filters plus communication, though very long filter banks require code-size discipline.
Recommended
Industrial Automation Nodes
As an automation node controller, the DSPIC30F2012-20E/ML manages local I/O, sequences actuators, and executes control algorithms on a machine or cell floor. Its 16-bit core and 24-bit instruction width keep deterministic timing for sequential logic and PID regulation, while CMOS technology and low-power modes (3V operation at 15 MHz) suit nodes on shared 24V industrial supplies via a local regulator. The extended temperature grade survives panel and enclosure environments. Designers value the MPLAB XC-DSC C compiler for maintainable code and the small QFN footprint for dense I/O boards; serial links handle communication with higher-level PLCs or HMIs.
Recommended
Automotive Auxiliary Control
The DSPIC30F2012-20E/ML serves non-safety automotive auxiliary functions such as pump control, fan sequencing, and actuator positioning, where its -40C to +125C E grade and 20 MIPS DSP capability handle engine-bay and body electronics environments. The DSC runs sensorless motor algorithms with the hardware multiplier, monitors fault conditions through the ADC, and communicates over serial links to body controllers. Firmware executes from 12KB internal flash with no external memory, improving robustness against vibration-related connector failures. For safety-critical drives requiring functional-safety qualification, engineers should instead evaluate dedicated automotive-qualified parts and perform the required qualification analysis.
Recommended
Consumer Appliance Control
In appliances such as fans, pumps, blenders, and small compressors, the DSPIC30F2012-20E/ML provides sensorless motor commutation and user-interface sequencing in one 6x6 mm chip. The 20 MIPS core with DSP engine implements back-EMF commutation and speed ramps without external gate-control ICs, and the 12KB flash holds commutation, button handling, and fault protection concurrently. Low-power operation down to 3V simplifies standby-rail design, and the exposed-pad QFN dissipates inverter-interface heat into the PCB pour. Volume pricing near four dollars per unit at 1000 pieces as of 2026-09-20 keeps total control BOM cost low for cost-sensitive appliance designs.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC30F2012-20E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC30F2012-20I/ML | DSPIC30F2011T-20E/ML | DSPIC30F3012-20E/ML | DSPIC30F2012-20E/SO |
|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) Exposed Pad | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN ML family - verify footprint | 28-SOIC - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 20 MIPS | 20 MIPS | 20 MIPS | 20 MIPS | 20 MIPS |
| Temperature Grade | E (-40C to +125C) | I (industrial) | E (-40C to +125C) | E grade | E (-40C to +125C) |
| Core Architecture | dsPIC30F 16-bit with DSP engine | dsPIC30F 16-bit with DSP engine | dsPIC30F 16-bit with DSP engine | dsPIC30F 16-bit with DSP engine | dsPIC30F 16-bit with DSP engine |
| Package Pin Count | 28 | 28 | 28 | 28 | 28 |
| Supply Voltage | 3 V min (full range per datasheet) | 3 V min | 3 V min | 3 V min | 3 V min |
Key Differentiators
- Extended temperature grade for harsh environments (vs DSPIC30F2012-20I/ML)
- Cost-optimized 12KB entry point in the dsPIC30F family (vs DSPIC30F3012-20E/ML)
- Compact 6x6 mm QFN footprint vs SOIC version (vs DSPIC30F2012-20E/SO)
Design Notes
The 28-QFN (6x6 mm) exposed pad must be soldered to a grounded copper pour on the PCB. The exposed pad is not optional - it provides the primary thermal path and lowers ground impedance for the mixed-signal DSC. Use an array of thermal vias (typically 4-9, 0.3 mm diameter) connecting the pad to inner ground planes. Follow the Microchip QFN landing-pattern recommendation in the package outline drawing; inspect solder joint formation via X-ray on first-article builds since the pad is hidden beneath the package.
Decouple each VDD/VSS pin pair with 0.1uF ceramic capacitors placed within 2 mm of the pins, plus one bulk 4.7uF-10uF capacitor near the device. The dsPIC30F core draws supply ripple during flash execution and DSP MAC bursts; poor decoupling shows up as ADC noise and spurious resets. The device operates from a supply as low as 3V at 15 MHz, but full 20 MIPS operation requires the upper supply range - verify the exact VDD maximum in the electrical characteristics table of the manufacturer datasheet before finalizing the regulator selection.
Two frequent mistakes with this part: (1) assuming all 28-QFN dsPIC30F2012 ordering suffixes are interchangeable - the -20E and -20I suffixes denote different temperature grades, so qualify the correct grade for your ambient; (2) exceeding 12KB flash with debug-heap-enabled code - the XC-DSC compiler in release mode typically compiles well within 4K x 24 instructions, but library-heavy code may overflow. Enable the linker map review in MPLAB and size the firmware early. Also remember the -E grade's 125C maximum requires derating of nearby passives.
Compliance Information
Compliance status not stated in the retrieved web data; modern Microchip dsPIC30F parts are generally RoHS-compliant but this must be confirmed on the official Microchip product page or datasheet before use.
