DSPIC30F2011T-20I/ML - 16-bit 20MIPS DSC 12KB Flash | Microchip
MPN: DSPIC30F2011T-20I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $4.95 | $495.00 |
| 500 | $4.42 | $2,210.00 |
| 1,000 | $3.96 | $3,960.00 |
DSPIC30F2011T-20I/ML Overview
A digital signal controller combines the control peripherals of a microcontroller with the computational throughput of a DSP core, sitting in the system hierarchy between a general-purpose MCU and a dedicated digital signal processor. The dsPIC30F Sensor Family from Microchip targets cost-sensitive sensing and embedded control nodes, and offers seamless migration paths to dsPIC33F, PIC24H, or PIC24F devices in similar packages.
Key features of this device include the 16-bit dsPIC core executing up to 20 MIPS, 12KB of self-programmable FLASH program memory organized as 4K x 24-bit instruction words, 1KB of on-chip SRAM, and 21 I/O lines available to the designer. The industrial temperature rating (-40C to +85C, denoted by the I suffix in the ordering code) qualifies the part for factory-floor environments.
The QFN-28 package measures 6 x 6 mm with a 0.90 mm profile, providing a compact leadless footprint with an exposed thermal pad that improves heat dissipation and simplifies PCB layout for space-constrained designs. The 4.5V to 5.5V supply range makes the device directly compatible with 5V industrial logic levels and noisy power buses, improving noise margins in electrically harsh environments.
Typical applications include sensor signal acquisition and conditioning nodes, digital switch-mode power supply control, industrial automation I/O, and portable instrumentation. The DSP engine accelerates filtering and transform computations that a conventional 8-bit or 16-bit MCU would execute too slowly.
When designing with this device, budget the 5V rail early in the schematic, since the part does not operate at 3.3V, and use the exposed pad as the primary ground connection for thermal and signal-integrity reasons.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC30F2011T-20I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC30F2011T-20I/ML (same form factor and footprint) — differing in Package, Core Architecture, Migration Path, Operating Temperature, Program Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC30F2011T-20E/ML
✅ Drop-In✓ In Stock
$3.68 / Unit
View Datasheet →DSPIC30F2011T-30I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC30F2010T-30I/MM
✅ Drop-In✓ In Stock
$3.92 / Unit
View Datasheet →DSPIC30F2010T-20E/MM
✅ Drop-In✓ In Stock
$3.98 / Unit
View Datasheet →DSPIC30F2011T-20I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC30F (DSP + MCU) |
| Maximum Execution Speed | 20 MIPS |
| Program Memory | 12KB FLASH (4K x 24-bit) |
| RAM | 1KB |
| Supply Voltage | 4.5 V to 5.5 V |
| I/O Ports | 21 |
| Package | QFN-28, 6 x 6 mm, 0.90 mm height |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial) |
| Family | dsPIC30F Sensor Family |
| Program Memory Type | Flash |
| Lifecycle Stage | ACTIVE |
| Tape & Reel Variant | Yes (T suffix) |
| Migration Path | dsPIC33F, PIC24H, PIC24F in similar packages |
DSPIC30F2011T-20I/ML qfn-28, 6 x 6 mm, 0.90 mm height Pin Configuration Guide
Pin configuration for DSPIC30F2011T-20I/ML (qfn-28, 6 x 6 mm, 0.90 mm height package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC30F2011T-20I/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC30F2011T-20I/ML is suitable for 6 applications: Sensor Signal Acquisition Nodes, Digital Switch-Mode Power Supply Control, Industrial Automation and Control I/O, Portable and Battery-Powered Instrumentation, Motor Drive Auxiliary Control, Smart Building and HVAC Sensing.
Sensor Signal Acquisition Nodes
The DSPIC30F2011T-20I/ML was designed specifically for sensing tasks as part of Microchip's dsPIC30F Sensor Family. Its 16-bit DSP core at 20 MIPS executes digital filtering, offset correction, and scaling algorithms in real time on raw sensor streams, while the 21 I/O lines interface switches, encoders, and digital sensors without glue logic. The 4.5V to 5.5V supply range is a decisive advantage here: sensor cabling in industrial cabinets picks up motor and relay noise, and 5V logic preserves a wide noise margin that 3.3V controllers cannot. With 12KB of FLASH and 1KB of RAM, a complete acquisition-plus-communication firmware fits on-chip, and the industrial -40C to +85C rating covers unconditioned factory environments. If sensor channel counts or algorithm complexity grow, Microchip documents seamless migration to dsPIC33F or PIC24H devices in similar packages, protecting the firmware investment.
Recommended
Digital Switch-Mode Power Supply Control
Microchip positions the dsPIC30F2011/2012 family as 28/44-pin high-performance switch-mode power supply digital signal controllers, and this MPN is a natural fit for digitally controlled SMPS stages. At 20 MIPS, the 16-bit DSP core executes the control-loop arithmetic for buck, boost, or flyback converters at switching frequencies practical for 5V-class industrial supplies, with cycle-by-cycle decisions that analog controllers cannot adapt dynamically. The QFN-28 package keeps the controller physically close to the power stage, shortening gate-drive and feedback traces - important for EMI in a 5V-noisy environment. Firmware-controlled compensation lets one PCB serve multiple output-voltage variants, cutting BOM proliferation. Designers who need higher speed for harder-switching topologies can drop in the DSPIC30F2011T-30I/ML (30 MIPS) on the identical footprint, or step to the DSPIC30F2010 SMPS-focused variant without a layout change.
Recommended
Industrial Automation and Control I/O
In factory automation, the DSPIC30F2011T-20I/ML serves as an intelligent node handling limit switches, actuators, and small sensor arrays. The 21 I/O lines provide enough parallel connectivity for typical machine I/O clusters, and native 5V operation eliminates level-shifters when talking to legacy 24V-buffered industrial logic through standard conditioning stages. The -40C to +85C industrial rating and active lifecycle status make it safe to design into long-life equipment, while the 12KB FLASH program space holds control state machines plus a simple serial protocol. The 16-bit core with DSP capability can run vibration or current-signature monitoring routines locally - a predictive-maintenance feature that 8-bit MCUs struggle to deliver at 20 MIPS. Field firmware updates are supported by the self-programmable FLASH, enabling remote feature upgrades across an installed machine base.
Recommended
Portable and Battery-Powered Instrumentation
Handheld measurement instruments benefit from the compact 6 x 6 mm QFN-28 package with 0.90 mm profile, which lets the DSPIC30F2011T-20I/ML fit on dense double-sided boards inside handheld enclosures. The 16-bit DSP engine computes RMS, FFT, and averaging on measured signals at 20 MIPS - performance that turns raw ADC samples into engineering units in real time. The single 5V supply simplifies battery-pack power design using common 4-cell or 5V boost architectures. With 12KB FLASH and 1KB RAM, menus, calibration tables, and a serial or display driver all fit on-chip without external memory, reducing BOM count and assembly cost for portable products. The industrial temperature rating also allows these instruments to be used outdoors in winter conditions without derating, and the exposed-pad QFN aids thermal management in sealed enclosures with no fan.
Recommended
Motor Drive Auxiliary Control
Although the sister part dsPIC30F2010 carries the dedicated motor-control peripheral emphasis within the family, the DSPIC30F2011T-20I/ML is well suited to supervisory roles in small motor-drive systems: sequencing contactors, monitoring bus current and temperature sensors, and running the operator interface. Its 20 MIPS 16-bit core handles the state machines and safety interlocks around a power stage, while 5V I/O communicates directly with opto-isolated gate-driver boards common in industrial drives. The 1KB RAM suffices for fault logs and rolling sensor statistics used in drive diagnostics. Where the drive needs on-chip motor PWM, designers can reuse the same PCB layout with the DSPIC30F2010 in the same QFN-28 footprint, giving a two-tier product family from one layout: a supervisory SKU and a full motor-control SKU - a significant cost and qualification advantage.
Recommended
Smart Building and HVAC Sensing
Building controllers and HVAC sensing heads are classic dsPIC30F Sensor Family applications. The DSPIC30F2011T-20I/ML reads temperature, pressure, and humidity sensors, executes linearization and filtering at 20 MIPS on its 16-bit core, and drives dampers, valves, or fan controls through its 21 I/O lines. Operation on a 5V rail matches the long cable runs and electrically noisy compressor environments of rooftop units, where 3.3V controllers suffer spurious resets. The -40C to +85C range covers unconditioned attic and mechanical-room installations. The 12KB FLASH holds full PID loops plus a simple communication routine, and firmware updates can be pushed via the self-programmable FLASH across a building's installed base. If the product later needs more memory or lower power, Microchip documents seamless migration to PIC24F devices in similar packages, extending the platform roadmap without a board redesign.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC30F2011T-20I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC30F2011T-20E/ML | DSPIC30F2011T-30I/ML | DSPIC30F2010T-30I/MM | DSPIC30F2010T-20E/MM |
|---|---|---|---|---|---|
| Package | QFN-28 (6x6 mm) | QFN-28 (6x6 mm) - same | QFN-28 (6x6 mm) - same | QFN-28 (6x6 mm) - same | QFN-28 (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Architecture | 16-bit dsPIC30F | 16-bit dsPIC30F | 16-bit dsPIC30F | 16-bit dsPIC30F | 16-bit dsPIC30F |
| Max Speed | 20 MIPS | 20 MIPS | 30 MIPS | 30 MIPS | 20 MIPS |
| Program Memory | 12KB (4K x 24) FLASH | 12KB (4K x 24) FLASH | 12KB (4K x 24) FLASH | 12KB (4K x 24) FLASH | 12KB (4K x 24) FLASH |
| RAM | 1KB | 1KB | 1KB | 1KB | 1KB |
| Supply Voltage | 4.5V to 5.5V | 4.5V to 5.5V | 4.5V to 5.5V | 4.5V to 5.5V | 4.5V to 5.5V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| Peripheral Emphasis | Sensor Family general-purpose DSC | Sensor Family (same die) | Sensor Family (same die) | SMPS/motor-control oriented | SMPS/motor-control oriented |
Key Differentiators
- 5V-native noise margin in a 16-bit DSP core (vs DSPIC30F2011T-30I/ML)
- Same die with extended temperature option (vs DSPIC30F2011T-20E/ML)
- One footprint, two product tiers (vs DSPIC30F2010T-30I/MM)
Design Notes
The DSPIC30F2011T-20I/ML operates only from a 4.5V to 5.5V supply - it is not a 3.3V device. Design the power tree around a regulated 5.0V rail with at least +/-10% tolerance margin, and add a local 100 nF ceramic decoupling capacitor at each VDD pin plus a bulk 4.7 uF to 10 uF capacitor near the QFN. If the board also hosts 3.3V peripherals, plan level shifting on all bidirectional lines early in the schematic rather than as a late fix, since 5V push-pull outputs will overdrive 3.3V inputs.
The QFN-28 (6 x 6 mm) package dissipates heat primarily through its exposed pad, not the perimeter leads. Connect the exposed pad to a solid ground plane using a 3x3 or larger via array directly under the part, and define the land pattern per the Microchip package outline drawing in the dsPIC30F2011 datasheet. Keep the oscillator (OSC1/OSC2) traces as short as possible and guard them with ground. Verify your assembly house supports leadless QFN paste-in-pad printing to avoid solder voiding under the pad.
Watch the ordering-code suffixes when purchasing: T = tape and reel, I = industrial -40C to +85C, E = extended -40C to +125C. A DSPIC30F2011T-20E/ML is a valid drop-in but a different temperature grade; conversely the SOIC variants (e.g., DSPIC30F2011T-20E/SO) share the die but NOT the QFN footprint. Also verify flash programming-tool support: the dsPIC30F family uses the older programming protocol, so confirm your programmer and compiler license cover dsPIC30F before committing to the family for new designs.
With 21 I/O lines packed into a 6 x 6 mm QFN-28, fan-out density is high. Escape traces at 0.2 mm width with vias placed immediately after pad escapes to reach inner routing layers; do not route power traces under the exposed pad region. Group analog sensor inputs on one side of the package away from switching or clock traces to keep the 16-bit DSP's sampling free of crosstalk, and reserve one ground via per group of three to four I/O escape vias for return-current paths.
Compliance Information
Compliance status was not stated in the captured distributor snippets for this exact MPN. Verify RoHS/REACH/lead-free certificates on the official Microchip product page before use in RoHS-mandated products.
