DSPIC33CK256MP606-I/MR - 100MHz DSC, 256KB Flash, CAN FD | Microchip
MPN: DSPIC33CK256MP606-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.48 | $6.48 |
| 10 | $5.92 | $59.20 |
| 100 | $5.36 | $536.00 |
| 500 | $4.85 | $2,425.00 |
| 1,000 | $4.42 | $4,420.00 |
DSPIC33CK256MP606-I/MR Overview
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and deterministic control of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC such as the dsPIC33CK256MP606 sits above general-purpose MCUs for math-intensive closed-loop tasks, making it the central processing element in digital power conversion and precision motor control systems.
Key differentiating features include 100 MIPS (100 MHz) single-core execution, CAN flexible data-rate (CAN FD) for in-vehicle and industrial networking, on-chip operational amplifiers for current sensing, 12-bit ADCs for high-resolution analog feedback, and high-resolution PWM peripherals optimized for switching power stages. Dual-partition flash enables live firmware update and functional-safety boot strategies.
Architecturally, the dsPIC33CK core integrates DSP multiply-accumulate instructions, hardware divide support, and deterministic interrupt latency, while the enhanced peripherals (op-amps, comparators, high-speed ADC with multiple sample-and-hold channels) offload analog front-end functions that would otherwise require external components. The functional-safety variant designation supports designs targeting safety-relevant industrial and automotive-adjacent applications.
Typical applications include precision motor control (FOC for BLDC/PMSM drives), digital power supplies (totem-pole PFC, LLC converters), automotive and industrial CAN FD nodes, and sensor fusion or digital filtering tasks. The op-amps and 12-bit ADCs make it especially compact for single-chip servo and inverter designs.
A key design consideration: at 100 MHz the device requires careful power-supply decoupling and PCB layout per Microchip layout guidelines; also verify that the MP606 peripheral set (including op-amps) matches your requirements versus the MP506 variants before footprint reuse.
This page synthesizes distributor pricing tiers, drop-in family alternatives, design notes, and comparison data not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK256MP606-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK256MP606-E/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK128MP606-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK64MP606-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK256MP506-I/MR
✅ Drop-In✓ In Stock
$2.3 / Unit
View Datasheet →DSPIC33CK256MP606-I/MR Maximum Ratings & Electrical Characteristics
| Core | dsPIC33CK 16-bit DSC, single core |
| CPU Speed | 100 MHz (100 MIPS) |
| Program Memory (Flash) | 256 KB (256K x 8), dual partition |
| RAM | 64 KB |
| CAN Interface | CAN FD |
| ADC Resolution | 12-bit |
| On-chip Op-Amps | Yes |
| PWM | High-resolution PWM |
| Package | 64-QFN (9x9 mm), HVQCCN |
| Mounting Type | Surface Mount |
| Terminal Count | 64 |
| Maximum Seated Height | 1 mm |
| Package Shape | Square |
| Operating Temperature | -40C to +85C (I grade) |
| Family Designation | dsPIC33CK Functional Safety (FuSa) |
DSPIC33CK256MP606-I/MR square Pin Configuration Guide
Pin configuration for DSPIC33CK256MP606-I/MR (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK256MP606-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK256MP606-I/MR is suitable for 6 applications: Precision Motor Control (FOC), Digital Power Conversion, Automotive CAN FD Nodes, Industrial Automation and PLC I/O, Battery Management and Charging Systems, Test, Measurement and Signal Processing.
Precision Motor Control (FOC)
The DSPIC33CK256MP606-I/MR is purpose-built for field-oriented control (FOC) of BLDC and PMSM motors: the 100 MHz / 100 MIPS dsPIC33CK core executes the Park/Clarke transforms and PI current loops with DSP multiply-accumulate throughput, while the integrated op-amps amplify shunt phase currents directly into the 12-bit ADCs, removing external amplifier ICs from the BOM. High-resolution PWM peripherals generate the complementary gate signals with fine duty-cycle granularity, minimizing current ripple at high switching frequencies. In a typical topology the DSC reads three phase currents each PWM cycle, computes the FOC loop deterministically, and drives the inverter - achieving current-loop bandwidths in the kHz range. The dual-partition flash also enables field firmware updates on deployed drives. Consideration: at high PWM frequencies, ADC sample timing must be synchronized to the PWM period per Microchip motor-control reference designs.
Recommended
Digital Power Conversion
For totem-pole PFC, LLC and synchronous buck converters, the DSPIC33CK256MP606-I/MR supplies the deterministic control engine: the 100 MIPS core closes voltage and current loops at hundreds of kHz, the high-resolution PWM provides sub-nanosecond-class duty resolution for phase-shift and LLC topologies, and the 12-bit ADCs sample output voltage and inductor current with on-chip op-amp gain for shunt sensors. Because the DSC implements control law in firmware, compensation parameters can be tuned or updated in the field - an advantage over fixed analog controllers. CAN FD also allows the converter to report telemetry on industrial buses. Trade-off to manage: firmware latency must fit within the switching period, so use the hardware PWM special events to trigger ADC sampling precisely. Microchip's digital power reference designs target this exact dsPIC33CK peripheral combination.
Recommended
Automotive CAN FD Nodes
The integrated CAN FD controller makes the DSPIC33CK256MP606-I/MR a strong candidate for automotive and industrial networked nodes that also need local real-time control - such as pump controllers, actuator drivers and sensor fusion units. CAN FD raises payload to 64 bytes and supports higher arbitration-free data rates than classical CAN, which the dsPIC33CK handles with hardware message RAM. Combined with the 100 MHz core and 256KB dual-partition flash, the device can run a local control loop (for example, brushed-DC servo or valve positioning) while sustaining full CAN FD network traffic. Use a CAN FD transceiver such as the MCP2558 at the physical layer, and apply the dual-partition flash for failsafe firmware updates in the vehicle. Temperature grade should be selected (I vs E suffix) according to the mounting environment.
Recommended
Industrial Automation and PLC I/O
In industrial automation, the DSPIC33CK256MP606-I/MR serves as an intelligent I/O or small motion controller: its 64-pin package delivers generous peripheral I/O, the 12-bit ADCs and op-amps digitize 4-20 mA or ratiometric sensor signals, and the high-resolution PWM drives actuators or stepper/servo stages. The 100 MIPS DSP core applies digital filtering (IIR/FIR) to noisy sensor data without CPU-starving the supervisory task. Dual-partition flash supports rugged field updates in equipment that must not go offline, and CAN FD integrates the node into machine networks. For noise-heavy factory environments, follow Microchip's layout guidance: separate analog ground for the ADC/op-amp domain, and use differential routing for remote sensor signals. The functional-safety family designation further supports safety-relevant machinery designs.
Recommended
Battery Management and Charging Systems
Battery chargers and battery-management front-ends benefit from the DSPIC33CK256MP606-I/MR's combination of high-resolution PWM (precise charge-current regulation), 12-bit ADC with op-amp front-end (cell voltage and shunt-current acquisition), and CAN FD (communication with vehicle or inverter BMS masters). The 100 MHz core executes coulomb counting, CC/CV charge state machines and balancing algorithms concurrently. In an onboard charger power stage, the DSC controls the PFC and DC-DC stages with firmware-adjustable compensation, while CAN FD reports state-of-charge and fault telemetry. The dual-partition flash allows certified firmware to be updated in the field without bricking the charger. Design consideration: synchronize ADC sampling to the switching waveform to avoid averaging ripple into the control loop, and validate the temperature-grade selection against the enclosure environment.
Recommended
Test, Measurement and Signal Processing
The DSP block set of the DSPIC33CK256MP606-I/MR - multiply-accumulate, hardware divide and fast interrupt context switching - makes it suitable for embedded measurement instruments: digital filtering of sensor streams, FFT-based spectral analysis, and precision timing generation via the high-resolution PWM. The 12-bit ADCs with integrated op-amp gain stage condition transducer signals directly, and the 64KB RAM buffers acquisition windows for block processing. CAN FD or UART/SPI links stream results to a host, while the deterministic 100 MHz core guarantees sample-rate accuracy. In handheld or bench instruments, the dual-partition flash supports feature firmware updates post-deployment. Trade-off: the 12-bit ADC is adequate for most instrumentation front-ends, but higher-resolution applications may pair the DSC with an external delta-sigma ADC over SPI for sub-ppm measurements.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK256MP606-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK256MP606-E/MR | DSPIC33CK128MP606-I/MR | DSPIC33CK64MP606-I/MR | DSPIC33CK256MP506-I/MR |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm, MR) | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) |
| Flash Memory | 256 KB dual partition | 256 KB dual partition | 128 KB dual partition | 64 KB dual partition | 256 KB dual partition |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| CAN FD | Yes | Yes | Yes | Yes | Yes |
| On-chip Op-Amps | Yes | Yes | Yes | Yes | No |
| Temperature Grade | Industrial (I): -40C to +85C | Extended (E) | Industrial (I) | Industrial (I) | Industrial (I) |
Key Differentiators
- On-chip operational amplifiers (vs DSPIC33CK256MP506-I/MR)
- Largest flash option in the pin-compatible 64-pin MP-series (vs DSPIC33CK128MP606-I/MR)
- Extended-temperature drop-in upgrade (vs DSPIC33CK256MP606-E/MR)
Design Notes
At 100 MHz core frequency, provide clean VDD with a decoupling network per Microchip layout guidelines: place a 0.1 uF ceramic capacitor at each VDD pin pair plus at least one bulk 10 uF capacitor near the package. The 64-QFN exposes a center ground pad (epad) that must be soldered to aVia-stitched ground plane - it is the primary ground and thermal path. Estimated: a design dissipating on the order of 200-300 mW (100 MHz core active) sees only a few degrees C junction rise with a solid ground pour, but verify against the datasheet thermal table for your exact operating profile.
Separate the analog domain (op-amp outputs, ADC reference, VDDA) from the digital/pwm switching domain on the PCB. Route high-resolution PWM outputs away from op-amp input traces; motor-control shunt signals should be routed differentially to the op-amp inputs. Microchip's dsPIC33CK motor-control reference designs show the recommended placement: shunt amplification within centimeters of the DSC, gate-driver connections short and direct, and the crystal/oscillator loop kept clear of PWM return currents. Keep the CAN FD transceiver close to the MR package CAN pins with a local 0.1 uF decoupler.
Three frequent integration mistakes: (1) forgetting the exposed pad connection - an unsoldered epad causes erratic ground reference and brownouts at 100 MHz; (2) using the MP506 footprint believing full pin compatibility with the MP606 - the op-amp pins differ functionally, so firmware and analog routing must be re-verified; (3) ignoring dual-partition flash configuration - a device intended for live-update must have partitions configured in the configuration words, otherwise the boot/update scheme silently fails. Always validate against the latest Microchip datasheet and errata sheet before tape-out.
Compliance Information
Compliance data not explicitly stated in the provided web data; the part is described as functional-safety (FuSa) family by Microchip. Verify RoHS/REACH status on the Microchip product page.
