DSPIC33CK32MP502-I/2N - 100MHz 16-bit DSC CAN-FD | Microchip
MPN: DSPIC33CK32MP502-I/2N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.36 | $336.00 |
| 500 | $3.02 | $1,510.00 |
| 1,000 | $2.71 | $2,710.00 |
DSPIC33CK32MP502-I/2N Overview
A digital signal controller combines the computational capability of a digital signal processor (DSP) with the control peripherals of a microcontroller (MCU). Within the power-management hierarchy, the dsPIC33CK family sits above basic MCUs and below multi-core SoCs, targeting real-time closed-loop control. The Modified Harvard architecture executes from flash while a dedicated DSP engine handles multiply-accumulate operations for control-loop mathematics.
Key features include operation from DC to 100 MIPS (100 MHz core), dual-panel flash supporting live update firmware upgrades, and memory built-in self-test (MBIST) on the SRAM. The peripheral ecosystem includes 3 op-amps, 3 comparators, a peripheral-trigger generator (PTG), CAN Flexible Data-rate (CAN FD) for modern in-vehicle and industrial networks, and high-resolution PWM generators suited to switching power converters.
Technical depth: the dsPIC33CK DSC core achieves deterministic single-cycle DSP multiply-accumulate execution, while the 12-bit ADC with multiple sample-and-hold inputs enables simultaneous sampling of phase currents in motor-drive topologies. Operating conditions are 3.0V to 3.6V over DC to 100 MIPS, with the I-grade temperature option specified from -40C to +150C per Microchip documentation for the family.
Typical applications include digital power supplies (totem-pole PFC, LLC converters), brushless DC and PMSM motor control, advanced sensing, and CAN-FD-connected industrial control nodes.
Design consideration: flash partitioning must be planned at compile time when live update is used, since boot and secure partition sizes are fixed by configuration words.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK32MP502-I/2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK32MP502-I/2N (same form factor and footprint) — differing in Package, Operating Temperature, Architecture, Core, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK128MP202-I/2N
✅ Drop-In✓ In Stock
$3.05 / Unit
View Datasheet →DSPIC33CK64MP202-I/2N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK16MP202-I/2N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK32MC102T-I/2N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →DSPIC33CK16MC102-I/2N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK32MP502-I/2N Maximum Ratings & Electrical Characteristics
| Core | dsPIC33CK 16-bit DSC |
| Core Speed | 100 MHz (100 MIPS) |
| Program Flash | 32 KB (dual-partition, ECC) |
| Data SRAM | 8 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +150C (I grade) |
| CAN | CAN FD |
| Integrated Op-Amps | 3 |
| Comparators | 3 |
| ADC | 12-bit |
| PWM | High-Resolution PWM |
| Peripheral Trigger Generator | PTG included |
| Package | 28-pin UQFN (5x5 mm) |
| Mounting Type | Surface Mount |
| Architecture | Modified Harvard, single-core |
| Flash ECC / Live Update | Yes (dual-panel flash) |
| MBIST | Yes (SRAM built-in self-test) |
DSPIC33CK32MP502-I/2N 28-pin uqfn (5x5 mm) Pin Configuration Guide
Pin configuration for DSPIC33CK32MP502-I/2N (28-pin uqfn (5x5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK32MP502-I/2N.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK32MP502-I/2N is suitable for 6 applications: Digital Power Supplies, Brushless DC and PMSM Motor Control, CAN-FD Industrial Control Nodes, Advanced Sensing and Control, Automotive-Adjacent and Secured Embedded Systems, General-Purpose Embedded Control.
Digital Power Supplies
The DSPIC33CK32MP502-I/2N fits digital power conversion because its 100 MHz DSP core closes voltage and current loops deterministically while high-resolution PWM generators deliver the fine duty-cycle resolution required by LLC, totem-pole PFC, and phase-shifted full-bridge topologies. The 12-bit ADC samples output voltage and inductor current, and the 3 integrated op-amps condition shunt or Hall-effect current signals without external amplifiers, reducing BOM count. Placed as the sole controller, it replaces analog compensation networks with firmware, enabling adaptive mode switching and digital telemetry over CAN FD. The trade-off is loop tuning effort in firmware versus fixed analog compensation, but the 100 MIPS headroom supports multi-loop control well above typical switching frequencies of 100-500 kHz.
Recommended
Brushless DC and PMSM Motor Control
Field-oriented control (FOC) demands fast, simultaneous current sampling and high-resolution PWM - exactly the DSPIC33CK32MP502-I/2N strength profile. The 12-bit ADC captures phase currents synchronized to PWM trigger points, the integrated op-amps amplify low-level shunt signals in-line, and the 3 comparators support hardware overcurrent trip with microsecond response independent of CPU load. The 100 MHz DSP core executes Clarke/Park transforms and PI loops at PWM frequencies, while CAN FD links the drive to a vehicle or industrial network. Typical benefit: single-chip drive for fans, pumps, and servo modules in the 5x5 mm UQFN footprint. Design consideration: op-amp gain-bandwidth must be budgeted against switching-frequency ripple; external filters are still recommended at the ADC inputs for high dv/dt environments.
Recommended
CAN-FD Industrial Control Nodes
The integrated CAN Flexible Data-rate controller distinguishes the MP502 from the MC-series siblings and makes it a compact choice for industrial networked nodes - sensor aggregators, actuator controllers, and gateways. CAN FD supports payloads up to 64 bytes and higher data-phase bit rates than classical CAN, and having the controller on-chip eliminates an external CAN controller IC. Combined with the PTG (peripheral trigger generator) automating ADC/PWM sequences without CPU intervention, the 100 MHz core remains available for protocol stacks and application logic. Use a compliant CAN FD transceiver at the pins and follow Microchip's CAN FD bit-timing app notes for oscillator tolerance. The 32 KB flash accommodates a lean protocol stack plus control code; migrate to the 128 KB MP202 for larger stacks.
Recommended
Advanced Sensing and Control
For smart-sensor and closed-loop control subsystems, the DSPIC33CK32MP502-I/2N offers a dense analog integration: 3 op-amps configurable as PGA stages ahead of the 12-bit ADC, plus 3 comparators for fast threshold detection. Signal chains such as thermocouple front ends, bridge sensors, and current monitors can be conditioned largely on-chip, and the DSP engine applies filtering (IIR/FIR) at 100 MIPS throughput. SRAM MBIST and flash ECC support functional-safety-oriented designs, and live-update dual-panel flash allows sensor firmware to be upgraded in the field without downtime. The 28-pin UQFN keeps the sensing node compact for PCB-real-estate-limited equipment. The trade-off: 8 KB SRAM bounds buffering depth, so high-rate streaming designs should select higher-memory family variants.
Recommended
Automotive-Adjacent and Secured Embedded Systems
CAN FD is the backbone of modern vehicle networks, and while this commercial/I-grade part is not an AEC-Q100-qualified automotive ordering option, the same silicon family is used in vehicular-adjacent equipment such as chargers, workshop tools, and telematics development rigs. The flash ECC and SRAM MBIST provide the memory integrity checks expected in secured embedded platforms, and the dual-partition flash with live update enables signed over-the-air style firmware updates - a mandatory feature in connected systems. The 3.0V-3.6V rail matches standard 3.3V automotive logic. For production automotive sockets, select the automotive-qualified dsPIC33CK ordering options instead. Design consideration: implement bootloader authentication in the secure partition before release.
Recommended
General-Purpose Embedded Control
Beyond its DSP heritage, the DSPIC33CK32MP502-I/2N serves as a high-performance general-purpose 16-bit MCU: 100 MIPS of headroom runs state machines, communication stacks, and UI logic with wide margins, and C development is supported by Microchip MPLAB X IDE and the XC16 compiler with free optimization tiers. Compared with entry PIC16 controllers in the same voltage class, it adds hardware multiply-accumulate, DMA-classed peripheral triggering via PTG, and far richer timers - useful in meters, chargers, HVAC boards, and handheld instruments. The I-grade -40C to +150C rating extends use into high-ambient enclosures. Trade-off: 3.0V-3.6V-only operation means it cannot run at 5V or below 3.0V; level-shift interfaces for 5V peripherals accordingly.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK32MP502-I/2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK128MP202-I/2N | DSPIC33CK64MP202-I/2N | DSPIC33CK16MP202-I/2N | DSPIC33CK32MC102T-I/2N | DSPIC33CK16MC102-I/2N |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (5x5 mm) | 28-UQFN (5x5 mm) - same | 28-UQFN (5x5 mm) - same | 28-UQFN (5x5 mm) - same | 28-UQFN (5x5 mm) - same | 28-UQFN (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) |
| Program Flash | 32 KB | 128 KB | 64 KB | 16 KB | 32 KB | 16 KB |
| Data SRAM | 8 KB | 16 KB | 8 KB | 4 KB | 8 KB | 4 KB |
| CAN FD | Yes | Yes | Yes | Yes | No | No |
| Integrated Op-Amps | 3 | 3 | 3 | 3 | 0 | 0 |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Key Differentiators
- Integrated CAN FD controller (vs DSPIC33CK32MC102T-I/2N)
- 3 integrated op-amps eliminate external signal conditioning (vs DSPIC33CK32MC102T-I/2N)
- Optimal flash/SRAM balance for compact control firmware (vs DSPIC33CK16MP202-I/2N)
Design Notes
Supply the DSPIC33CK32MP502-I/2N from a clean 3.0V-3.6V rail - the family has no wide-voltage operation, so a 5V input requires an LDO or buck first. Decouple each VDD pin with 0.1 uF ceramic placed within 2 mm of the pin, plus one bulk 4.7-10 uF capacitor near the package. The integrated op-amps draw from the same rail, so avoid routing high di/dt PWM return currents under the analog supply traces. Estimated: at 100 MHz full-speed operation the core current is on the order of tens of mA, so a 100 mA-class LDO suffices.
The 28-pin UQFN (5x5 mm) has a center exposed pad that must be soldered to a grounded thermal land for reliable operation - it is often the primary VSS connection. Use an array of 3x3 vias under the pad to the ground plane. Keep the high-resolution PWM outputs short and routed away from the 12-bit ADC inputs; on a 4-layer board, dedicate layer 2 as an unbroken ground plane. Follow the Microchip high-speed PCB layout guidelines for the dsPIC33CK family when switching frequencies exceed 200 kHz.
Dual-partition flash means total user flash is split between the boot (active) and secure (inactive) partitions - a 32 KB part yields roughly half per partition when live update is enabled, a frequent surprise in migration from single-partition dsPIC33EP parts. Also, configuration-word settings and the debug/ICSP pin assignments differ from older families; verify with the family datasheet before tape-out. Finally, program with an up-to-date MPLAB ICD 4/REAL ICE firmware image to avoid programming-benchmark issues reported with third-party NSDSP programmers.
Compliance Information
Compliance certificates for this specific ordering code were not present in the verified web data; confirm via the Microchip product page material declaration. The I temperature grade (-40C to +150C) is confirmed; AEC-Q100 qualification is not claimed for this commercial/I-grade ordering option.
