DSPIC33CK64MP502-I/2N - 100MHz DSC, 64KB Flash, CAN-FD | Microchip
MPN: DSPIC33CK64MP502-I/2N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.95 | $4.95 |
| 10 | $4.45 | $44.50 |
| 100 | $3.85 | $385.00 |
| 500 | $3.4 | $1,700.00 |
| 1,000 | $3.05 | $3,050.00 |
DSPIC33CK64MP502-I/2N Overview
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and ease of use of a microcontroller. Within the power management hierarchy, the DSC sits above a general-purpose MCU for control-loop-intensive tasks, making the dsPIC33CK family a staple of digital power and motor-control system design where deterministic, fast interrupt response matters.
Key features include CAN Flexible Data (CAN FD) support for robust communication, integrated operational amplifiers for current sensing without external op-amps, 12-bit ADCs for high-precision feedback acquisition, and high-resolution PWM peripherals for switching power stages. These peripherals are purpose-built for closed-loop digital control where loop bandwidth and conversion speed directly determine performance.
Architecturally, the dsPIC33CK core executes DSP instructions such as MAC and multiply-divide operations with dual-panel flash enabling live firmware updates. The exposed-pad UQFN-28 (6x6) package improves thermal dissipation and provides solid grounding for high-frequency switching environments common in power electronics.
Typical applications include digital power supplies (LLC, totem-pole PFC), brushless DC and PMSM motor control, advanced sensing systems, and CAN FD networked industrial nodes. The on-chip op-amps and ADC sample rates eliminate several external analog components in compact designs.
Design consideration: the /2N UQFN package requires careful PCB thermal design; connect the exposed pad to a solid ground pour for heat and signal-integrity reasons.
This page synthesizes distributor pricing, pin-compatible same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK64MP502-I/2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK64MP502-I/2N (same form factor and footprint) — differing in Core, Operating Temperature, Package, Architecture, Data SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesDSPIC33CK64MP502-I/2N Maximum Ratings & Electrical Characteristics
| Core | dsPIC33C 16-bit DSC |
| CPU Speed | 100 MHz |
| Flash Memory | 64 KB (dual panel) |
| RAM | 8 KB |
| Supply Voltage | 3.3 V |
| Package | 28-UQFN (6x6 mm) Exposed Pad |
| Mounting Type | Surface Mount |
| CAN | CAN FD |
| ADC | 12-bit |
| Integrated Op-Amps | Yes |
| PWM | High-Resolution PWM |
| Instruction Set | CISC (dsPIC) |
| Temperature Range | -40C to +85C (I grade) |
| Packaging | Tube |
| Family | dsPIC33CK64MP502 |
| RoHS Status | Compliant |
| Product Type | Digital Signal Controller (DSC) |
DSPIC33CK64MP502-I/2N 28-uqfn (6x6 mm) exposed pad Pin Configuration Guide
Pin configuration for DSPIC33CK64MP502-I/2N (28-uqfn (6x6 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK64MP502-I/2N.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK64MP502-I/2N is suitable for 6 applications: Digital Power Supplies, BLDC and PMSM Motor Control, CAN FD Industrial Network Nodes, Advanced Sensing and Control, USB-C PD and Battery Chargers, Automotive-Adjacent Control Systems.
Digital Power Supplies
The DSPIC33CK64MP502-I/2N fits digital power conversion because its 100 MHz DSP core closes voltage- and current-mode loops with the deterministic latency needed for LLC resonant converters, totem-pole PFC, and synchronous buck stages. The high-resolution PWM offers fine duty and phase resolution, minimizing limit-cycle oscillation at switching frequencies of several hundred kHz. The 12-bit ADCs sample feedback signals synchronously with the PWM, and the 64KB dual-panel flash supports live firmware updates in the field without halting the converter. Compared with an analog controller, the DSC provides adaptive compensation, soft-start shaping, and fault logging in one chip. Trade-off: firmware development effort replaces the simplicity of an analog control IC, so budget validation time for loop tuning and transient testing.
Recommended
BLDC and PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33CK64MP502-I/2N executes field-oriented control (FOC) at 100 MHz with DSP MAC instructions, achieving current-loop execution in a few microseconds. The integrated operational amplifiers amplify low-side or in-line shunt current signals directly, removing external op-amp stages and their offset and drift contributions. The 12-bit ADCs sample phase currents at precise PWM-centered instants, reducing switching-noise-induced measurement error, while the high-resolution PWM enables sinusoidal drive with low acoustic noise. Single-shunt and three-shunt topologies are both practical. Key design consideration: route shunt signals with Kelvin connections to the op-amp inputs and keep the power stage ground return separate from the analog ground to protect measurement accuracy.
Recommended
CAN FD Industrial Network Nodes
The DSPIC33CK64MP502-I/2N integrates a CAN FD controller, making it an economical single-chip node for industrial automation networks that demand both protocol throughput and local control intelligence. CAN FD raises payload to 64 bytes per frame and allows faster data-phase bit rates than classical CAN, and the on-chip controller handles message filtering and DMA-style RAM access to reduce CPU overhead. The 64KB flash stores protocol stacks plus application firmware with headroom, and the 100 MHz core keeps control tasks responsive between message arrivals. With an external transceiver, the node connects directly to plant buses. Performance consideration: the -I grade covers -40C to +85C, adequate for most industrial enclosures, but verify enclosure temperature rise before deployment near heat sources.
Recommended
Advanced Sensing and Control
The DSPIC33CK64MP502-I/2N serves advanced sensing systems where analog front-end and digital processing must coexist tightly. Its integrated op-amps can condition sensor outputs such as pressure bridges, thermocouple amplifiers, or current shunts, while the 12-bit ADCs digitize multiple channels with programmable sample sequencing. The 100 MHz DSP core applies filtering, FFT-based analysis, or calibration math in real time, eliminating a separate signal-processing device in many designs. For example, a vibration-monitoring node can sample an accelerometer through the on-chip amplifier and compute spectral features on-chip before reporting via CAN FD. The main constraint is 8KB of RAM; streaming algorithms with large buffers should be sized carefully or offloaded to a device with more RAM.
Recommended
USB-C PD and Battery Chargers
In USB Power Delivery and multi-chemistry battery chargers, the DSPIC33CK64MP502-I/2N runs the constant-current/constant-voltage algorithms, protocol state machines, and safety supervision in one 3.3V controller. The high-resolution PWM drives synchronous buck or buck-boost power stages with the duty resolution needed for tight voltage regulation across wide input ranges, while 12-bit ADC feedback tracks battery voltage, current, and temperature with sufficient resolution for JEDEC-style charge profiling. The 64KB dual-panel flash allows firmware field updates when charging profiles or protocol specs change after deployment, an increasingly common regulatory requirement. Consideration: implement hardware-independent redundant over-voltage and over-temperature protection paths so a firmware fault cannot compromise battery safety compliance.
Recommended
Automotive-Adjacent Control Systems
The DSPIC33CK64MP502-I/2N supports automotive-adjacent systems such as auxiliary pumps, fan controllers, actuators, and sensor modules that communicate over CAN FD but sit outside safety-critical domains. The CAN FD peripheral speaks the same protocol as modern vehicle networks, and the 100 MHz core handles local closed-loop motor or heater control deterministically. The -E/2N extended-temperature variant in the identical footprint covers hotter under-hood zones, giving designers a migration path without PCB changes. Start with the -I grade for cabin and body electronics and move to the -E variant where ambient temperatures exceed +85C. Remember this standard part is not AEC-Q100 qualified; formal automotive programs should confirm qualification requirements with Microchip before design-in.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK64MP502-I/2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK128MP202-I/2N | DSPIC33CK64MP502-E/2N | DSPIC33CK64MP502-I/SS | DSPIC33CK32MP502-I/2N |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) EP | 28-UQFN (6x6 mm) EP - same | 28-UQFN (6x6 mm) EP - same | 28-SSOP | 28-UQFN (6x6 mm) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Flash Memory | 64 KB | 128 KB | 64 KB | 64 KB | 32 KB |
| CAN FD | Yes | Yes | Yes | Yes | Yes |
| Temperature Range | -40C to +85C (I grade) | -40C to +85C (I grade) | Extended grade | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Key Differentiators
- On-chip operational amplifiers for current sensing (vs DSPIC33CK128MP202-I/2N)
- Same UQFN footprint with double the flash (vs DSPIC33CK64MP502-I/2N vs upgrade path)
- Extended-temperature variant available (vs DSPIC33CK64MP502-E/2N)
Design Notes
The 28-UQFN (6x6) exposed-pad package requires the center pad to be soldered to a ground pour for thermal dissipation and grounding integrity. Use an array of thermal vias (typically 3x3 to 4x4, 0.3 mm drill) connecting the pad to internal and bottom ground planes. For the digital power use case, this exposed ground also serves as the low-inductance reference for the high-resolution PWM switching currents, reducing ground bounce that would otherwise corrupt 12-bit ADC measurements.
Decouple all VDD pins with 100 nF ceramic capacitors placed within 2 mm of each pin, plus one bulk 4.7-10 uF capacitor per power domain. The dsPIC33C core regulator output also requires its own capacitor per the Microchip datasheet recommendations - omitting it causes brown-out resets under load transients. Estimated: with a 50 mA core load and typical transient currents, inadequate decoupling on the internal regulator node is the most common cause of erratic resets in first-revision dsPIC33CK boards.
Ordering errors between the /2N (UQFN) and /SS (SSOP) package suffixes are frequent because both exist in the same family with identical die. Verify the package code on the purchase order against your PCB footprint before releasing BOMs. Also note that the MP502 peripheral set (with op-amps) differs from MP202/MP503 variants - confirm the peripheral list in the datasheet before substituting, since firmware written for on-chip op-amps will not run on parts lacking them.
Compliance Information
RoHS compliance per Microchip product page and distributor listings. Not AEC-Q100 qualified; the -E/2N extended-temperature variant exists but formal automotive qualification status should be confirmed with Microchip.
