DSPIC33CK64MP206T-I/MR - 100MHz DSC 64KB Flash QFN-64 | Microchip
MPN: DSPIC33CK64MP206T-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.19 | $2.19 |
| 10 | $2.05 | $20.50 |
| 100 | $1.95 | $195.00 |
| 500 | $1.85 | $925.00 |
| 1,000 | $1.75 | $1,750.00 |
DSPIC33CK64MP206T-I/MR Overview
A digital signal controller combines the computational throughput of a digital signal processor (DSP) with the peripheral integration and control architecture of a microcontroller (MCU). In the system hierarchy, the DSC sits between a general-purpose MCU and a dedicated DSP, making it the preferred processor class for real-time closed-loop control such as digital power conversion, motor control, and advanced sensing.
Key differentiating features include the 100 MHz core with DSP engine and barrel shifter, on-chip 3 op-amps and 3 comparators that reduce external analog component count, high-resolution PWM (HRPWM) for fine duty-cycle and phase control, and CAN Flexible Data (CAN FD) support for automotive and industrial networking. The device also integrates multiple serial interfaces (4 serial I/O ports), DMA channels, and a PTG (peripheral trigger generator) for autonomous peripheral sequencing.
Architecturally, the dsPIC33CK core executes from Flash with a 24-bit instruction width and uses pipelined, single-cycle MAC and multiply instructions, enabling control-loop rates well above 100 kHz in digital power and FOC motor-control applications. The integrated analog front-end (op-amps, comparators, 12-bit ADC pipelines in the MP family) allows direct connection of current shunts and voltage dividers, minimizing signal-chain latency.
Typical applications include digital power supplies and 48V-to-12V DC/DC brick converters (as in the EPC9143 reference design using a sibling dsPIC33CK32MP102), PFC stages, BLDC/PMSM/ACIM motor drives, battery chargers, and industrial automation nodes requiring CAN FD connectivity.
Design consideration: the device requires a stable 3.3V rail (3.0V-3.6V), decoupled close to the QFN exposed pad; the exposed thermal pad must be soldered to a ground pour for both electrical return and heat dissipation. Use Microchip's MPLAB X IDE and X16 compiler with the dsPIC33CK device family support pack.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing verified as of 2026-09-23.
Drop-in alternatives for DSPIC33CK64MP206T-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK64MP206T-I/MR (same form factor and footprint) — differing in Core, Package, Operating Temperature, RoHS Status, Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK64MP206T-E/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CK64MP206-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK64MP205-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK128MC106-I/MR
✅ Drop-In✓ In Stock
$3.28 / Unit
View Datasheet →DSPIC33CK32MP506-E/MR
✅ Drop-In✓ In Stock
$3.55 / Unit
View Datasheet →DSPIC33CK64MP206T-I/MR Maximum Ratings & Electrical Characteristics
| Core | 16-bit dsPIC33CK DSC core |
| Maximum Clock Frequency | 100 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash |
| Program Memory Type | Flash |
| RAM Size | 8 KB |
| Supply Voltage Range | 3 V to 3.6 V |
| Number of I/Os | 53 |
| On-Chip Op-Amps | 3 |
| On-Chip Comparators | 3 |
| Communication Interfaces | CAN FD, UART, SPI, I2C (4 serial I/O ports) |
| Special Peripherals | High-Resolution PWM (HRPWM), PTG, DMA |
| Operating Temperature Range | -40C to +85C |
| Package | 64-QFN (9x9 mm, MR) with exposed pad |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| RoHS Status | RoHS compliant |
DSPIC33CK64MP206T-I/MR 64-qfn (9x9 mm, mr) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33CK64MP206T-I/MR (64-qfn (9x9 mm, mr) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK64MP206T-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK64MP206T-I/MR is suitable for 6 applications: Digital Power Supplies and DC/DC Converters, BLDC/PMSM Motor Control (FOC), Battery Chargers and BMS Nodes, Industrial Automation and CAN FD Networking, Advanced Sensing and Signal Conditioning, Power over Ethernet and Telecom Rectifiers.
Digital Power Supplies and DC/DC Converters
The DSPIC33CK64MP206T-I/MR fits digital power conversion because its 100 MHz core closes voltage- and current-mode loops far faster than switching frequencies of 100-500 kHz demand, while the high-resolution PWM provides sub-nanosecond duty-cycle resolution for tight transient response. Microchip's EPC9143 48V-to-12V eGaN brick reference design (built with the sibling dsPIC33CK32MP102) demonstrates the family's role in this space. The 3 on-chip op-amps amplify current-shunt signals directly, and the 3 comparators implement hardware cycle-by-cycle overcurrent limiting without CPU intervention. Placed as the sole controller between the feedback dividers and gate drivers, the DSC eliminates analog compensation components; the trade-off is firmware development effort versus an analog-controller solution.
Recommended
BLDC/PMSM Motor Control (FOC)
Field-oriented control of brushless DC and permanent-magnet synchronous motors is a primary application for the DSPIC33CK64MP206T-I/MR. The 100 MHz core executes FOC current loops with single-cycle MAC and DSP instructions, sustaining PWM frequencies of 20-100 kHz with control bandwidth above what 8-bit MCUs achieve. The 3 integrated op-amps condition low-side shunt currents, and the 3 comparators provide fast hardware overcurrent trips that protect power stages within microseconds. High-resolution PWM sets precise dead times, minimizing switching loss and audible noise. The 53 I/O pins drive gate drivers, hall/encoder interfaces, and communication links, while CAN FD connects the drive into industrial networks. Microchip's motor-control libraries and MCAF tooling shorten firmware development for this part.
Recommended
Battery Chargers and BMS Nodes
Smart battery chargers benefit from the DSPIC33CK64MP206T-I/MR's combination of precision analog and control throughput. Its high-resolution PWM implements multi-phase buck charge stages with fine current regulation, while the on-chip 3 op-amps read charge current and pack voltage through shunts and dividers without external amplifiers. Charge-state safety is enforced by the 3 comparators as hardware limits independent of firmware latency. The CAN FD interface integrates the charger or battery-pack node into automotive and industrial networks, and the -40C to +85C industrial rating covers under-hood-adjacent and factory environments. With 64KB Flash, the device holds CC/CV charging state machines, cell-balancing logic, and communication stacks in a single 3.3V controller.
Recommended
Industrial Automation and CAN FD Networking
In factory automation nodes, the DSPIC33CK64MP206T-I/MR serves as a real-time actuator and sensor controller with native CAN Flexible Data connectivity. CAN FD supports data phases well above classical CAN bit rates, enabling fast deterministic messaging between PLC masters and distributed I/O. The 100 MHz DSC core handles protocol stacks plus local control loops concurrently, the 53 I/O pins interface solenoids, encoders and limit switches, and the 4 serial ports provide RS-485/UART/SPI links to legacy equipment. The -40C to +85C range and RoHS compliance fit industrial environmental requirements. Compared with general-purpose MCUs lacking a DSP engine, this DSC sustains deterministic microsecond-level control alongside network communication on one chip.
Recommended
Advanced Sensing and Signal Conditioning
The DSPIC33CK64MP206T-I/MR integrates a complete analog front end - 3 op-amps and 3 comparators plus the MP family's high-speed ADC pipelines - so sensor signals such as current, pressure-bridge, and thermocouple outputs can be amplified, windowed, and digitized on-chip. The 100 MHz core applies DSP filtering (IIR/FIR, with hardware MAC acceleration) directly in firmware, removing external filter and amplifier ICs from the BOM. DMA moves ADC results to RAM without CPU intervention, sustaining continuous sampling in tightly timed loops. This consolidation suits condition-monitoring sensors, weigh-scale front ends, and analytical instruments where board area and per-channel cost matter. The PTG peripheral triggers ADC sampling autonomously for jitter-free acquisition timing.
Recommended
Power over Ethernet and Telecom Rectifiers
Telecom rectifier and PoE power-shelf modules use the DSPIC33CK64MP206T-I/MR as the digital supervisory and control device. Its high-resolution PWM manages interleaved LLC or phase-shifted full-bridge stages at high switching frequency with fine phase resolution, improving efficiency at 48V-class telecom bus voltages. The on-chip op-amps digitize output current and temperature, the comparators enforce fast fault shutdowns, and CAN FD (or UART-based PMBus-style links via the serial ports) reports telemetry to shelf managers. The 64KB Flash accommodates hot-swap sequencing, ORing control, and alarm logging. The 9x9 mm QFN conserves vertical clearance in 1U power shelves where height and thermal spreading through the exposed pad are critical.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK64MP206T-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK64MP206T-E/MR | DSPIC33CK128MC106-I/MR | DSPIC33CK32MP506-E/MR | DSPIC33CK64MP206T-I/PT |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm, MR) | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same | 64-TQFP (PT) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Flash Memory | 64 KB | 64 KB | 128 KB | 32 KB | 64 KB |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C |
| CAN FD | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Integrated 3 op-amps and 3 comparators reduce external BOM (vs DSPIC33CK128MC106-I/MR)
- Industrial temperature grade at standard pricing (vs DSPIC33CK64MP206T-E/MR)
- Smallest-footprint-compatible memory step within the same QFN-64 (vs DSPIC33CK32MP506-E/MR)
Design Notes
The 64-QFN (9x9) exposed pad is the primary ground return and must be soldered to a stitched ground pour. Use a 4x4 or 5x5 via array (0.3 mm vias) under the pad connected to the internal ground plane to minimize ground bounce for the ADC and analog peripherals. Place 100 nF ceramic decoupling capacitors within 2 mm of every VDD pin pair, plus 4.7-10 uF bulk capacitance near the supply entry. AVDD should be filtered from VDD through an ferrite bead plus 1 uF to preserve op-amp and ADC accuracy.
The device requires 3.0V-3.6V (nominal 3.3V); no 5V-tolerant I/O exists on the dsPIC33CK family, so level-shift any 5V logic signals. The VCAP pin requires the datasheet-specified low-ESR capacitor to stabilize the internal core regulator - omitting or substituting the wrong value causes erratic resets at 100 MHz. Budget supply current for the full-speed core plus all analog peripherals (op-amps and comparators add meaningful load); estimated: a 3.3V rail sized at 150-200 mA covers core, I/O and analog with margin.
Peripheral Pin Select (PPS) means most digital peripherals are routed to pins in firmware - verify your PPS map against the datasheet pinout table before layout freeze, since two firmware versions of the same PCB can have incompatible pin assignments. Also, when substituting memory-grade variants (32/64/128KB) in the same QFN-64 footprint, the device header and linker script in MPLAB X must be changed; the Flash programming algorithm differs per density. Finally, keep high-di/dt PWM gate-drive traces away from the analog op-amp input pins to prevent comparator false trips.
Estimated: at 100 MHz with all peripherals active, typical core current on the dsPIC33CK family is on the order of tens of milliamps, giving power dissipation well below 0.5W - the 9x9 QFN with a grounded exposed pad keeps junction rise modest (theta_JA in the low tens of C/W with a solid ground pour). No heatsink is normally required at -40C to +85C ambient, but in sealed enclosures above 70C ambient consider the -E extended temperature variant (DSPIC33CK64MP206T-E/MR) for margin.
Compliance Information
RoHS compliance per JLCPCB and LCSC part listings for dsPIC33CK64MP206T-I/MR. Not an automotive AEC-Q100 qualified part number; contact Microchip for automotive-grade options.
