DSPIC33EP256MC506-H/MR - 16-bit 60 MIPS DSC, 256KB Flash | Microchip
MPN: DSPIC33EP256MC506-H/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.2 | $6.20 |
| 10 | $5.58 | $55.80 |
| 100 | $4.96 | $496.00 |
| 500 | $4.45 | $2,225.00 |
| 1,000 | $3.98 | $3,980.00 |
DSPIC33EP256MC506-H/MR Overview
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and deterministic interrupt architecture of a microcontroller. Within the power-management hierarchy, a DSC sits above general-purpose MCUs in the sense that its DSP engine (single-cycle MAC, DSP instruction set) and dedicated high-speed PWM peripherals exist specifically to run closed-loop control algorithms such as field-oriented control (FOC) for motors and digital power conversion loops.
Key features include the 16-bit dsPIC33E CPU core running at up to 60 MIPS, integrated DSP engine with single-cycle multiply-accumulate, 256KB self-programmable Flash with ECC, and 32KB of RAM. Differentiating analog peripherals include three on-chip operational amplifiers plus a dedicated analog comparator, which reduce external component count in current-sense front ends for motor drives. High-speed PWM modules support complementary outputs with dead-time insertion, essential for three-phase inverter topologies.
Architecturally, the device pairs the enhanced dsPIC33E core with a flexible clock system (internal FRC and PLL, external crystal options), multiple UART/SPI/I2C communication ports, DMA for peripheral-to-memory transfers, and watchdog/lockout protection. The 64-VQFN (9x9) exposed-pad package improves thermal dissipation and signal routing density versus 64-TQFP equivalents.
Typical applications include precision sensorless and sensored motor control (BLDC, PMSM, ACIM) on Microchip MCLV-2/MCHV-2 development platforms, digital power supplies and solar inverters, automotive auxiliary systems, and industrial automation requiring deterministic control loops.
Design consideration: the -H suffix denotes the automotive/extended temperature option; verify your firmware toolchain (MPLAB X, XC16) targets the 33EP device family, and reserve debug pins (PGD/PGC) in pin multiplexing plans.
This page synthesizes distributor pricing context, drop-in same-family alternatives, design notes, and application guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP256MC506-H/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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Request AlternativesDSPIC33EP256MC506-H/MR Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC core |
| CPU Speed | 60 MIPS / 60 MHz |
| Program Memory | 256 KB (85.5K x 24) Flash |
| RAM | 32 KB |
| Supply Voltage | 3.3 V |
| Package | 64-VQFN (9x9 mm), MR |
| On-chip Op Amps | 3 (plus 1 dedicated analog comparator) |
| PWM | High-speed PWM with complementary outputs and dead-time insertion |
| DSP Engine | Single-cycle MAC, DSP instruction set |
| Communication Interfaces | UART, SPI, I2C |
| DMA | Yes |
| Mounting Type | Surface Mount |
| Qualification | AEC-Q100 (automotive) |
| Operating Temperature | -40C to +125C (H temperature option, per AEC-Q100 listing) |
| Family | dsPIC33EP256MC506, dsPIC 33EP |
DSPIC33EP256MC506-H/MR 64-vqfn (9x9 mm), mr Pin Configuration Guide
Pin configuration for DSPIC33EP256MC506-H/MR (64-vqfn (9x9 mm), mr package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256MC506-H/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256MC506-H/MR is suitable for 6 applications: Three-Phase Motor Control (FOC), Digital Power Conversion, Automotive Auxiliary Control Systems, Industrial Automation and Robotics, Embedded Sensing and Signal Processing Nodes, Power Tool and Appliance Motor Drives.
Three-Phase Motor Control (FOC)
The DSPIC33EP256MC506-H/MR is purpose-built for precision motor control: its 60 MIPS DSP core executes field-oriented control (FOC) loops for BLDC, PMSM, and ACIM motors with sample rates well into the tens of kHz, while high-speed PWM modules generate complementary outputs with hardware dead-time insertion for three-phase inverters. The three integrated op amps amplify shunt current-sense signals directly, and the dedicated analog comparator supports overcurrent protection with fast hardware response, reducing external analog component count. On Microchip MCLV-2 and MCHV-2 development boards this device is the reference DSC, allowing designs to migrate from evaluation to production with the same silicon. Firmware complexity such as sensorless observers and communication stacks fits comfortably in the 256KB Flash and 32KB RAM.
Recommended
Digital Power Conversion
In digital power supplies, solar micro-inverters, and PFC stages, the DSPIC33EP256MC506-H/MR closes fast control loops using its 60 MIPS core, high-resolution PWM with dead-time and fault inputs, and DMA-driven ADC sampling that minimizes CPU interrupt latency. The on-chip op amps condition current and voltage feedback signals without external amplifiers, and the analog comparator provides cycle-by-cycle overcurrent limiting in hardware - a critical safety feature in power conversion. The 3.3V single-supply operation simplifies auxiliary bias design, and the exposed-pad 64-VQFN package dissipates switching-stage driver heat efficiently. Typical topologies include LLC resonant converters, totem-pole PFC, and grid-tie inverter control where deterministic loop timing is mandatory.
Recommended
Automotive Auxiliary Control Systems
As an AEC-Q100 listed device with the automotive H-grade option, the DSPIC33EP256MC506-H/MR suits auxiliary automotive electronic control units such as pumps, fans, HVAC blowers, throttle actuators, and window/seat motor drivers. The 60 MIPS core runs sensorless FOC for low-voltage brushless motors, the three on-chip op amps reduce BOM cost in current-sense paths, and LIN/UART/CAN-adjacent communication peripherals (via UART modules) support vehicle networking gateways. The 64-VQFN (9x9) footprint saves PCB area in space-constrained modules while the exposed pad aids thermal management in engine-bay temperature environments up to +125C. Designers should review the Microchip automotive qualification documentation and family errata for deployment in safety-related functions.
Recommended
Industrial Automation and Robotics
Industrial servo drives, conveyor controllers, and robotic joint actuators benefit from the DSPIC33EP256MC506-H/MR's combination of DSP math throughput and rich peripherals. The 60 MIPS core computes multi-axis position/velocity/current cascades; SPI and UART modules interface with encoders, absolute sensors, and supervisory PLCs; and DMA offloads high-rate ADC sample streams from the CPU. The 256KB Flash accommodates trajectory planners and fieldbus stacks alongside the control loops, while the 32KB RAM buffers motion profiles. The device's deterministic interrupt latency keeps current-loop jitter low, which directly translates to smoother torque at low speeds - a measurable advantage in robotics and precision positioning applications.
Recommended
Embedded Sensing and Signal Processing Nodes
The integrated DSP engine (single-cycle MAC, DSP addressing modes) plus three op amps make the DSPIC33EP256MC506-H/MR effective as a smart sensor node performing real-time filtering, FFT-based analysis, or active signal conditioning on-board. Examples include vibration monitoring nodes, ultrasonic flow measurement, and acoustic diagnostics where the DSC samples analog channels through its ADC, applies FIR/IIR filters in firmware, and reports results over UART/SPI/I2C. The 64-pin package provides enough I/O to drive local indication, control relays, and multiple sensor buses simultaneously, while 256KB Flash retains calibration tables and self-test code. Compared with an MCU-plus-external-AFE approach, this integration reduces board area and noise pickup in the analog front end.
Recommended
Power Tool and Appliance Motor Drives
High-performance cordless power tools and premium appliances increasingly use sensorless BLDC drives, and the DSPIC33EP256MC506-H/MR fits this space well: the 60 MIPS core handles back-EMF observers or sliding-mode estimators, high-speed PWM drives the inverter stage with programmable dead time, and hardware comparators provide rapid overcurrent shutdown for battery-pack protection. The three internal op amps amplify low-side shunt signals, trimming cost in consumer-priced products. The AEC-Q100 option also allows one design to serve both consumer and light-automotive derivative products. Its 3.3V logic simplifies interfacing with battery management ICs and user-interface touch controllers commonly used in modern tool and appliance platforms.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256MC506-H/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GM606-H/MR | DSPIC33EP128MC506-H/MR | DSPIC33EP64MC506-H/MR | DSPIC33EP256MC506-I/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9, MR) - same | 64-VQFN (9x9, MR) - same | 64-VQFN (9x9, MR) - same | 64-VQFN (9x9, MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 16-bit dsPIC33E, 60 MIPS | 16-bit dsPIC33E, 60 MIPS | 16-bit dsPIC33E, 60 MIPS | 16-bit dsPIC33E, 60 MIPS | 16-bit dsPIC33E, 60 MIPS |
| Flash Program Memory | 256 KB (85.5K x 24) | 256 KB (dual-partition) | 128 KB | 64 KB | 256 KB |
| On-chip Op Amps | 3 + 1 comparator | 3 + comparators (GM analog set) | 3 + 1 comparator | 3 + 1 comparator | 3 + 1 comparator |
| Qualification Grade | AEC-Q100 (automotive, H suffix) | Automotive (H suffix) | Automotive (H suffix) | Automotive (H suffix) | Industrial (I suffix) |
| Flash Feature | Single-partition, self-programmable | Dual-partition (live update capable) | Single-partition | Single-partition | Single-partition |
Key Differentiators
- Full 256KB Flash at automotive grade (vs DSPIC33EP128MC506-H/MR)
- Automotive AEC-Q100 option (vs DSPIC33EP256MC506-I/MR)
- Live-update capability available via GM-series upgrade path (vs DSPIC33EP256GM606-H/MR)
Design Notes
The DSPIC33EP256MC506-H/MR operates from a single 3.3V supply. Estimated: with core plus peripherals running at 60 MIPS, supply current is typically in the tens of mA range (consult the family datasheet electrical specifications table for exact IDD by operating mode); budget the local regulator accordingly and decouple each VDD/VSS pair with 0.1uF ceramics placed within 2-3 mm of the pins, plus one bulk 10uF capacitor near the device. Do not share analog supply filtering with high-current gate-driver rails.
The 64-VQFN (9x9) MR package has a center exposed pad that must be soldered to a grounded thermal land with an array of thermal vias - this is both the primary heat-removal path and the VSS return. Use at least a 5x5 via array under the pad. Route PWM outputs to gate drivers as short, matched pairs and keep shunt-based op-amp input traces (OPA1-OPA3 inverting/non-inverting pins) away from PWM and crystal traces to preserve analog accuracy.
Pin functions on the dsPIC33EP family are heavily multiplexed and configured via Peripheral Pin Select (PPS) registers plus configuration words; failing to lock PPS settings (via the PPS lock sequence) can allow firmware runaway to remap PWM outputs unexpectedly. Also verify OSC configuration words match your crystal/PLL selection - a mismatched configuration silently selects the internal FRC, dropping the clock from 60 MHz to 7.37 MHz and destabilizing control loops. Reserve PGD/PGC debug pins during layout.
Compliance Information
AEC-Q100 automotive qualification is explicitly stated in distributor listings (datasheets.com, GlobalSpec). RoHS/REACH/lead-free status not stated in the provided web data - verify on the Microchip product page before procurement.