DSPIC33EP512MU810-E/BG - 16-bit 70 MIPS DSC, 512KB Flash | Microchip
MPN: DSPIC33EP512MU810-E/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.95 | $89.50 |
| 100 | $8.1 | $810.00 |
| 500 | $7.45 | $3,725.00 |
| 1,000 | $6.9 | $6,900.00 |
DSPIC33EP512MU810-E/BG Overview
A digital signal controller combines the computation throughput of a DSP with the deterministic, interrupt-driven behavior and peripheral set of a microcontroller. In the semiconductor hierarchy it sits above general-purpose MCUs and beside DSPs, belonging to the broader class of 16-bit embedded processors used in closed-loop control systems where fast multiply-accumulate operations are required.
Key features include the 70 MIPS dsPIC33E DSP engine with dual 40-bit accumulators and single-cycle MAC, high-speed PWM modules purpose-built for motor control, full-speed USB OTG, two CAN 2.0B controllers for industrial networking, and Microchip nanoWatt XLP low-power technology for reduced standby consumption.
Technically, the dsPIC33EP512MU810 executes from 3.0V to 3.6V single-supply operation, supports 60 MHz internal clocking per distributor listings, and integrates 51 I/O pins in the BGA option along with advanced analog peripherals. The E suffix denotes the extended -40C to +125C operating range, and the device is listed as AEC-Q100 capable for automotive environments by distributor sources.
Typical applications include dual motor control (BLDC, PMSM, ACIM), digital power supplies and solar inverters, and automotive or industrial gateways that need USB plus dual CAN connectivity.
Design consideration: plan the 121-ball BGA layout early - escape routing requires controlled-impedance fanout and a solid ground plane; power supply decoupling on all VDD balls is essential for the 70 MIPS core.
This page synthesizes distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EP512MU810-E/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512MU810-E/BG (same form factor and footprint) — differing in Operating Temperature, Core, Core Architecture, DMA Channels, Qualification.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP512MU810-I/BG
✅ Drop-In✓ In Stock
$5.8 / Unit
View Datasheet →DSPIC33EP512GM310-E/BG
✅ Drop-In✓ In Stock
$5.95 / Unit
View Datasheet →DSPIC33EP512MU810-E/BG Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC core |
| Maximum CPU Speed | 70 MIPS |
| Clock Speed | 60 MHz |
| Program Memory Size | 512 KB (170K x 24) Flash |
| SRAM Size | 52 KB |
| Supply Voltage | 3 V to 3.6 V |
| I/O Ports | 51 |
| Package | 121-TFBGA (10x10 mm) |
| Operating Temperature | -40C to +125C (E grade) |
| USB | USB 2.0 full-speed OTG |
| CAN Modules | 2 x CAN 2.0B |
| PWM | High-speed PWM for motor control |
| Low Power Technology | nanoWatt XLP |
| Qualification | Automotive, AEC-Q100 capable (per distributor listing) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
DSPIC33EP512MU810-E/BG 121-tfbga (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP512MU810-E/BG (121-tfbga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP512MU810-E/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP512MU810-E/BG is suitable for 6 applications: Dual Motor Control Drives, Digital Power Conversion, Automotive CAN/USB Gateways, Industrial Automation and PLC Nodes, Audio and Speech Processing, Test and Measurement Instruments.
Dual Motor Control Drives
The DSPIC33EP512MU810-E/BG is purpose-built for dual motor control: Microchip explicitly markets this device as a 'DSC with Dual Motor Control', and its high-speed PWM peripherals plus the 70 MIPS DSP core with single-cycle MAC execute field-oriented control (FOC) loops fast enough for PMSM, BLDC, and ACIM drives. Two independent motors can be controlled from one chip, halving controller cost versus two-MCU solutions. The -E grade (-40C to +125C) suits enclosed drives and automotive actuators. Place the DSC between gate drivers and the CAN bus, using the dual CAN modules for networked drive coordination; the deterministic interrupt latency of the dsPIC33E core keeps current-loop bandwidth consistent across the PWM period.
Recommended
Digital Power Conversion
Solar inverters, telecom rectifiers, and high-density DC-DC systems benefit from the DSPIC33EP512MU810-E/BG's combination of a 70 MIPS DSP engine and high-resolution PWM. Compensation loops for PFC and LLC stages require fast multiply-accumulate throughput, which the dsPIC33E core delivers with deterministic execution, unlike software-filtered general-purpose MCUs. The 3.0V to 3.6V supply and 51 I/O allow direct interface with gate-driver ICs and feedback dividers, while 512 KB Flash holds multiple firmware profiles (e.g., buck, boost, inverter modes) in one unit. The -E temperature grade supports outdoor solar combiner boxes where ambient temperatures regularly exceed 85C during peak irradiance.
Recommended
Automotive CAN/USB Gateways
The DSPIC33EP512MU810-E/BG integrates two CAN 2.0B controllers and a full-speed USB 2.0 OTG module that can operate simultaneously, making it a compact gateway between vehicle CAN buses and USB diagnostic or telematics links. Distributor listings (Hotenda) categorize the part as automotive, AEC-Q100 capable, with the -E grade covering the -40C to +125C under-hood-adjacent range. The 52 KB SRAM buffers CAN message queues and USB endpoint data without external memory, and dual CAN enables OBD-II plus body-bus bridging in one device. Confirm Microchip's formal qualification scope and PPAP availability before releasing safety-relevant production programs.
Recommended
Industrial Automation and PLC Nodes
Factory automation nodes use the DSPIC33EP512MU810-E/BG where sensor acquisition, motor actuation, and network communication converge. The 70 MIPS core executes digital filters and PID loops with predictable timing; dual CAN connects to industrial fieldbuses; and USB OTG provides local configuration or data-logging links to panel PCs. The nanoWatt XLP technology reduces standby consumption in always-on monitoring nodes, and 512 KB Flash supports field-updatable firmware with an in-application bootloader. The 121-ball TFBGA (10x10 mm) keeps board area small for distributed I/O modules, while 51 I/O lines handle direct switch, encoder, and relay interfacing without port expanders.
Recommended
Audio and Speech Processing
The dsPIC33E architecture is documented by Microchip as targeting digital audio and speech processing, and the DSPIC33EP512MU810-E/BG fits this role with its single-cycle MAC, dual 40-bit accumulators, and DSP-style addressing modes. Audio effects, echo cancellation, and speech compression run comfortably within the 70 MIPS budget, while 52 KB SRAM buffers delay lines and filter states. The integrated USB OTG module enables direct USB audio class connectivity to hosts, eliminating an external USB bridge chip - a common cost saving in conference systems and intercoms. The 121-ball BGA footprint suits compact ceiling and wall-mounted audio hardware where board space is constrained.
Recommended
Test and Measurement Instruments
Handheld and bench instruments use the DSPIC33EP512MU810-E/BG as a real-time control and signal-processing engine. The 70 MIPS DSP core handles FFT-based analysis, digital filtering, and calibration math with deterministic latency, while the high-speed PWM generates stimulus signals for sensor excitation. USB OTG provides a direct instrument-to-PC data link, and dual CAN supports automotive diagnostic tools that must speak to vehicle buses. The extended -40C to +125C range (E grade) allows battery-powered field instruments to survive hot-vehicle and cold-storage environments. The MA330025-1 development module lets instrument teams prototype control firmware before committing to a custom BGA board.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512MU810-E/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP512MU810-I/BG | DSPIC33EP512GM310-E/BG |
|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-BGA - same footprint family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory | 512 KB (170K x 24) Flash | 512 KB (170K x 24) Flash | 512 KB (170K x 24) Flash |
| SRAM | 52 KB | 52 KB | 52 KB |
| CPU Performance | 70 MIPS / 60 MHz clock | 70 MIPS / 60 MHz clock | 70 MIPS (same dsPIC33E core) |
| Temperature Range | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
Key Differentiators
- Extended -40C to +125C temperature grade in the full 512 KB memory configuration (vs DSPIC33EP512MU810-I/BG)
- Integrated USB OTG plus dual CAN in one DSC (vs DSPIC33EP512GM310-E/BG)
- 70 MIPS DSP engine with dedicated motor-control PWM (vs DSPIC33EP512MU810-I/BG)
Design Notes
The 121-ball TFBGA (10x10 mm, 0.8 mm ball pitch class) demands disciplined fanout. Plan escape routing before finalizing schematic pin-mux assignments: use via-in-pad or dog-bone fanout, keep a minimum of one solid ground plane directly beneath the die for return paths, and group VDD/VSS decoupling (100 nF per supply ball pair) on the second layer to shorten the loop. Estimated: with 0.9 mm package height per distributor package data, keep mating connector clearances in mind for reflow-profile verification.
The -E grade guarantees operation to +125C ambient, but junction temperature is dominated by core plus I/O current. Estimated: at 60 MHz with heavy I/O loading, dissipation typically stays in the hundreds of milliwatts, which a 4-layer board with grounded thermal balls can absorb without a heatsink; verify with Microchip's power estimation spreadsheet using your actual clock, peripheral, and I/O budget before finalizing enclosure design.
Three recurring mistakes: (1) ignoring supply-voltage range - the dsPIC33E family is a strict 3.0V to 3.6V device; 5V I/O will damage pins, so level-shift 5V interfaces. (2) Assuming MUs-series peripherals map to GM-series pins - when considering the DSPIC33EP512GM310-E/BG alternative, re-verify every pin-mux assignment in the schematic. (3) Using the -I variant in >85C environments to save cost - the temperature derating will cause field failures. Confirm AEC-Q100/PPAP scope with Microchip for automotive releases.
Compliance Information
Distributor listings (Hotenda) categorize the part as Automotive, AEC-Q100 capable. RoHS/lead-free status per standard Microchip current production; verify formal qualification documents and REACH declarations with Microchip for regulated programs.
