DSPIC33EP32GP504-E/ML - 16-bit DSC 32KB 60MHz QFN-44 | Microchip
MPN: DSPIC33EP32GP504-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.95 | $2.95 |
| 10 | $2.66 | $26.60 |
| 100 | $2.39 | $239.00 |
| 500 | $2.15 | $1,075.00 |
| 1,000 | $1.95 | $1,950.00 |
DSPIC33EP32GP504-E/ML Overview
A digital signal controller combines the control peripherals of a microcontroller with the multiply-accumulate DSP engine of a digital signal processor. In the embedded system hierarchy, the DSC sits between general-purpose MCUs and dedicated DSPs, making it the preferred choice for closed-loop control loops - such as digital power conversion and motor control - that need both fast mathematical processing and rich analog integration on a single chip.
Key features include the 16-bit DSP engine with hardware multiply and divide, 32KB of self-programmable Flash, 4KB of on-chip RAM, and four DMA channels that offload data movement from the CPU. Five timers, multiple UART, SPI, and I2C serial interfaces, and a CAN 2.0B controller support industrial networking. The integrated op amps and comparators reduce external analog component count in current-sense and protection circuits.
Architecturally, the dsPIC33EP family uses a modified Harvard pipeline with 16-bit data paths and separate program memory, executing from CMOS Flash at up to 60 MHz (20 MIPS at 3.3V operation per family data sheet DS70000657J). The high-resolution PWM module targets switch-mode power supplies and motor inverters.
Typical applications include brushless DC and PMSM motor control, digital SMPS and power factor correction, and CAN-networked industrial and automotive body nodes, where the extended -40C to +125C E-grade rating and integrated analog reduce BOM cost.
Design consideration: budget the 4KB RAM carefully - DMA buffers, CAN FIFOs, and DSP delay lines compete for the same on-chip SRAM, so map memory usage early in the project.
This page synthesizes verified distributor pricing, drop-in family alternatives, and practical design guidance not consolidated on the manufacturer product page alone.
Drop-in alternatives for DSPIC33EP32GP504-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP32GP504-E/ML (same form factor and footprint) — differing in Package, Operating Temperature, Core, Core Architecture, Maximum CPU Speed.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP32GP504-I/ML
✅ Drop-In✓ In Stock
$3.05 / Unit
View Datasheet →DSPIC33EP64GP504-E/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GP504-E/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.28 / Unit
View Datasheet →DSPIC33EP32MC504-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP32GS504-E/ML
✅ Drop-In✓ In Stock
$3.75 / Unit
View Datasheet →DSPIC33EP32GP504-E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33E DSC with DSP engine |
| Program Memory (Flash) | 32 KB |
| Data RAM | 4 KB |
| Maximum CPU Speed | 60 MHz core clock |
| Package | 44-QFN (ML), 8 x 8 mm |
| Pin Count | 44 |
| Operating Temperature Range | -40C to +125C (E grade) |
| Timers | 5 timers |
| DMA Channels | 4 |
| Communication Interfaces | I2C, SPI, UART/USART, IrDA, CAN |
| Analog Peripherals | Op amps, comparators, 10/12-bit ADC |
| PWM | High-speed PWM |
| Peripheral Trigger Generator | PTG included |
| Technology | CMOS |
| Low Power Modes | Supported |
| Mounting Type | Surface Mount |
| Lifecycle Status | In Production (per Microchip product page) |
DSPIC33EP32GP504-E/ML 44-qfn (ml), 8 x 8 mm Pin Configuration Guide
Pin configuration for DSPIC33EP32GP504-E/ML (44-qfn (ml), 8 x 8 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP32GP504-E/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP32GP504-E/ML is suitable for 6 applications: BLDC/PMSM Motor Control, Digital Switch-Mode Power Supplies, CAN-Networked Industrial Nodes, Analog Sensor Acquisition Front Ends, Automotive Body and Auxiliary Electronics, General Embedded Control and IoT Nodes.
BLDC/PMSM Motor Control
The DSPIC33EP32GP504-E/ML fits brushless DC and permanent-magnet synchronous motor drives because its 60 MHz DSP core executes field-oriented control loops with hardware multiply-accumulate, while the high-speed PWM module generates complementary outputs with dead-time control. On-chip op amps amplify low-level current-shunt signals directly, and comparators provide cycle-by-cycle overcurrent trip without CPU intervention, cutting external component count. Four DMA channels stream ADC conversion results into RAM, keeping ISR latency low during commutation. Place the controller near the gate drivers with short PWM traces, allocate the 4KB RAM between the FOC state machine and DMA sample buffers, and use the -E grade -40C to +125C rating for drive enclosures that run hot.
Recommended
Digital Switch-Mode Power Supplies
For digital SMPS and power-factor-correction stages, the DSPIC33EP32GP504-E/ML provides the control loop elements digital power needs: high-resolution PWM with phase-shifted outputs, a fast ADC sequenced by the PTG (Peripheral Trigger Generator) for deterministic sampling instants, and a DSP engine that closes voltage and current loops at tens of kilohertz. The op amps condition inductor current feedback on-chip, while comparators implement hardware overcurrent shutdown in nanoseconds, independent of firmware. Where a design is SMPS-dedicated, the pin-compatible DSPIC33EP32GS504 offers power-specific peripheral variants on the same footprint. Budget the 4KB RAM for compensator state and data logging, and keep the PWM output routing short to minimize ringing at the gate-driver inputs.
Recommended
CAN-Networked Industrial Nodes
The integrated CAN 2.0B controller with DMA support makes the DSPIC33EP32GP504-E/ML a compact industrial field node: sensor data acquired through the ADC and conditioned by the on-chip op amps is packetized and transmitted on a CAN bus without CPU-heavy bit-banging. The 60 MHz core simultaneously runs local control logic, and the extended -40C to +125C E-grade suits junction boxes and drive cabinets near heat sources. Implement the physical layer with an external CAN transceiver and add a 0.1uF/10uF decoupling pair per Microchip layout guidance. When firmware grows beyond 32KB, drop in the footprint-identical DSPIC33EP64GP504 or 128GP504 variant without PCB redesign.
Recommended
Analog Sensor Acquisition Front Ends
With integrated op amps, comparators, and a multi-channel ADC, the DSPIC33EP32GP504-E/ML consolidates a complete sensor front end: gain stages for bridge or shunt sensors are realized on-chip, the ADC samples multiple channels under PTG or DMA control for jitter-free timing, and comparators implement threshold alarms without software latency. This suits load-cell interfaces, pressure and temperature nodes, and current monitoring in industrial equipment. The 60 MHz core applies filtering and linearization in firmware, and the 32KB Flash holds calibration tables and communication stacks. For highest accuracy, keep analog routing away from PWM traces, use the internal reference or an external precision reference, and exploit the four DMA channels to build glitch-free sample buffers.
Recommended
Automotive Body and Auxiliary Electronics
The extended -40C to +125C operating range of the -E/ML grade qualifies the DSPIC33EP32GP504-E/ML for automotive-adjacent auxiliary electronics: body-control sub-nodes, lighting controllers, and pump or fan control modules exposed to under-hood temperatures. The high-speed PWM drives lamp or motor loads via external drivers, the CAN interface connects to vehicle networks, and comparators implement hardware fault detection for load shorts. Microchip's automotive-adjacent ecosystem, including the MPLAB Snap debugger for low-cost production programming, keeps tooling costs down. Verify AEC-Q100 requirements separately - the standard catalog part is not automatically automotive-qualified - and use the E-grade rating headroom plus proper PCB thermal relief to manage junction temperature in sealed modules.
Recommended
General Embedded Control and IoT Nodes
Beyond dedicated control loops, the DSPIC33EP32GP504-E/ML serves as a general embedded controller where UART, SPI, and I2C links connect displays, EEPROMs, radios, and peripherals, and the 60 MHz core with DSP instructions accelerates filtering and protocol processing. Five timers handle scheduling, PWM dimming, and measurement capture; the PTG automates sequences to offload the CPU for lower power consumption between wakeups, complementing the family's supported low-power modes. Production support through MPLAB X IDE and the MPLAB Snap programmer enables fast in-circuit reprogramming. Use the four DMA channels to service serial and ADC traffic, reserve RAM headroom for buffers before adding features, and rely on the QFN-44 footprint's family compatibility for future Flash upgrades.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP32GP504-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP32GP504-I/ML | DSPIC33EP64GP504-E/ML | DSPIC33EP32MC504-E/ML | DSPIC33EP32GS504-E/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (ML) 8x8 mm | 44-QFN (ML) 8x8 mm - same | 44-QFN (ML) 8x8 mm - same | 44-QFN (ML) 8x8 mm - same | 44-QFN (ML) 8x8 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 32 KB | 32 KB | 64 KB | 32 KB | 32 KB |
| Data RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Core Speed | 60 MHz | 60 MHz | 60 MHz | 60 MHz | 60 MHz |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Peripheral Focus | General purpose + op amps, PTG, CAN | Identical GP peripheral set | Identical GP peripheral set | Motor-control oriented | SMPS / digital power oriented |
| Communication Interfaces | UART, SPI, I2C, IrDA, CAN | UART, SPI, I2C, IrDA, CAN | UART, SPI, I2C, IrDA, CAN | UART, SPI, I2C, CAN | UART, SPI, I2C, CAN |
Key Differentiators
- Extended temperature rating for hot environments (vs DSPIC33EP32GP504-I/ML)
- Flash headroom without PCB change (vs DSPIC33EP32GP504-E/ML vs DSPIC33EP64GP504-E/ML)
- Balanced general-purpose analog and control peripherals (vs DSPIC33EP32MC504-E/ML)
- Trade-off: not the digital-power specialist (vs DSPIC33EP32GS504-E/ML)
Design Notes
Decouple every VDD/VSS pair on the 44-pin QFN with a 0.1uF ceramic capacitor placed within 2 mm of the pin, plus one bulk 4.7uF-10uF capacitor per supply domain. The dsPIC33EP core at 60 MHz draws transient currents on every instruction cycle; Microchip's family data sheet DS70000657J recommends a low-impedance supply network to avoid brown-out resets during DMA bursts. If switching regulators share the board, add an LC filter or ferrite bead on the controller supply to suppress ripple coupling into the ADC.
Solder the QFN center thermal pad to a ground array of at least a 4x4 via matrix - this exposed pad is the primary thermal and ground path, not optional. Keep the analog op-amp inputs routed away from high-speed PWM traces; the on-chip analog peripherals are only as clean as the PCB layout around their pins. Provide programming access to PGC/PGD pins with a standard 5-pin footprint compatible with the MPLAB Snap debugger, so production programming and field diagnostics need no board rework.
The 4KB RAM is the most common design bottleneck on this part: CAN message buffers, DMA ADC buffers, and DSP delay lines all share the same SRAM. Estimate: a 64-sample FOC buffer per current loop plus 29 CAN message buffers already consumes a meaningful fraction of 4096 bytes - map linker sections early with MPLAB X memory views. Also remember the -E grade is rated to +125C but internal power dissipation still raises junction temperature; verify thermal margin with the actual clock and I/O loading in your enclosure.
High-speed PWM outputs driving long traces to gate drivers will ring at edges; add small series resistors (10-22 ohm, estimated values) at the controller pins to damp reflections, and route PWM pairs with ground return references. For CAN, terminate the bus at both ends with 120 ohm and keep the transceiver within a few centimeters of the CAN TX/RX pins. Use the PTG to trigger ADC sampling synchronously with PWM centers, which avoids switching-noise-corrupted conversions entirely.
Compliance Information
Standard current-production Microchip catalog part supplied in RoHS-compliant lead-free QFN packaging per distributor listings (LCSC, Mouser). Formal REACH and conflict-minerals declarations should be obtained via Microchip compliance documentation; not stated in the provided verified data.
