DSPIC33EP32GS502T-E/MX - 16-bit 60MIPS Digital Power DSC | Microchip
MPN: DSPIC33EP32GS502T-E/MX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.18 | $41.80 |
| 100 | $3.74 | $374.00 |
| 500 | $3.42 | $1,710.00 |
| 1,000 | $3.08 | $3,080.00 |
DSPIC33EP32GS502T-E/MX Overview
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and control peripherals of a microcontroller. Within the power-management hierarchy, the dsPIC33EP GS family sits between general-purpose MCUs and dedicated digital power ICs: it runs closed-loop control firmware for switch-mode power supplies, power factor correction stages, and motor drives, replacing analog control loops with software-defined control.
Key differentiating features include the interconnected high-speed PWM module designed for power topologies such as buck, boost, half-bridge, and interleaved PFC; an ADC with programmable gain amplifier (PGA) and comparators that can trigger PWM updates without CPU intervention; and AEC-Q100 automotive qualification with an extended -40C to +125C operating range denoted by the E temperature suffix.
Architecturally, the device uses the enhanced dsPIC33E 16-bit core with DSP instruction support (MAC, multiply-divide) for fast control-loop execution, plus DMA for autonomous data movement between the ADC and RAM. The GS family datasheet (document 70005127) describes the interconnected PWM, ADC, PGA, and comparator resources designed specifically for digital power applications.
Typical applications include interleaved power factor correction (Microchip's 350W Interleaved PFC reference design uses this family), DC-DC converters, LED drivers, and AC-DC power supplies requiring software-controlled feedback loops.
Design consideration: the 28-UQFN exposed pad must be soldered to a solid ground plane for thermal and electrical performance; follow the GS50x family datasheet layout guidance for the analog (AVDD/AVSS) supply filtering to preserve ADC accuracy.
This page synthesizes distributor listings, drop-in same-package alternatives, and digital-power design notes not consolidated on the manufacturer product page.
Drop-in alternatives for DSPIC33EP32GS502T-E/MX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP32GS502T-I/MX
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP64GS502T-I/MX
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GS502-I/MX
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GS502T-E/MX
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →DSPIC33EP32GS502T-E/MX Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC |
| Max CPU Speed | 60 MIPS |
| Program Memory (Flash) | 32 KB (32K x 8) |
| Supply Voltage | 3.3 V |
| Package | 28-UQFN (6x6 mm) Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (E grade) |
| Qualification | AEC-Q100, Automotive |
| PWM Module | High-Speed PWM for digital power (GS family) |
| ADC | ADC with PGA and comparators (GS family) |
| Special Features | Functional Safety (FuSa) capable, DSP engine, DMA |
| Product Family | dsPIC 33EP, GS series |
| Packaging | Tape and Reel (T suffix) |
DSPIC33EP32GS502T-E/MX 28-uqfn (6x6 mm) exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP32GS502T-E/MX (28-uqfn (6x6 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP32GS502T-E/MX.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP32GS502T-E/MX is suitable for 6 applications: Interleaved Power Factor Correction, AC-DC and DC-DC Power Supplies, LED Driver Power Control, Battery Chargers, Industrial Motor Control, Automotive Power Modules.
Interleaved Power Factor Correction
The DSPIC33EP32GS502T-E/MX is a natural fit for interleaved PFC because its high-speed PWM module generates multiple phase-shifted drive outputs with programmable dead time, while the fast ADC with PGA samples inductor current and bus voltage synchronously with the switching period. Microchip's 350W Interleaved PFC reference design for SMPS dsPIC DSCs demonstrates this topology with universal AC input and a single high-voltage DC output, proving the family's suitability. The interconnected comparators provide cycle-by-cycle overcurrent protection without CPU latency, essential at high switching frequencies. Firmware-implemented average-current-mode control also allows adaptive gain scheduling across the universal input range, something fixed-function analog controllers cannot offer.
Recommended
AC-DC and DC-DC Power Supplies
In isolated and non-isolated switch-mode power supplies, the DSPIC33EP32GS502T-E/MX replaces analog PWM controllers with firmware-defined voltage-mode or current-mode control. The ADC-plus-PGA path amplifies shunt or divider feedback signals internally, and the high-resolution PWM supports frequency and duty-cycle dithering for EMI reduction. Digital control enables non-linear gain scheduling, burst mode at light load, and PMBus-style telemetry without extra circuitry. The 60 MIPS core closes voltage loops at bandwidths well beyond typical 10 kHz requirements, while hardware comparators keep per-cycle current limiting active even if firmware stalls, meeting safety expectations for offline power conversion designs.
Recommended
LED Driver Power Control
Digitally controlled LED drivers benefit from the DSPIC33EP32GS502T-E/MX's precise high-speed PWM, which supports both constant-current regulation and dimming generation from the same controller. The ADC samples current sense feedback to hold LED current within tight tolerance despite forward-voltage variation with temperature, and the PWM resolution enables flicker-free dimming above the 100 Hz human-perception threshold. Because control parameters are firmware-defined, one hardware design can serve multiple LED load profiles, luminaire sizes, and dimming interfaces (0-10 V, DALI-like UART protocols, or PWM input). The E temperature grade supports enclosed luminaire environments reaching 105C ambient near the driver stage.
Recommended
Battery Chargers
Smart battery chargers require multi-stage control (pre-charge, constant current, constant voltage, termination) that is simpler to implement in firmware than with analog state machines. The DSPIC33EP32GS502T-E/MX executes these charge profiles in software while its PWM and comparator hardware enforces fast overcurrent and overvoltage protection. The 12-bit-class ADC path with PGA reads pack current and voltage with adequate resolution for 1% termination accuracy, and on-chip UART or I2C communicates charge status to a host. The AEC-Q100-qualified E-grade device also supports automotive onboard chargers and 12V accessory-port chargers exposed to extended under-hood temperature ranges.
Recommended
Industrial Motor Control
For low-power BLDC, PMSM, and ACIM drives, the DSPIC33EP32GS502T-E/MX provides complementary or center-aligned PWM outputs with programmable dead time for three-phase inverters, while the fast ADC triggers phase-current sampling at PWM midpoints to avoid switching noise. The DSP engine executes field-oriented control (FOC) transforms (Clarke, Park, PI loops) at 60 MIPS with margin for 20 kHz-class loops. Hardware comparators implement overcurrent trip without software latency. The 28-pin UQFN footprint suits compact integrated drive modules, and the extended -40C to +125C range covers sealed industrial actuators and fan/pump drives mounted near power stages.
Recommended
Automotive Power Modules
The AEC-Q100-qualified DSPIC33EP32GS502T-E/MX targets automotive subsystems performing local power conversion and supervision: door-zone LED modules, heated-seat controllers, small DC-DC point-of-load converters, and auxiliary pump controllers. The E temperature rating (-40C to +125C) matches typical automotive module ambient requirements, and the GS family's hardware protection resources (comparator trip, PWM fault inputs) support fail-safe behavior expected in vehicle environments. Distributor listings such as Hotenda explicitly classify this part as Automotive, AEC-Q100 within the dsPIC33EP series, simplifying qualification documentation. Firmware-updatable control behavior also supports late-stage requirement changes during vehicle programs.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP32GS502T-E/MX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP32GS502T-I/MX | DSPIC33EP64GS502T-I/MX | DSPIC33EP32GS502-I/MX |
|---|---|---|---|---|
| Package | 28-UQFN (6x6) | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 32 KB | 32 KB | 64 KB | 32 KB |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| AEC-Q100 Automotive | Yes | I grade - standard industrial | I grade - standard industrial | I grade - standard industrial |
| High-Speed PWM (GS family) | Yes | Yes | Yes | Yes |
| Packaging Format | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tube / Tray (non-T) |
Key Differentiators
- Extended automotive temperature range (vs DSPIC33EP32GS502T-I/MX)
- Digital power peripheral fabric (vs DSPIC33EP32GP502)
- Flash upgrade path without respin (vs DSPIC33EP64GS502T-I/MX)
Design Notes
The 28-UQFN exposed pad must connect to a contiguous ground plane through an array of thermal vias (typically 4-9 vias under the pad). Because this is a digital power controller, keep the analog supply pins (AVDD/AVSS) on a filtered 3.3V branch with a ferrite bead and 100 nF + 1 uF decoupling per the GS50x family datasheet layout recommendations, and route ADC sense lines away from PWM gate-drive traces to prevent switching noise from corrupting feedback samples.
Place the current-shunt feedback network for the PGA inputs as close to the device as possible and use Kelvin connections at the shunt resistor. Trigger ADC sampling synchronously with the PWM period (mid-point of center-aligned PWM) rather than free-running; this is the technique used in Microchip's Interleaved PFC reference design to avoid sampling during switch transitions. Verify PGD/EMUD programming pin assignments early, as UQFN packages multiplex many functions onto limited pins.
Do not confuse the E and I temperature grades during procurement: both ship in the identical MX UQFN package, but the I grade is limited to +85C and will not survive enclosure ambients near power stages. Also, the GS502 (digital power) and GP502 (general purpose) are NOT interchangeable despite similar ordering codes - pinout and peripheral fabric differ. Reserve firmware margin within 32KB Flash; if protocols or telemetry grow, the pin-compatible 64KB DSPIC33EP64GS502 avoids a PCB respin.
Compliance Information
Distributor listing (Hotenda) identifies the part as Automotive, AEC-Q100 within the dsPIC33EP series. RoHS/REACH status not stated in provided data; verify on the Microchip product page.
