DSPIC33EP512MU810-I/BG - 16-bit 70 MIPS DSC, 512KB Flash | Microchip
MPN: DSPIC33EP512MU810-I/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.55 | $8.55 |
| 10 | $7.75 | $77.50 |
| 100 | $6.9 | $690.00 |
| 500 | $6.3 | $3,150.00 |
| 1,000 | $5.8 | $5,800.00 |
DSPIC33EP512MU810-I/BG Overview
A digital signal controller combines the computational throughput of a digital signal processor (DSP) with the peripheral integration and ease of use of a microcontroller (MCU). Within the embedded hierarchy, the dsPIC33EP family sits between general-purpose 16-bit MCUs and dedicated DSPs, executing digital filter algorithms, fast control loops, and audio/speech processing with a modified Harvard architecture and a C-compiler-optimized instruction set.
Key features include a 16-bit data path with 24-bit-wide instructions, linear program memory addressing up to 4 M instruction words, dual CAN 2.0B modules, full-speed USB, 15-channel DMA, and motor-control PWM peripherals. Mouser lists the device as a 100P, 512 KB flash, 52 KB RAM, 60 MHz part with USB, and the 'MU' suffix identifies USB and dual motor-control capability per Microchip's product page.
Architecturally, the dsPIC33EP core supports single-cycle MAC, hardware divide, and DSP addressing modes, letting a single chip close high-speed current loops for FOC motor control while simultaneously servicing USB or dual CAN communication. The extensive DMA controller offloads data movement between peripherals and RAM, preserving CPU cycles for control math.
Typical applications include precision motor control (the PIM infosheet notes compatibility with Microchip MCLV DM330021, MCHV DM330023, and MCSM DM330022 development boards), industrial automation and CAN networking nodes, and digital power supplies / USB-connected instrumentation.
Design consideration: BGA packages require controlled-impedance PCB fabrication with fine-pitch via-in-pad or dog-bone fanout; if your process cannot support 121-ball TFBGA assembly, the same die is available in a 100-pin TQFP (DSPIC33EP512MU810-I/PT), which is functionally equivalent but not footprint-compatible.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP512MU810-I/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512MU810-I/BG (same form factor and footprint) — differing in Qualification, Core, DMA Channels, Operating Temperature, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256MU810-I/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP512MU811-I/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MU811-I/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP512GM310-E/BG
✅ Drop-In✓ In Stock
$5.95 / Unit
View Datasheet →PIC24EP512GU810-I/BG
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP512MU810-I/BG Maximum Ratings & Electrical Characteristics
| Core Processor | dsPIC33EP 16-bit DSC core |
| Core Architecture | Modified Harvard, 16-bit data path, 24-bit instructions |
| Maximum Performance | 70 MIPS (DigiKey); core clock 60 MHz (Mouser) |
| Program Memory Size | 512 KB (170K x 24) Flash |
| RAM Size | 52 KB |
| Connectivity | USB, 2x CAN, UART, SPI, I2C |
| DMA Channels | 15 |
| Operating Temperature | -40C to +85C (I suffix, industrial) |
| Package | 121-TFBGA (10x10 mm) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Series | dsPIC 33EP (dsPIC33E MU family) |
| Motor Control Peripherals | Dual motor control, high-speed PWM |
| Program Memory Addressing | Linear up to 4 M instruction words |
DSPIC33EP512MU810-I/BG 121-tfbga (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP512MU810-I/BG (121-tfbga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP512MU810-I/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP512MU810-I/BG is suitable for 6 applications: Precision Motor Control (FOC / BLDC / PMSM), Industrial CAN Networking Nodes, USB-Connected Instruments and Data Loggers, Digital Power Supplies and Converters, Digital Audio and Speech Processing, Automated Test and Embedded Control Systems.
Precision Motor Control (FOC / BLDC / PMSM)
The DSPIC33EP512MU810-I/BG is purpose-built for field-oriented control of BLDC and PMSM motors. Its 70 MIPS dsPIC33EP core executes single-cycle MAC and hardware divide, closing current loops at 10-20 kHz PWM rates with margin for position estimation. Dual motor-control PWM modules drive two independent three-phase inverters, while the 15-channel DMA moves ADC results to RAM without stealing CPU cycles. Microchip's PIM infosheet confirms compatibility with the MCLV (DM330021), MCHV (DM330023), and MCSM (DM330022) development boards, letting engineers validate firmware on standard hardware before PCB spin. The 52 KB RAM buffers control-state data and communication stacks concurrently.
Recommended
Industrial CAN Networking Nodes
With two independent CAN 2.0B controllers, the MU810 can act as a gateway or bridge between two CAN segments while running local control code. The 70 MIPS core services both CAN message filters plus a USB or UART uplink, and DMA channels offload receive buffers so no mailbox overruns occur during bus bursts. The 512 KB flash stores extensive protocol stacks (CANopen, DeviceNet-style layers) plus OTA-updatable application code. Industrial -40C to +85C temperature rating (I suffix) suits factory-floor and outdoor enclosures. Place a 3.3 V LDO and TVS on the transceiver rails; the DSC core tolerates typical industrial supply variation per the family datasheet.
Recommended
USB-Connected Instruments and Data Loggers
The integrated full-speed USB module makes the DSPIC33EP512MU810-I/BG a compact single-chip data-acquisition front end. The 15-channel DMA streams multi-channel ADC samples directly to the 52 KB RAM ring buffers while the USB endpoint serves them to a host at full-speed 12 Mbps, sustaining continuous logging without CPU memcpy overhead. The 512 KB flash hosts both the application and a boot-loader for field firmware updates over the same USB port. Typical uses include bench instrumentation, sensor loggers, and motor-drive commissioning tools where the engineer browses captured waveforms over USB. Keep USB D+/D- traces 90-ohm differential and route away from PWM lines.
Recommended
Digital Power Supplies and Converters
High-speed PWM peripherals with fine duty-cycle and dead-time resolution make the MU810 effective as the digital controller for LLC, buck, and PFC stages. The 70 MIPS core runs compensator math (PI/PID or 3p3z) inside each PWM cycle at switching frequencies of hundreds of kHz, while ADC-trigger synchronization to the PWM module samples current and voltage at optimal points, minimizing switching-noise corruption. Dual motor-control PWM blocks also support interleaved multi-phase converters. The 12 distributors listed on Octopart reflect steady demand for this part in digital-power designs. Use differential ADC inputs and keep the analog ground plane clean for best SNR.
Recommended
Digital Audio and Speech Processing
Microchip describes the dsPIC33EP family as designed to execute digital audio and speech processing. The single-cycle MAC, dual operand fetch, and bit-reversed addressing implement FIR/IIR filters and FFTs efficiently; 70 MIPS sustains real-time multi-band processing of 48 kHz stereo streams. The 512 KB flash holds code plus coefficient tables, and 52 KB RAM supports double-buffered audio frames with DMA-driven I2S-style data flow through SPI/DCI peripherals. Applications include active noise cancellation, loudspeaker management, and voice-band communication equipment. For clean audio performance, isolate the ADC reference with an RC filter and route PWM/clock lines away from the analog input section.
Recommended
Automated Test and Embedded Control Systems
The MU810 serves as the controller core for test fixtures, environmental chambers, and general automation nodes that mix sensing, actuation, and connectivity. Five UART-class serial ports plus SPI and I2C buses talk to sensors, drivers, and HMIs simultaneously; dual CAN plus USB connect it to factory networks and PCs without external bridge chips. The 70 MIPS core handles state machines, PID loops, and CRC-checked protocol framing in a single device, reducing BOM count versus MCU-plus-DSP two-chip solutions. The 121-ball TFBGA conserves board area in dense rack assemblies; alternatively the same die in 100-TQFP (-I/PT) eases rework during development iterations.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512MU810-I/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256MU810-I/BG | DSPIC33EP512MU811-I/BG | DSPIC33EP512GM310-E/BG | PIC24EP512GU810-I/BG |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA - same | 121-TFBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 512 KB (170K x 24) | 256 KB | 512 KB | 512 KB | 512 KB |
| Core Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| DSP Instructions (MAC) | Yes (dsPIC DSC core) | Yes | Yes | Yes | No (PIC24 MCU core) |
| Automotive Grade | No (industrial I grade) | No | No | E grade option (extended temp) | No |
Key Differentiators
- DSP instructions with single-cycle MAC in 16-bit core (vs PIC24EP512GU810-I/BG)
- Double the program memory in the same BGA footprint (vs DSPIC33EP256MU810-I/BG)
- Dual motor-control PWM plus USB plus dual CAN in one chip (vs DSPIC33EP512GM310-E/BG)
Design Notes
The 121-ball TFBGA (10x10 mm, 0.8 mm ball pitch) requires via-in-pad or dog-bone fanout and a minimum 4-layer stack-up with dedicated ground plane for signal return. Plan escape routing before finalizing schematic pin usage: assign high-speed signals (USB D+/D-, PWM groups) to outer ball rows where possible. Include fiducials and a 0.1 mm solder-mask-defined pad per Microchip package outline drawing. If your CM cannot process BGA, switch to DSPIC33EP512MU810-I/PT (100-TQFP) BEFORE layout - the packages are not interchangeable.
Provide separate, star-connected supply rails for the VDD core/IO and the USB VUSB 3.3 V domain, with 0.1 uF ceramic decoupling at each VDD/VSS ball pair plus bulk 10 uF near the package. Follow the dsPIC33EP family datasheet power-up requirements - the device includes internal brown-out and POR supervision, but slow-rising rails below the brown-out threshold can cause erratic startup, so verify supply ramp time against the datasheet electrical characteristics section.
Route the high-speed PWM outputs to gate drivers as short, matched groups and keep them away from analog ADC input traces; motor-control ADC sampling is synchronized to PWM edges specifically to dodge switching noise, but board-level coupling defeats that benefit. USB D+/D- must be 90-ohm differential, length-matched within a few mm, with no stubs. Use the two ground balls nearest USB as the local return via landing.
Two recurring mistakes: (1) launching layout with the TQFP pinout and later switching to the BGA - pin maps differ and force redesign; freeze the package decision first. (2) Assuming the -I grade covers automotive: it is industrial (-40C to +85C) and not AEC-Q100 qualified; do not use this commercial part in automotive powertrain designs. Also verify the PIM jumper configuration (PIM_810_infosheet) differs for USB vs non-USB use when prototyping on MCLV/MCHV boards.
Compliance Information
Compliance certificates were not captured in the verified web data. The -I suffix denotes industrial temperature grade (-40C to +85C); this is a commercial/industrial part, not AEC-Q100 automotive qualified. Obtain official RoHS/REACH declarations via Microchip's Material Declaration Search for the exact part number.
