DSPIC33EP64GP503T-I/TL - 70 MIPS 16-bit DSC 64KB Flash | Microchip
MPN: DSPIC33EP64GP503T-I/TL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.2 | $6.20 |
| 10 | $5.6 | $56.00 |
| 100 | $4.95 | $495.00 |
| 500 | $4.4 | $2,200.00 |
| 1,000 | $3.9 | $3,900.00 |
DSPIC33EP64GP503T-I/TL Overview
A digital signal controller (DSC) combines the deterministic architecture of a microcontroller (MCU) with DSP-grade math capability in a single core. Within the power-management hierarchy of embedded systems, a DSC sits between a general-purpose MCU and a dedicated DSP: it runs real-time control loops (PID, field-oriented control) while managing communication and housekeeping tasks, making the dsPIC33E family a staple in motor control, digital power, and sensing applications.
Key features of this part include the highest-speed dsPIC33E 70 MIPS core, CAN 2.0B communication for automotive and industrial networks, a Charge Time Measurement Unit (CTMU) for capacitive touch and precise time measurement, integrated analog peripherals, and a Peripheral Trigger Generator (PTG) that automates peripheral sequencing to offload the CPU. The device operates from a 3V to 3.6V supply.
The dsPIC33EP architecture uses a modified Harvard pipeline with DSP multiply-accumulate instructions, enabling single-cycle MAC operations at 70 MIPS. According to Microchip, the family offers superior ADC performance compared to prior dsPIC33F generations, with faster conversion and richer analog integration suitable for closed-loop control.
Typical applications include brushless DC and PMSM motor control, digital power supplies (LLC, totem-pole PFC), automotive sensor nodes leveraging the AEC-Q100 qualification, and industrial HMI/touch interfaces using the CTMU.
Design consideration: at 70 MIPS the core is sensitive to supply integrity; use low-ESR decoupling on all VDD/VDDCORE pins and follow Microchip's oscillator layout guidance for the external crystal. The exposed pad must be soldered to a ground pour for thermal and EMI performance.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EP64GP503T-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64GP503T-I/TL (same form factor and footprint) — differing in Package, Operating Temperature, Packaging, Qualification, Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64GP503T-E/TL
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128GP503T-I/TL
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64MC503T-I/TL
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GP503T-I/TL
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.79 / Unit
View Datasheet →DSPIC33EP64GP503T-I/TL Maximum Ratings & Electrical Characteristics
| Core Processor | dsPIC33E (16-bit RISC DSC) |
| Maximum Speed | 70 MIPS |
| Program Memory (Flash) | 64 KB (22K x 24) |
| RAM | 4 KB |
| Supply Voltage | 3 V to 3.6 V |
| Package | 36-pin VTLA (QFN) with Exposed Pad |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T/R) |
| Qualification | AEC-Q100 (Automotive) |
| Operating Temperature | -40C to +85C (I grade) |
| CAN | Yes (ECAN 2.0B) |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator (PTG) | Yes |
| RoHS Status | Lead free / RoHS Compliant |
| Product Status | Active |
DSPIC33EP64GP503T-I/TL 36-pin vtla (qfn) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP64GP503T-I/TL (36-pin vtla (qfn) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64GP503T-I/TL.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64GP503T-I/TL is suitable for 6 applications: BLDC/PMSM Motor Control, Automotive Sensor and CAN Nodes, Digital Power Conversion, Capacitive Touch HMI, Industrial Sensing and Data Acquisition, Portable and Battery-Powered Instruments.
BLDC/PMSM Motor Control
The dsPIC33EP64GP503T-I/TL is a natural fit for field-oriented control of brushless DC and permanent-magnet synchronous motors. Its 70 MIPS DSP core executes single-cycle multiply-accumulate operations, sustaining FOC current loops at PWM frequencies of 20 kHz and above, while the dedicated motor-control PWM outputs drive three-phase inverters with dead-time control. The ADC can be synchronized to PWM events through the Peripheral Trigger Generator, sampling phase currents at the center of the PWM carrier for clean, ripple-free feedback. Engineers typically pair the DSC with a three-phase gate driver and current-sense amplifiers; the 3.0-3.6V supply integrates cleanly with 3.3V logic ecosystems. Compared to a general-purpose MCU, the DSC closes current loops deterministically without software jitter, improving torque ripple and efficiency. The AEC-Q100 qualification additionally permits automotive auxiliary motor applications such as pumps and HVAC blowers.
Recommended
Automotive Sensor and CAN Nodes
Because the DSPIC33EP64GP503T-I/TL is AEC-Q100 qualified, it is suitable for automotive body, sensing, and actuator nodes that must communicate over CAN. The integrated ECAN 2.0B controller implements full CAN with hardware message buffering, offloading the 70 MIPS core from bit-level protocol handling. The CTMU provides precise charge-time measurement for resistive/capacitive sensor front-ends, and the high-performance ADC digitizes analog sensor channels for condition reporting. The industrial -I temperature grade of -40C to +85C covers under-dash and engine-bay-adjacent zones, while the -E/TL variant extends this for harsher positions. Typical topology places the DSC behind an automotive-rated CAN transceiver, with local sensor inputs on the multiplexed analog pins. Firmware OTA-style field updates are supported through the self-programming Flash via ECAN bootloaders, a common pattern in production vehicle networks.
Recommended
Digital Power Conversion
In digital power supplies - LLC converters, totem-pole PFC stages, and synchronous buck regulators - the dsPIC33EP64GP503T-I/TL closes voltage and current loops in software with sub-PWM-cycle latency. The 70 MIPS core plus DSP MAC instructions implement 3-pole/3-zero compensators at switching frequencies of 100 kHz to 500 kHz, while the Peripheral Trigger Generator locks ADC sampling to the PWM waveform to reject switching ripple. The 3.0-3.6V core supply and 36-pin VTLA footprint keep the controller compact on dense power boards, with the exposed pad providing low-inductance ground return that reduces EMI. The 64KB Flash holds multiple operating profiles plus a communications stack (SMBus/I2C/UART) for telemetry to a host. Compared to analog control, this DSC enables adaptive mode switching, soft-start profiles, and per-unit calibration without hardware changes.
Recommended
Capacitive Touch HMI
The integrated Charge Time Measurement Unit (CTMU) makes the DSPIC33EP64GP503T-I/TL a self-contained capacitive touch controller for industrial and automotive human-machine interfaces. The CTMU injects a precise constant current into touch pads and measures charge time; firmware applies drift compensation and multi-key decoding without an external touch IC, cutting BOM cost and board area. At 70 MIPS, the core sustains scanning of multiple keys, LED feedback, and communication simultaneously, while 64KB Flash holds the full touch library plus application logic. The 36-pin VTLA package provides enough I/O for key matrices, backlight PWM, and buzzer outputs on a single chip. Designers should follow Microchip's touch sensing layout guidelines - ground hatching around pads and keeping CTMU channels away from switching nodes - to maximize sensitivity and ESD robustness. The AEC-Q100 qualification extends this use into automotive center-stack and steering-wheel controls.
Recommended
Industrial Sensing and Data Acquisition
For factory sensing nodes and portable data-acquisition instruments, the dsPIC33EP64GP503T-I/TL combines a high-performance ADC, 70 MIPS signal processing, and UART/SPI/I2C connectivity in one 3.3V device. Sensor front-ends (RTD bridges, strain gauges, pH probes) connect to the multiplexed analog inputs; the DSP core performs filtering, linearization, and FFT-based analysis on-chip, transmitting processed results over RS-485-style UART links or logging to external SPI Flash. The CTMU adds precise time/interval measurement for flow and time-of-flight sensors. The industrial -40C to +85C grade suits unconditioned cabinets and outdoor enclosures, and the 4KB RAM supports buffering bursts without external SRAM. Compared to an MCU-plus-external-DSP split, this single-chip approach reduces latency, board area, and firmware complexity. The exposed-pad QFN also improves thermal behavior in sealed enclosures with limited airflow.
Recommended
Portable and Battery-Powered Instruments
Handheld meters, logging instruments, and battery-powered controllers benefit from the DSPIC33EP64GP503T-I/TL's balance of compute and integration. The 3.0-3.6V supply matches a single lithium-ion cell through a low-cost LDO or buck, and the dsPIC33EP family provides power-managed sleep and idle modes that cut average draw between measurements. The 70 MIPS core processes ADC bursts rapidly so the device can return to sleep quickly - the standard duty-cycling strategy for extending battery life. The CTMU supports touch keys and battery impedance measurement, while UART/I2C interfaces connect to displays and radio modules. With 64KB Flash, a full instrument firmware including menus, calibration tables, and communication fits without external memory. The compact 6x6-class VTLA QFN keeps PCB area small for pocket-form-factor designs, and the exposed pad aids heat spreading during continuous measurement phases.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64GP503T-I/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64GP503T-E/TL | DSPIC33EP128GP503T-I/TL | DSPIC33EP64MC503T-I/TL | DSPIC33EP32GP503T-I/TL |
|---|---|---|---|---|---|
| Package | 36-pin VTLA (QFN-EP) | 36-pin VTLA (QFN-EP) - same | 36-pin VTLA (QFN-EP) - same | 36-pin VTLA (QFN-EP) - same | 36-pin VTLA (QFN-EP) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 64 KB (22K x 24) | 64 KB | 128 KB | 64 KB | 32 KB |
| Temperature Grade | -40C to +85C (I) | Extended / automotive (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Peripheral Focus | General Purpose (GP) | General Purpose (GP) | General Purpose (GP) | Motor Control (MC) PWM set | General Purpose (GP) |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
Key Differentiators
- Industrial temperature grade with tape-and-reel delivery (vs DSPIC33EP64GP503T-E/TL)
- Cost-optimized 64KB memory point (vs DSPIC33EP128GP503T-I/TL)
- General-purpose peripheral set including ECAN + CTMU + PTG (vs DSPIC33EP64MC503T-I/TL)
- Trade-off: smaller sibling exists for cost reduction only via memory loss (vs DSPIC33EP32GP503T-I/TL)
Design Notes
The dsPIC33EP requires regulated 3.0-3.6V on VDD and a regulated core supply pin (VDDCORE) that must use the capacitor values specified in the dsPIC33EP family datasheet hardware guidelines - an external LDO or the internal regulator per the chosen configuration. Place 0.1uF ceramic capacitors at every VDD/VSS pair plus one bulk 4.7-10uF at board entry. AVDD should be filtered from the digital rail with an RC or ferrite to preserve ADC accuracy, which matters for the CTMU and analog sensing use cases. Estimated: at 70 MIPS typical core current is tens of mA; budget rail droop below 3.0V during simultaneous Flash writes.
The exposed pad under the 36-pin VTLA QFN must be soldered to a solid ground pour - it is not optional. Use a via array (4-9 vias) in the pad to tie into inner ground planes; this provides both thermal relief for the core current and a low-inductance return path that reduces EMI at 70 MIPS clock rates. Solder paste segmentation into 3-4 smaller apertures prevents voiding and floating of the QFN body. Verify with X-ray on first-article builds, as a floating exposed pad is the most common assembly defect on VTLA packages.
Do not rely on default pin mappings: the dsPIC33EP uses Peripheral Pin Select (PPS), so UART, SPI, and many digital functions must be explicitly mapped in initialization code - a blank project with unconfigured PPS will show dead peripherals despite a working oscillator. Also confirm oscillator configuration fuses (primary vs FRC with PLL) before hardware freeze; a wrong clock configuration changes baud rates and PWM frequencies silently. Finally, when substituting the -E/TL for the -I/TL, re-verify maximum junction temperature derating against your enclosure thermal design.
Compliance Information
RoHS / lead-free status per YIC Electronics listing. AEC-Q100 automotive qualification stated in datasheets.com part description. REACH, halogen-free, and conflict-minerals status not stated in provided data.
