DSPIC33EV256GM002T-I/MM - 16-bit 70 MIPS 5V DSC 256KB | Microchip
MPN: DSPIC33EV256GM002T-I/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.1 | $4.10 |
| 10 | $3.78 | $37.80 |
| 100 | $3.45 | $345.00 |
| 500 | $3.15 | $1,575.00 |
| 1,000 | $2.88 | $2,880.00 |
DSPIC33EV256GM002T-I/MM Overview
A digital signal controller combines the computational throughput of a DSP core with the peripheral integration and deterministic interrupt handling of a microcontroller, occupying a middle tier in the embedded control hierarchy between general-purpose MCUs and application-specific DSPs. The dsPIC33EV series extends this concept to harsh electrical environments by operating directly from 5V supplies, eliminating an extra regulation stage in automotive and industrial systems.
Key features include a 4.5V to 5.5V operating supply, ECC (error-correcting code) Flash for functional-safety designs, up to three on-chip op amps, six motor-control PWM channels, the CTMU (Charge Time Measurement Unit) for capacitive touch and time measurement, and a SENT peripheral for automotive sensor interfaces. Four DMA channels offload data movement from the CPU, and seven timers support complex multi-axis control schemes.
Architecturally, the dsPIC33EV core executes an enhanced 16-bit instruction set with DSP multiply-accumulate (MAC) instructions and dual operand fetch, enabling single-cycle FIR filter taps and fast PID loops. The DSC is qualified as Functional Safety (FuSa) capable by DigiKey listing, and the industrial temperature grade (-40C to +85C) suits under-hood adjacent and factory-floor environments.
Typical applications include BLDC and PMSM motor control in appliances and power tools, automotive body and comfort modules using SENT, switch-mode power conversion, and industrial sensing nodes leveraging the CTMU for capacitive interfaces.
For design, budget the exposed pad as the primary thermal and ground path: a solid ground plane with multiple via stitching under the QFN-28 keeps junction temperature low at 70 MIPS operation.
This page synthesizes distributor inventory data, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EV256GM002T-I/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV256GM002T-I/MM (same form factor and footprint) — differing in Package, Operating Temperature, Timers, RAM, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV256GM002T-E/MM
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV256GM002T-M/MM
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV128GM102T-I/MM
✅ Drop-In✓ In Stock
$2.98 / Unit
View Datasheet →DSPIC33EV64GM002-I/MM
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.4 / Unit
View Datasheet →DSPIC33EV32GM002-I/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64MC502-E/MM
✅ Drop-In✓ In Stock
$3.05 / Unit
View Datasheet →DSPIC33EV256GM002T-I/MM Maximum Ratings & Electrical Characteristics
| Core | dsPIC33EV 16-bit DSC |
| Performance | 70 MIPS |
| Program Memory (Flash) | 256KB (85.5K x 24) with ECC |
| RAM | 16KB (16K x 8) |
| Supply Voltage Range | 4.5 V to 5.5 V |
| Operating Temperature | -40C to +85C (I grade) |
| Package | 28-QFN-S (6x6 mm) Exposed Pad |
| Mounting Type | Surface Mount |
| DMA Channels | 4 |
| Timers | 7 |
| External Interrupts | 3 |
| Motor Control PWM | 6 channels (MC PWM) |
| On-chip Op Amps | 3 |
| Special Peripherals | CTMU, SENT, ECC Flash |
| Functional Safety | FuSa capable |
| Packaging | Tape & Reel (T suffix) |
DSPIC33EV256GM002T-I/MM 28-qfn-s (6x6 mm) exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EV256GM002T-I/MM (28-qfn-s (6x6 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV256GM002T-I/MM.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV256GM002T-I/MM is suitable for 6 applications: BLDC/PMSM Motor Control, Automotive Body and Sensor Modules, Digital Power Conversion, Capacitive Touch and Sensing Nodes, Industrial Automation and Control Panels, Signal Processing and Smart Appliances.
BLDC/PMSM Motor Control
The DSPIC33EV256GM002T-I/MM fits three-phase motor control because it combines six motor-control PWM channels with complementary outputs and dead-time insertion, a 70 MIPS DSP core for executing field-oriented control (FOC) inner loops at multi-kHz rates, and three on-chip op amps that can amplify shunt current-sense signals without external amplifier ICs. In a typical topology the PWM outputs drive a gate-driver stage for the inverter bridge, while ADC sampling of phase currents is synchronized to the PWM center via hardware trigger, minimizing measurement ripple. Running from a native 5V supply, the DSC tolerates the noisy 5V rails common in appliance and power-tool environments where 3.3V controllers would need extra regulation and protection. The 256KB ECC Flash leaves generous space for FOC libraries plus a supervisory application.
Recommended
Automotive Body and Sensor Modules
This DSC suits automotive body electronics because the dsPIC33EV family includes a SENT (SAE J2716) peripheral for reading modern automotive sensors and a CTMU for precise time and capacitance measurement, both common interfaces in 5V automotive nodes. The 5V-tolerant architecture connects directly to vehicle 5V rails, and the ECC Flash protects program memory integrity in electrically harsh harness environments. With 70 MIPS available, the part can run LIN or CAN-based body functions - window lift, wiper control, HVAC dampers - while executing diagnostic and plausibility checks required in functional-safety-oriented designs (the device is listed as FuSa capable). Designers should add proper load-dump protection externally and use the -E or -M temperature variants where under-hood mounting exceeds 85C ambient.
Recommended
Digital Power Conversion
Switch-mode power supplies, PFC stages, and DC-DC converters benefit from this DSC's deterministic DSP core and synchronized analog peripherals. The 70 MIPS core closes voltage- and current-mode control loops fast enough for medium-frequency converters, while the six motor-control PWM channels can be repurposed as high-resolution power-stage modulators with complementary outputs and programmable dead time. The 12-bit ADC can be triggered from the PWM hardware so that sampling lands in the noise-free window, a technique central to Microchip's digital power reference designs. The 4.5V to 5.5V native supply fits traditional telecom and industrial 5V control rails, and the 256KB ECC Flash comfortably hosts firmware for multiple topologies plus communication and telemetry stacks in one device.
Recommended
Capacitive Touch and Sensing Nodes
The integrated CTMU (Charge Time Measurement Unit) makes this DSC a compact solution for capacitive touch interfaces, ultrasonic time-of-flight, and resistive sensing, because it measures charge time with sub-nanosecond resolution without a separate touch controller IC. Industrial control panels, appliance user interfaces, and level-sensing applications can implement multi-channel touch keys plus a 70 MIPS main application in one 28-QFN device. The on-chip op amps condition signals, and the 5V supply improves signal-to-noise ratio in noisy factory environments compared with 3.3V solutions - a meaningful SNR advantage for touch sensitivity. Firmware should apply Microchip's CTMU-based mTouch techniques, including oversampling and drift compensation, which fit easily in the 256KB ECC Flash alongside the host application and communication stack.
Recommended
Industrial Automation and Control Panels
Factory-floor equipment demands 5V-tolerant I/O, deterministic interrupt response, and resilience to electrical noise - all strengths of the dsPIC33EV family per Microchip's positioning for industrial applications. This DSC handles sequence control, sensor acquisition, and actuator driving in machinery nodes: seven timers coordinate multi-stage operations, four DMA channels move ADC results without CPU intervention, and three external interrupt pins capture fast events. The 70 MIPS core executes PID loops and digital filtering with DSP MAC instructions, while the ECC Flash mitigates single-bit upsets in electrically noisy cabinets. The 6x6 mm QFN saves board area on compact I/O modules, and the exposed pad provides a low-impedance ground connection that reduces EMI emissions from fast PWM switching edges.
Recommended
Signal Processing and Smart Appliances
Appliance controllers increasingly perform real DSP work - compressor control, acoustic noise detection, load identification - and this DSC merges those tasks with the main application on one chip. The 16-bit dsPIC core's single-cycle MAC and dual operand fetch accelerate FFT and FIR filtering for vibration or acoustic analysis, at 70 MIPS headroom that also runs the appliance state machine and user interface. Native 5V operation matches the appliance environment's motor and relay drive electronics, reducing interface complexity and improving noise margins. Three on-chip op amps condition microphone or current-shut signals, and 256KB ECC Flash holds the DSP libraries plus OTA-update-capable firmware. The -40C to +85C industrial range covers unconditioned appliance and outdoor equipment enclosures.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV256GM002T-I/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV256GM002T-E/MM | DSPIC33EV256GM002T-M/MM | DSPIC33EV128GM102T-I/MM | DSPIC33EV64GM002-I/MM | DSPIC33EP64MC502-E/MM |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) Exposed Pad | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 256KB (85.5K x 24) ECC | 256KB ECC | 256KB ECC | 128KB | 64KB | 64KB |
| Operating Temperature | -40C to +85C (I) | -40C to +125C (E) | up to +150C (M) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) |
| ECC Flash / Safety | Yes (ECC, FuSa capable) | Yes (ECC, FuSa capable) | Yes (ECC, FuSa capable) | Yes (ECC, FuSa capable) | Yes (ECC) | No ECC |
Key Differentiators
- Largest Flash in the same 28-QFN footprint (vs DSPIC33EV128GM102T-I/MM)
- ECC Flash and Functional Safety (FuSa) capability (vs DSPIC33EP64MC502-E/MM)
- Three on-chip op amps reduce BOM cost (vs DSPIC33EV256GM002T-E/MM)
Design Notes
The 28-QFN (6x6) exposed pad is the primary ground and heat-removal path. Create a ground pad on the PCB matching the datasheet dimensions, patterned with a grid of 4-5 mil vias to the internal ground plane, and solder-fill with adequate paste segmentation to avoid voiding. All 28 perimeter pins plus the pad must be defined in the footprint per Microchip's QFN land-pattern guidance; a floating exposed pad is the most common cause of intermittent ground and thermal problems on this package family.
The device runs from a 4.5V to 5.5V rail, but current draw peaks during 70 MIPS flash execution plus PWM switching. Place 0.1uF ceramic decoupling capacitors within 2 mm of each VDD pin and add 4.7uF to 10uF of bulk capacitance per Microchip's hardware guidelines. When powered from automotive or industrial rails, add a series protection element and TVS upstream, since the absolute maximum rating leaves little margin for load-dump transients on the 5V domain.
Estimated: at full-speed execution the DSC dissipates on the order of tens to a few hundred milliwatts (supply current at 70 MIPS times 5V, per datasheet typical figures), which the exposed pad on a solid ground plane dissipates easily. However, in motor-drive boards where the QFN sits near hot gate drivers or in a 105C enclosure, verify junction temperature against the -E or -M grade part; switching from the I-grade to the E-grade variant is footprint-free and adds 40C of margin.
The T suffix indicates tape-and-reel delivery with a minimum reel quantity - order the correct delivery form for prototypes. Additionally, peripheral pin selection (PPS) means many I/O functions are software-mapped at reset: if configuration bits or PPS registers are misprogrammed, pins default to inputs and motor or power stages may see floating gate signals. Always include a defined safe state in firmware initialization before enabling PWM outputs, and use CONFIG bit verification in production programming.
Compliance Information
Compliance data was not present in the provided web data. Microchip dsPIC33EV parts are generally RoHS-compliant per manufacturer product pages, but this must be confirmed from the official product page or datasheet before claim.