DSPIC33EV256GM002T-I/SO - 70 MIPS 5V 256KB DSC | Microchip
MPN: DSPIC33EV256GM002T-I/SO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.75 | $3.75 |
| 10 | $3.45 | $34.50 |
| 100 | $3.15 | $315.00 |
| 500 | $2.9 | $1,450.00 |
| 1,000 | $2.65 | $2,650.00 |
DSPIC33EV256GM002T-I/SO Overview
A digital signal controller combines the computational capabilities of a digital signal processor with the control peripherals and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits between general-purpose MCUs and dedicated DSPs: it executes DSP-class math (MAC, barrel shifter, DSP instruction set) while also providing real-time control loops, communication interfaces and interrupt-driven I/O typical of microcontrollers. The dsPIC33EV family extends this concept to harsh, 5V industrial and automotive-adjacent environments.
Key features of the DSPIC33EV256GM002T-I/SO include the 70 MIPS 16-bit dsPIC DSC core operating from a 4.5V to 5.5V supply, 256KB of ECC-protected Flash for functional-safety-oriented designs, 16KB of on-chip RAM, and Microchip's Functional Safety (FuSa) design support package. The on-chip ECC Flash detects and corrects single-bit memory errors, which is a significant differentiator for applications where uncorrected memory corruption is unacceptable.
Architecturally, the dsPIC33E core uses a modified Harvard architecture with a 24-bit instruction word, hardware DSP engine, and deterministic interrupt latency. The wide 5V operating range allows direct connection to industrial 5V logic, automotive sensor rails and 12V-derived supplies through simple regulation, reducing level-shifting circuitry compared with 3.3V MCUs.
Typical applications include appliance motor control (BLDC/PMSM loops), industrial power supplies and digital power conversion, automotive body and sensor-interface nodes, and general embedded control in electrically noisy environments where 5V noise immunity matters.
Design-wise, ensure a 0.1uF decoupling capacitor at each VDD/VSS pair placed within 5 mm of the pins, and verify that 70 MIPS operation uses the internal PLL configured via the FOSC configuration words at programming time.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EV256GM002T-I/SO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV256GM002T-I/SO (same form factor and footprint) — differing in Operating Temperature, Package, Packaging, Program Memory Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV256GM002-E/SO
✅ Drop-In✓ In Stock
$7.18 / Unit
View Datasheet →DSPIC33EV256GM002T-M/SO
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV256GM002-I/SO
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV128GM002T-I/SO
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV64GM002T-I/SO
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV256GM002T-I/SO Maximum Ratings & Electrical Characteristics
| Core | dsPIC33EV 16-bit DSC |
| Core Size | 16-bit |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 256KB (85.5K x 24) Flash |
| Program Memory Type | ECC Flash |
| RAM Size | 16KB |
| Supply Voltage Range | 4.5 V to 5.5 V |
| Supply Voltage Nominal | 5 V |
| Number of Pins | 28 |
| Package | 28-SOIC (7.5 mm width) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (I grade) |
| Packaging | Tape & Reel (T suffix) |
| Functional Safety Support | FuSa (Functional Safety) supported |
| Family Application Target | Appliances, industrial, automotive |
DSPIC33EV256GM002T-I/SO 28-soic (7.5 mm width) Pin Configuration Guide
Pin configuration for DSPIC33EV256GM002T-I/SO (28-soic (7.5 mm width) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV256GM002T-I/SO.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV256GM002T-I/SO is suitable for 6 applications: Appliance Motor Control, Industrial Power Conversion, Automotive Body and Sensor Nodes, Sensor Signal Conditioning, Industrial Automation and Control Panels, Functional-Safety-Oriented Embedded Systems.
Appliance Motor Control
The DSPIC33EV256GM002T-I/SO fits appliance motor control because its 70 MIPS 16-bit DSP core can execute field-oriented control (FOC) loops for BLDC and PMSM motors at switching frequencies of 16-20 kHz with deterministic latency, and its 5V operation provides the noise immunity demanded inside washing machines, refrigerators and dishwashers. In a typical topology, the DSC reads current via on-board ADC channels, computes the FOC transform in the hardware DSP engine, and drives the inverter gate drivers through PWM outputs. The 256KB ECC Flash holds the entire motor-control stack plus a bootloader, eliminating an external memory device. This keeps system BOM cost low while preserving firmware integrity in harsh, vibration-prone environments.
Recommended
Industrial Power Conversion
In digital power supplies, PFC stages and DC-DC converters, the DSPIC33EV256GM002T-I/SO provides the deterministic control bandwidth needed for voltage-mode and current-mode loops. The 70 MIPS core supports control-loop update rates in the tens of kilohertz range, while the ECC Flash protects control firmware from single-bit memory upsets in electrically noisy switch-mode environments - a notable advantage over non-ECC MCUs. Operating directly at 5V means ADC inputs can interface with industrial signal ranges through simple dividers without level shifting. The 28-SOIC footprint suits compact power-supply daughterboards, and the 16KB RAM supports advanced compensation algorithms and telemetry buffers for condition-monitoring features.
Recommended
Automotive Body and Sensor Nodes
The dsPIC33EV family is explicitly targeted by Microchip at automotive applications, and the DSPIC33EV256GM002T-I/SO suits non-safety-critical body nodes such as seat controllers, lighting modules, pump drivers and sensor hubs. The 5V supply matches automotive 12V-rail regulated accessories directly, and the wide industrial temperature rating handles under-dash environments. The 256KB ECC Flash is valuable where firmware must survive many field-update cycles, and the FuSa support package assists suppliers building ISO-oriented processes. Firmware reliability is reinforced by the DSC core's deterministic interrupt behavior, which keeps time-critical polling loops consistent across the entire operating temperature range.
Recommended
Sensor Signal Conditioning
For industrial sensor front-ends - pressure, load-cell, and Hall-effect signals - the DSPIC33EV256GM002T-I/SO combines on-chip ADC sampling with 70 MIPS of DSP throughput for filtering, linearization and compensation math. The 5V analog domain means the ADC input span uses the full 0-5V range, improving signal-to-noise headroom by roughly 3.6 dB compared with a 3.3V system at equal noise floor. Firmware stored in 256KB ECC Flash can hold multi-point calibration tables, FIR/IIR filters and communication stacks simultaneously. Typical designs place an instrumentation amplifier ahead of the ADC input and use the internal timers for synchronized sampling of bridge sensors.
Recommended
Industrial Automation and Control Panels
The DSPIC33EV256GM002T-I/SO works well as a control processor in automation panels, driving relays, reading switches and communicating over industrial buses. Its 70 MIPS core handles protocol processing (CAN, UART, SPI) alongside the main control loop without a second MCU, and 5V logic interfaces directly with legacy industrial I/O modules still designed around 5V TTL thresholds. The 256KB ECC Flash accommodates a full state machine, HMI logic, parameter storage in emulated EEPROM, and field-updatable firmware. The 28-SOIC package is wave- and reflow-solderable for mixed-technology panel boards, and the -40C to +85C rating covers unconditioned factory floor enclosures.
Recommended
Functional-Safety-Oriented Embedded Systems
Microchip designates the dsPIC33EV family with Functional Safety (FuSa) support, and the DSPIC33EV256GM002T-I/SO leverages this with ECC on its 256KB Flash, which detects and corrects single-bit program-memory errors in service. For equipment developers building systems assessed against industrial safety standards, the availability of a safety manual and development tool qualification package shortens the compliance path. The DSC still delivers real performance - 70 MIPS and a DSP engine - so safety-oriented designs do not have to sacrifice control bandwidth. Combined with external supervision devices, this part serves as the control element in machines, drives and power systems with integrity requirements.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV256GM002T-I/SO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV256GM002-E/SO | DSPIC33EV256GM002T-M/SO | DSPIC33EV256GM002-I/SO | DSPIC33EV128GM002T-I/SO | DSPIC33EV64GM002T-I/SO |
|---|---|---|---|---|---|---|
| Package | 28-SOIC | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory | 256KB ECC Flash | 256KB ECC Flash | 256KB ECC Flash | 256KB ECC Flash | 128KB ECC Flash | 64KB ECC Flash |
| RAM | 16KB | 16KB | 16KB | 16KB | 16KB | 8KB |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Packaging | Tape & Reel (T) | Tube/Tray | Tape & Reel (T) | Tube/Tray | Tape & Reel (T) | Tape & Reel (T) |
Key Differentiators
- 256KB ECC Flash in a compact 28-pin footprint (vs DSPIC33EV128GM002T-I/SO)
- 5V native operation (vs 3.3V general-purpose MCUs (e.g. STM32-class))
- Extended-temperature upgrade path without redesign (vs DSPIC33EV256GM002-E/SO)
Design Notes
Decouple every VDD/VSS pair with a 0.1uF ceramic capacitor placed within 5 mm of the pins, plus one bulk 4.7uF-10uF capacitor near the device. On 2-layer boards, dedicate a ground plane and connect VSS directly to it with short vias. The dsPIC33EV oscillator pins (OSC1/OSC2) should have their external crystal/resonator and load capacitors placed tightly together with guard traces to ground, since clock integrity at 70 MIPS operation depends on clean oscillator startup.
The 70 MIPS operating point is achieved through the on-chip PLL configured by the FOSC configuration words, which are programmed with the code image - not at runtime. A mismatch between crystal frequency and PLL divider settings silently produces a wrong core clock. Always verify configuration bits in MPLAB X before releasing firmware, and confirm the actual Fcy with a test toggle on an output pin during first-article inspection. Also note peripheral pin select (PPS): many digital functions are assignable, so a schematic copied from another dsPIC variant may need PPS register updates.
The DSPIC33EV256GM002T-I/SO runs from a 4.5V to 5.5V single rail. Estimated current draw at 70 MIPS with flash execution is on the order of tens of milliamperes (exact figure: consult the manufacturer datasheet), so dissipation stays well under 100 mW in typical operation and no thermal management is needed. In 12V automotive or 24V industrial systems, regulate with a 5V LDO or buck converter rated for the input transient environment (e.g. load dump in vehicles), and add a TVS diode on the input for surge robustness.
Compliance Information
Compliance details were not stated in the verified web data. Microchip product pages list RoHS/REACH status per orderable - verify on the official product page before design release.
