DSPIC33FJ64GP306A-I/MR - 16-bit DSC, 40 MIPS, 64KB Flash | Microchip
MPN: DSPIC33FJ64GP306A-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.9 | $6.90 |
| 10 | $6.25 | $62.50 |
| 100 | $5.6 | $560.00 |
| 500 | $5.1 | $2,550.00 |
| 1,000 | $4.65 | $4,650.00 |
DSPIC33FJ64GP306A-I/MR Overview
A Digital Signal Controller combines the compute throughput of a DSP core with the peripheral integration and interrupt responsiveness of a microcontroller. Within the power-management hierarchy, the dsPIC33F family sits alongside Microchip's PIC24 16-bit MCU line: it executes multiply-accumulate (MAC) and DSP instructions for digital filtering and control loops while retaining general-purpose MCU peripherals, enabling seamless migration between dsPIC30F, dsPIC33F, and PIC24 devices in similar packages.
Key features include a modified Harvard 16-bit core with DSP engine (17-bit x 17-bit single-cycle MAC, 40-bit accumulator), dual ECAN modules, an 8-channel 500 ksps 10-bit or 12-bit 1.1 Msps-capable high-speed ADC, UART, SPI and I2C interfaces, and industrial temperature rating of -40C to +85C denoted by the I suffix. The A-suffix die incorporates Microchip's second-generation dsPIC33FJ silicon with improved errata profile over the original dsPIC33FJ64GP306.
Architecturally, the controller executes most instructions in a single cycle at 40 MIPS and supports barrel shifting and boundary scan (JTAG) for debug via In-Circuit Serial Programming (ICSP) through paired PGECx/PGEDx pins. Flash self-programming enables field firmware updates.
Typical applications include digital power supplies and power factor correction, motor control (PMSM, BLDC, induction), industrial automation sensor processing, and audio signal processing, where high-speed precision control loops under pressure are required.
Design consideration: all VDD and VSS pins must be connected and decoupled with 0.1uF ceramics; the pair of PGECx/PGEDx pins used for programming must be kept as a matched pair.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33FJ64GP306A-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ64GP306A-I/MR (same form factor and footprint) — differing in DSP Engine, Family Migration, Package.
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DSPIC33FJ128GP306A-I/MR
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DSPIC33FJ64GP306A-E/MR
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View Datasheet →DSPIC33FJ64GP306A-H/MR
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DSPIC33FJ64GP306A-I/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ64GP306-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ64GP306A-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33F DSC (modified Harvard) |
| Maximum Operating Speed | 40 MIPS at 3.0 V to 3.6 V |
| Flash Program Memory | 64 KB (64K x 8) |
| Package | 64-VQFN (9x9 mm), exposed pad |
| Operating Temperature Range | -40C to +85C (Industrial, I suffix) |
| Supply Voltage Range | 3.0 V to 3.6 V (industrial operating range) |
| ADC | High-speed 10-bit ADC, up to 1.1 Msps |
| Communication Interfaces | UART, SPI, I2C, ECAN, DCI |
| DSP Engine | Single-cycle 17x17 MAC, 40-bit accumulator |
| Programming Interface | ICSP via PGECx/PGEDx pairs, JTAG boundary scan |
| Debug Support | In-circuit debug via NSDSP and MPLAB tools |
| Mounting Type | Surface Mount |
| Family Migration | Pin-compatible migration to PIC24 MCU and dsPIC30F DSC in similar packages |
| Packaging Container | Tube (per Jotrin listing) |
DSPIC33FJ64GP306A-I/MR 64-vqfn (9x9 mm), exposed pad Pin Configuration Guide
Pin configuration for DSPIC33FJ64GP306A-I/MR (64-vqfn (9x9 mm), exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33FJ64GP306A-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33FJ64GP306A-I/MR is suitable for 6 applications: Digital Power Supplies and PFC, Motor Control (BLDC, PMSM, Induction), Industrial Automation and Sensing, Audio Signal Processing, Portable Instrumentation, Automotive-adjacent CAN Systems.
Digital Power Supplies and PFC
The DSPIC33FJ64GP306A-I/MR fits digital power conversion because its 40 MIPS core and DSP engine execute high-speed precision control loops such as voltage-mode and average-current-mode compensation at tens of kHz switching frequencies. The high-speed ADC samples feedback signals for non-linear control, cycle-by-cycle current limiting, and adaptive dead-time management. Placed as the sole supervisory controller, it replaces multiple analog compensator ICs, reducing BOM count while adding programmability. Firmware-based control enables soft-start profiles and fault response tuning without hardware redesign; the deterministic single-cycle MAC keeps loop latency predictable, which is essential for stability margins in phase-shifted full-bridge and PFC topologies.
Recommended
Motor Control (BLDC, PMSM, Induction)
Sensor and sensorless motor control benefits directly from this DSC's DSP capability: field-oriented control (FOC) requires fast Park/Clarke transforms and PI loops that map naturally onto the single-cycle 17x17 MAC and 40-bit accumulator. At 40 MIPS, the DSPIC33FJ64GP306A-I/MR closes current loops above 20 kHz while managing commutation, startup, and protection states in firmware. The high-speed ADC synchronizes sampling to the PWM period, minimizing torque ripple from sampling jitter. ECAN connectivity integrates the drive into industrial networks for speed commands and diagnostics, making the part a compact single-chip drive controller for fans, pumps, and servo stages.
Recommended
Industrial Automation and Sensing
In factory automation nodes, the DSPIC33FJ64GP306A-I/MR combines sensor signal processing with network communication on one chip. Its dual ECAN modules bridge CANopen-style fieldbuses, while UART, SPI, and I2C connect ADCs, encoders, and human-machine interfaces. The DSP engine applies digital filtering (FIR/IIR) to noisy sensor channels, and the -40C to +85C industrial temperature rating suits control cabinets and outdoor equipment. Firmware upgradability through ICSP and Flash self-programming supports field service without desoldering. Deterministic interrupt latency ensures accurate timestamping of events in distributed I/O, and the 64-VQFN exposed pad provides solid ground reference for analog measurements in electrically noisy environments.
Recommended
Audio Signal Processing
The Digital Audio Interface (DCI) peripheral and DSP engine make this DSC effective for audio effects, mixers, and speech processing. Audio streams routed through DCI are processed with MAC-intensive FIR filters, AGC, and echo cancellation at 40 MIPS, providing enough headroom for multiple concurrent channels at standard 48 kHz sample rates. I2C and SPI handle codec configuration, while UART links to system controllers. The A-suffix silicon's improved errata profile matters for glitch-free audio transport. Using the 64KB Flash, complete effect libraries plus a boot loader fit on-chip, and the VQFN-64 footprint leaves board area for analog sections whose grounds anchor to the exposed pad for low-noise performance.
Recommended
Portable Instrumentation
Battery-powered measurement instruments exploit the 3.0-3.6V single-supply operation of the DSPIC33FJ64GP306A-I/MR, allowing direct operation from a single lithium cell regulator without level shifting. The high-speed ADC digitizes sensor front ends up to 1.1 Msps, and DSP post-processing (averaging, windowing, FFT) runs in-line, so measurements display immediately without external processors. Flash self-programming supports data logging and calibration storage on-chip. The compact 9x9 mm VQFN package suits handheld enclosures, and the industrial temperature rating covers field use. Power-managed sleep and idle modes extend battery life between measurement bursts in data-logging applications.
Recommended
Automotive-adjacent CAN Systems
Although this specific -I grade is industrial-rated, its dual ECAN modules make it a natural gateway and control node in CAN-heavy systems such as marine, agricultural, and industrial vehicles where AEC-Q100 parts are not mandated. ECAN channels operate concurrently at different bit rates to bridge diagnostics and control buses, while the DSP engine filters sensor streams and the general-purpose peripherals drive actuators. At 40 MIPS there is headroom for protocol stacks (J1939-style layers) alongside the control application. The 64KB Flash accommodates two-bus stacks plus a boot loader for field firmware updates over CAN, reducing service cost across deployed fleets.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ64GP306A-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ128GP306A-I/MR | DSPIC33FJ64GP306A-E/MR | DSPIC33FJ64GP306A-H/MR | DSPIC33FJ64GP306A-I/PT | DSPIC33FJ64GP306-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | TQFP-64 - pin-function identical, different footprint | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 64 KB | 128 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Maximum Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Silicon Revision | A (second generation) | A | A | A | A | Pre-A (original errata profile) |
| Core Peripherals | DSP MAC, high-speed ADC, ECAN x2, UART/SPI/I2C, DCI | Identical peripheral set | Identical peripheral set | Identical peripheral set | Identical peripheral set | Identical peripheral set |
| Typical Use Case | General industrial DSC, digital power, motor control | Same, when >64KB code/data needed | High ambient temperature environments | Narrowed supply range applications | Prototyping / hand assembly | Legacy designs only |
Key Differentiators
- Double the code space without footprint change (vs DSPIC33FJ64GP306A-I/MR baseline)
- Extended temperature headroom (vs DSPIC33FJ64GP306A-E/MR)
- Improved errata profile over original silicon (vs DSPIC33FJ64GP306-I/MR)
- Solderability trade-off (vs DSPIC33FJ64GP306A-I/PT)
Design Notes
Connect every VDD and VSS pin pair and decouple each VDD pin with a 0.1uF ceramic capacitor placed within 2 mm of the pin, per the Microchip family datasheet hardware guidelines. Solder the VQFN exposed pad to a grounded land pattern with an array of thermal vias - it is the primary ground and heat path. Improper exposed-pad soldering is a leading cause of field returns on QFN-packaged DSCs.
The dsPIC33FJ64GP306A has more than one PGECx/PGEDx pair for ICSP. Per Northern Semiconductor support notes, any pair may be used but clock and data must come from the same pair (e.g., PGEC2 with PGED2); mixing pairs prevents programming. Avoid loading PGED/PGEC pins heavily in the application circuit, and add series resistors on programming header traces to isolate capacitive loads that corrupt ICSP timing.
Full 40 MIPS operation is guaranteed only at 3.0V to 3.6V. Estimated: with a typical running current in the tens of mA range at 3.3V, a low-dropout regulator with at least 150 mA capability plus bulk 10uF capacitance handles the core; verify exact IDD figures from the datasheet electrical characteristics table for your frequency configuration, as current scales directly with operating clock frequency.
Keep the high-speed ADC reference path clean: route analog reference traces away from ECAN and PWM switching lines, and use a dedicated low-ESR 10uF plus 0.1uF pair at the VREF pins. Synchronize ADC sample triggers to the PWM period (as in Microchip's digital-power reference designs) to eliminate sampling jitter that degrades control-loop and measurement accuracy.
Compliance Information
Compliance values were not stated in the retrieved web data. Verify against the official Microchip product page and environmental datasheet for this exact MPN before BOM sign-off.
