EP1K50FC256-3N - ACEX 1K 50K Gate FPGA 256-BGA | Altera
MPN: EP1K50FC256-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $111.28 | $111.28 |
| 10 | $106.5 | $1,065.00 |
| 100 | $99.2 | $9,920.00 |
| 500 | $90.1 | $45,050.00 |
| 1,000 | $84 | $84,000.00 |
Drop-in alternatives for EP1K50FC256-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50FC256-3
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View Datasheet →EP1K50FC256-2N
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View Datasheet →EP1K50FC256-2
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View Datasheet →EP1K50FC256-1N
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View Datasheet →EP1K50FC256-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1K50FC256-3N Maximum Ratings & Electrical Characteristics
| FPGA Family | ACEX 1K |
| Logic Elements / Cells | 2880 |
| Typical Logic Gates | 50000 |
| Embedded RAM Bits | 40960 |
| User I/O Count | 186 |
| Core Supply Voltage | 2.5 V |
| Process Technology | 0.22 um |
| Maximum Internal Clock Frequency | 166.67 MHz |
| Package / Case | 256-BGA (FBGA) |
| Number of Pins / Balls | 256 |
| Terminal Form | Ball |
| Package Shape | Square |
| Mounting Type | Surface Mount |
| Speed Grade | -3 |
| Configuration Method | SRAM-based; external configuration PROM or JTAG |
EP1K50FC256-3N square Pin Configuration Guide
Complete pinout information for EP1K50FC256-3N (square package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K50FC256-3N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50FC256-3N is suitable for 6 applications: Broadband Access Concentrator, Industrial Machine Control, Consumer Video and Imaging Processing, High-Channel-Count Protocol Bridging, Legacy Product Sustainment, FPGA Prototyping and Education.
Broadband Access Concentrator
The EP1K50FC256-3N suits broadband access concentrators, DSLAMs, and store-and-forward LAN switches because its 186 user I/Os can interface to multiple MAC/PHY devices, while its 40,960 bits of embedded RAM support small descriptor tables, FIFOs, and rate-matching buffers. The 2,880 logic cells implement framing, address filtering, arbitration, and statistics logic. At a 2.5 V core supply, the device reduces power compared with older 3.3 V programmable logic. The 166.67 MHz internal clock capability is adequate for standard line-rate control-plane tasks. For non-blocking packet buffers, external SRAM/DDR is still required, but embedded RAM can be used for per-port FIFOs. In a typical line-card design, the FPGA is configured from an EPC2 or EPC1441 PROM and communicates with network processors over parallel bus interfaces.
Recommended
Industrial Machine Control
In industrial machine control, the EP1K50FC256-3N provides a low-cost reprogrammable fabric for implementing fieldbus interfacing, encoder decoding, PWM generation, and interlock logic. The 186 user I/Os allow direct connection to optocouplers, level shifters, and parallel external interfaces. Its 40,960 RAM bits can store small lookup tables for motion profiles or alarm histories. The ACEX 1K enhanced embedded array enables dual-port RAM usage for exchanging data between control domains. As a nonvolatile SRAM FPGA, it requires external configuration memory at power-up, which is acceptable in PLC modules that already include a microcontroller boot chain. The 2.5 V core reduces power on 24 V industrial backplanes, and the 256-BGA package keeps PCB area small while offering enough I/O for a modular I/O controller.
Recommended
Consumer Video and Imaging Processing
The EP1K50FC256-3N can perform video pixel-format conversion, simple scaling, sync generation, and image-validation logic in consumer displays and video capture devices. Its 2,880 logic cells implement synchronous pipeline stages, while the 40,960 embedded RAM bits create line buffers and small frame-delay elements without external memory for low-resolution streams. The 186 user I/Os connect to CMOS image sensors, memory buses, and video DAC/encoder ICs. A 2.5 V core operating point helps meet low-power requirements of set-top boxes and display controllers. For larger full-HD frame buffers, external SDRAM is required. Since ACEX 1K is an older generation, this device is most practical for legacy replacement, reference designs, or products where existing RTL can be re-targeted to a pin-compatible speed-grade variant.
Recommended
High-Channel-Count Protocol Bridging
With 186 user I/O pins, the EP1K50FC256-3N is useful for high-channel-count protocol bridging, UART aggregation, SPI expansion, or GPIO mapping between a host CPU and multiple peripherals. The embedded RAM can provide independent FIFOs for each channel, preventing small packet bursts from consuming external logic cells. The 2,880 logic cells are enough for simple state machines, CRC generation, byte stuffing, and bus-width conversion. The device runs from 2.5 V, simplifying integration with modern low-voltage CPUs and CPLDs. Because ACEX 1K FPGAs are SRAM-based, configuration from an EPC2 or EPC1441 PROM is normally included in the bridge design. For legacy industrial or telecommunication equipment, this device also offers a migration path among -3N, -2N, and -1N speed-grade variants in the same 256-BGA footprint.
Recommended
Legacy Product Sustainment
The EP1K50FC256-3N is often used for sustaining legacy Altera ACEX 1K designs already in production, especially those requiring Pb-free assembly and a 256-BGA package. For these projects, the main role is to provide an exact or speed-grade-compatible die in the same footprint, allowing existing PCBs and configuration files to be reused. The device preserves 186 user I/Os, 40,960 RAM bits, and 2.5 V operation, matching the original EP1K50 behavior. Because this FPGA is obsolete, sustainment programs should verify remaining distributor stock and consider stocking enough units for end-of-life production. The -3N variant is particularly useful for applications qualified around -3 timing; faster -1/-2 variants are alternatives when the legacy timing model is no longer accepted after re-fit.
Recommended
FPGA Prototyping and Education
The EP1K50FC256-3N can be used on FPGA development boards and educational platforms to teach SOPC design, state-machine implementation, and embedded memory usage. Students can exercise 2,880 logic cells, 40,960 RAM bits, and 186 I/Os while learning about BGA prototyping and SRAM-based FPGA configuration. The 166.67 MHz internal clock capability is sufficient for teaching synchronous design, debounce logic, and bus interfaces. Design files are created in Altera/Intel Quartus, targeting the ACEX 1K EP1K50 device. The configuration bitstream can be loaded through JTAG during debugging, and an EPC2/EPC1441 PROM can be added for standalone operation. Although newer FPGA families are more common in education, the ACEX 1K architecture remains a useful example of a low-cost embedded-array FPGA.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50FC256-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50FC256-3 | EP1K50FC256-2N | EP1K50FC256-2 | EP1K50FC256-1N | EP1K50FC256-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) |
| FPGA Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K |
| Logic Cells | 2880 | 2880 | 2880 | 2880 | 2880 | 2880 |
| Typical Gates | 50000 | 50000 | 50000 | 50000 | 50000 | 50000 |
| Embedded RAM Bits | 40960 | 40960 | 40960 | 40960 | 40960 | 40960 |
| User I/O Count | 186 | 186 | 186 | 186 | 186 | 186 |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -3 | -3 | -2 | -2 | -1 | -1 |
| Terminal Finish | Pb-free (N) | SnPb | Pb-free (N) | SnPb | Pb-free (N) | SnPb |
Key Differentiators
- Pb-free N-suffix finish for RoHS-oriented legacy boards (vs EP1K50FC256-3)
- Conservative -3 timing grade for qualified legacy designs (vs EP1K50FC256-2N)
- Common 256-BGA migration path across speed-grade variants (vs EP1K50FC256-1N)
Design Notes
ACEX 1K devices operate from a 2.5 V core supply. Use a low-noise 2.5 V regulator and place a 0.1 uF ceramic capacitor near each VCC ball plus a 10 uF bulk capacitor per power segment. Although the exact VCC tolerance is not stated in the fetched web data, maintaining the core rail within the datasheet tolerance is mandatory for reliable configuration and operation. Verify the VCCIO supply requirements from the ACEX 1K datasheet before connecting external logic.
The 256-ball FBGA requires a multilayer PCB with via-in-pad or microvia fan-out under the device. Keep all VCC and GND connections routed to contiguous planes, and place decoupling capacitors on the bottom side of the BGA land pattern as close to the ball field as possible. Since only a square 256-BGA package and 186 user I/O were confirmed in the web data, the exact ball map must be obtained from the ACEX 1K datasheet before final layout.
Do not assume an EP1K50FC256-3N design can run unmodified on a different ACEX 1K density or on another vendor's FPGA. The -2 and -1 speed-grade variants are pin-compatible but require recompilation to meet timing. This FPGA is SRAM-based and has no internal flash, so omitting the configuration PROM or JTAG host will result in a blank device on every power cycle. For obsolete ACEX 1K stock, verify markings against distributor photos to avoid counterfeit or incorrectly re-labeled inventory.
Estimated: for a typical 2.5 V ACEX 1K design, core power is usually below 1 W at moderate toggle rates, but actual dissipation depends on I/O loading and clock activity. The BGA package relies on PCB copper for heat spreading. Provide a solid ground plane under the device and do not route slots beneath the BGA pad field. If the device is used in a high ambient environment, include airflow or heatsinking over the BGA package and monitor junction temperature using the thermal data from the ACEX 1K datasheet.
Compliance Information
The N suffix in Altera/Intel ACEX 1K ordering nomenclature conventionally indicates Pb-free lead finish, but no RoHS/REACH certificate was present in the verified web data. Confirm compliance with the distributor or Intel PCN before regulatory filing.
