EP1K50FC256-1 - 50K Gates ACEX 1K FPGA 256-FBGA | Altera
MPN: EP1K50FC256-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $24.9 | $2,490.00 |
| 250 | $21.4 | $5,350.00 |
| 500 | $18.95 | $9,475.00 |
Drop-in alternatives for EP1K50FC256-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50FC256-1N
✅ Drop-In✓ In Stock
$15.1 / Unit
View Datasheet →EP1K50FC256-3
✅ Drop-In✓ In Stock
$54.4 / Unit
View Datasheet →EP1K100FC256-1
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$53.2 / Unit
View Datasheet →EP1K100FC256-1N
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$22.1 / Unit
View Datasheet →EP1K30FC256-1
✅ Drop-In✓ In Stock
$17.85 / Unit
View Datasheet →EP1K50FC256-1 Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Logic Elements / Cells | 2,880 |
| System Gates | 50,000 |
| Maximum System Gates | 199,000 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Memory (EAB) | 40 Kbit (EAB-based) |
| Total RAM Bits | 40,960 |
| User I/Os | 186 |
| Operating Supply Voltage (Core) | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 250 MHz |
| Configuration Memory Type | SRAM |
| Package | 256-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Commercial (0 °C to +70 °C) |
| RoHS Status | Non-compliant (per distributor data) |
| Part Status | Obsolete (per Arrow listing) |
EP1K50FC256-1 256-ball fbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1K50FC256-1 (256-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K50FC256-1.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50FC256-1 is suitable for 6 applications: Bus-Bridging and Protocol-Conversion Glue Logic, Industrial Control and Instrumentation Front Ends, Legacy Communications Interface Controllers, Memory and Display Controllers, Design Replacement for Legacy ACEX 1K Boards, Test & Measurement Fixture Logic.
Bus-Bridging and Protocol-Conversion Glue Logic
The EP1K50FC256-1 is a strong fit for bus-bridging designs that need to translate between legacy parallel buses (PCI, ISA, VME) and modern processors, because its 2,880 logic elements and 360 LABs provide ample capacity for state machines, FIFOs, and address decoding while its 186 user I/Os leave headroom for wide data buses plus control. Per ACEX 1K datasheet, the 40 Kbit EAB memory allows on-chip FIFO buffers between mismatched clock domains. Engineers typically pair it with a host CPU where firmware upgrades require protocol-flexible bridges, accepting higher static power from the 0.22 µm process in exchange for short time-to-market.
Recommended
Industrial Control and Instrumentation Front Ends
In industrial control systems, the EP1K50FC256-1 serves as a configurable front-end that aggregates sensor signals, drives display or HMI interfaces, and pre-processes data before forwarding to a controller. Its 186 I/Os accommodate many ADC/DAC channels and discrete lines, while the 2.5 V core fits behind common 3.3 V-tolerant I/O bank designs. However, per distributor records the part is commercial-grade (0 °C to 70 °C), so industrial temperature deployments should use the -1N or industrial EP1K50FI256-2 variant. The 250 MHz fabric supports real-time sampling and modest DSP-style filtering.
Recommended
Legacy Communications Interface Controllers
The EP1K50FC256-1 fits well in legacy telecom or datacom interface cards implementing T1/E1, HDLC, UART, or custom serial protocols. With 2,880 logic elements and 40 Kbits of embedded RAM, the device can host multi-channel state machines, small packet buffers, and CRC engines on a single chip, eliminating external glue logic. Per ACEX 1K datasheet, the SRAM fabric enables field reconfiguration to add new protocols without hardware changes. The 256-FBGA package keeps board area compact while supporting high I/O count for multi-drop serial lines.
Recommended
Memory and Display Controllers
Designers use the EP1K50FC256-1 as a custom memory controller (SRAM, DRAM, NOR flash) or display driver interface (VGA, LVDS bridges) when off-the-shelf controllers are unavailable or inflexible. The 186 user I/Os handle wide data and address buses plus timing-critical strobes, while the 40 Kbit EAB memory provides small cache/line buffers. Per ACEX 1K family datasheet, the I/O banks support multiple voltage standards, simplifying mixed-voltage interfacing. The 250 MHz internal frequency supports pixel-clock and memory-clock generation in compact SoM designs.
Recommended
Design Replacement for Legacy ACEX 1K Boards
When manufacturing legacy ACEX 1K-based boards and the original FPGA is end-of-life, the EP1K50FC256-1 can be re-qualified to keep designs in production without firmware porting. Per ACEX 1K datasheet family, the part is electrically and pin-compatible with prior ACEX 1K 256-FBGA footprints, so existing Quartus II bitstreams targeting the same die revision typically load directly. Engineers should validate timing closure under the new speed-grade lot and check that lead-finish and RoHS status match the board's bill of materials. This preserves firmware investment.
Recommended
Test & Measurement Fixture Logic
Test fixtures and ATE-style boards often use ACEX 1K devices like the EP1K50FC256-1 to implement reconfigurable pattern generators, scan controllers, or DUT interface adapters. Its 186 user I/Os support many parallel channels, the 250 MHz fabric enables high-rate pattern generation, and SRAM configuration lets engineers swap bitstreams for different DUT families. Per ACEX 1K datasheet, JTAG-based programming simplifies fixture firmware updates in the field. The 256-FBGA package provides compact routing, but engineers should plan thermal vias given the 0.22 µm process power profile.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50FC256-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50FC256-1N | EP1K50FC256-3 | EP1K100FC256-1 | EP1K100FC256-1N | EP1K30FC256-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-FBGA | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) |
| System Gates | 50,000 | 50,000 | 50,000 | 100,000 | 100,000 | 30,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 4,992 | 4,992 | 1,728 |
| Embedded Memory | 40 Kbit | 40 Kbit | 40 Kbit | 48 Kbit | 48 Kbit | 24 Kbit |
| User I/Os | 186 | 186 | 186 | 186 | 186 | 186 |
| Speed Grade | -1 (250 MHz) | -1 (same) | -3 (faster) | -1 (same) | -1 (same) | -1 (same) |
| Temperature Grade | Commercial (0 °C to 70 °C) | Commercial | Commercial | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Unit Price (qty 1, USD) | 38.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Same-family upgrade path within 256-FBGA footprint (vs EP1K50FC256-1N)
- Higher logic capacity without PCB change (vs EP1K100FC256-1)
- Lower-cost, lower-density alternative within same package (vs EP1K30FC256-1)
Design Notes
Estimated: At a typical 2.5 V core supply and 5 mA quiescent current, the EP1K50FC256-1 core draws roughly 12.5 mW idle. With 186 I/Os switching under load, supply current can rise significantly and core power may reach hundreds of milliwatts depending on toggle rate. Per the ACEX 1K datasheet, the 2.5 V rail must be regulated within ±5 % (2.375 V to 2.625 V). Decouple the core supply with 0.1 µF and 10 µF ceramic capacitors placed close to the FBGA power balls, and provide separate decoupling for each I/O bank to minimize switching noise coupling into the logic fabric.
The 256-FBGA package demands careful PCB escape routing because the ball pitch is 1.0 mm. Use 4-layer or higher stackups with continuous power and ground planes directly under the device to provide a low-impedance return path and thermal spreading. Per ACEX 1K datasheet layout guidelines, route differential pairs with matched lengths and avoid routing signals across split planes. Stitch the ground plane with sufficient vias near the BGA to reduce inductance, and add thermal vias under the central pad area (if present) to improve heat dissipation for the 0.22 µm process.
The EP1K50FC256-1 uses SRAM configuration memory and therefore requires a configuration device (e.g., EPC2LC20) or JTAG download on every power-up - it does not retain its bitstream when powered off. Per ACEX 1K datasheet, nCONFIG, nSTATUS, and CONF_DONE signals must be properly pulled and monitored for proper startup. Engineers migrating from older ACEX 1K bitstreams should revalidate timing closure under the new speed-grade lot, and verify that the lead-finish variant (with or without N suffix) matches the PCB's solderability profile.
Compliance Information
RoHS non-compliant per Arrow listing for EP1K50FC256-1 (EU RoHS Not Compliant). REACH SVHC Exceeds Threshold per same listing; consult manufacturer for current SVHC declaration. The -1N variant provides a lead-free drop-in option. AEC-Q100 is not applicable (FPGA is not automotive-qualified in this family).
