EP1K50QC208-2 - 50K Gates ACEX-1K FPGA 208-PQFP | Intel / Altera
MPN: EP1K50QC208-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.75 | $2,875.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $20.95 | $20,950.00 |
Drop-in alternatives for EP1K50QC208-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50QC208-1
✅ Drop-In✓ In Stock
$11.4 / Unit
View Datasheet →EP1K50QC208-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$12.1 / Unit
View Datasheet →EP1K50QC208-1N
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Contact for price
View Datasheet →EP1K50QC208-2N
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$27.8 / Unit
View Datasheet →EP1K50QC208-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$13.85 / Unit
View Datasheet →EP1K50QC208-2 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Logic Elements / Cells | 2880 |
| Total Gates | 50000 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Memory (RAM bits) | 40960 |
| Number of I/Os | 147 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm |
| Maximum Operating Frequency | 200 MHz |
| Package Type | 208-BFQFP (PQFP-208) |
| Package Style | Power Quad Flat Pack, Gull-Wing Leads |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) / PS / AS via EPC series |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Speed Grade | -2 (Commercial) |
EP1K50QC208-2 power quad flat pack, gull-wing leads Pin Configuration Guide
Complete pinout information for EP1K50QC208-2 (power quad flat pack, gull-wing leads package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K50QC208-2.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50QC208-2 is suitable for 6 applications: Industrial Glue Logic and Protocol Bridging, Flat-Panel Display Timing Controller, Legacy PCI Bus Interface Card, Motor-Control Co-Processor, Communication Protocol Bridge / Converter, Low-Density ASIC Prototyping.
Industrial Glue Logic and Protocol Bridging
The EP1K50QC208-2 is well suited for industrial glue-logic and protocol-bridging applications requiring 50K gates of deterministic hardware-timed logic. With 2,880 logic elements distributed across 360 LABs and 147 user I/Os, the device can host parallel state machines, custom bus interfaces (I2C, SPI, UART), and protocol converters in a single chip. The 2.5 V core and LVTTL/LVCMOS I/O standards allow direct interfacing to legacy 5 V-tolerant devices through external resistive dividers. Compared to a microcontroller, the FPGA delivers guaranteed timing closure and parallel execution - critical for deterministic industrial control loops. This is the classic ACEX-1K use case.
Recommended
Flat-Panel Display Timing Controller
The EP1K50QC208-2's 147 user I/Os and 200 MHz maximum operating frequency make it a viable timing controller for low-to-mid resolution flat-panel displays (XGA, SXGA, and below). The 360 LABs can implement row/column drivers, color-space converters, and on-screen display (OSD) overlays while the embedded array blocks (EABs) hold line buffers. The PQFP-208 package is friendly to conventional SMT reflow, simplifying panel-side assembly. Designers should pay close attention to I/O timing skew across the four I/O banks when targeting wide parallel RGB interfaces above 65 MHz pixel clock.
Recommended
Legacy PCI Bus Interface Card
When designing legacy 32-bit/33 MHz PCI add-in cards, the EP1K50QC208-2 delivers sufficient logic density to implement the PCI target interface plus application logic in a single device. The 2.5 V core plus 3.3 V VCCIO for PCI-compliant I/O is supported on the ACEX-1K device bank structure. 147 user I/Os comfortably accommodate the 64-pin PCI bus plus dedicated control signals and board-level glue logic. The PQFP-208 package has a 0.5 mm lead pitch compatible with conventional PCB manufacturing tolerances. PCI timing closure must be verified with Quartus II timing analysis using the PCI megafunction.
Recommended
Motor-Control Co-Processor
The EP1K50QC208-2 can offload motor-control algorithms (PWM generation, FOC, encoder decoding) from a host microcontroller, executing critical loops in hardware with deterministic sub-microsecond latency. The embedded array blocks provide fast access to lookup tables for sine and Clarke transforms, while the 360 LABs handle the comparator and PWM modulator logic. The 200 MHz maximum frequency supports field-oriented control (FOC) loop rates up to 50 kHz even with multi-axis implementations. PQFP-208's exposed lead frame simplifies heat-sink attachment for high-utilization designs.
Recommended
Communication Protocol Bridge / Converter
The EP1K50QC208-2 is frequently deployed as a multi-protocol bridge in telecom and datacom equipment - converting between I2C, SPI, UART, parallel buses, and custom proprietary interfaces at line rates up to 200 MHz. With 2,880 logic elements and 40,960 bits of embedded RAM, designers can implement multiple protocol engines concurrently with shared buffer memory in the EABs. The 147 user I/Os handle dozens of peripheral connections on a single chip, reducing board area versus discrete glue logic. Quartus II's MegaWizard generates protocol cores (UART, I2C master/slave, SPI) for rapid development.
Recommended
Low-Density ASIC Prototyping
Before committing to a masked ASIC, design teams prototype their state machines, datapaths, and bus interfaces on the EP1K50QC208-2 to verify functionality and timing closure. The 50K-gate density matches many small-to-medium ASIC designs, and the PQFP-208 package is reusable as a footprint reference for ASIC package selection. The JTAG interface allows rapid in-system iteration, while the EPC configuration PROM enables field-upgradable prototypes. Quartus II synthesis preserves the same RTL when migrating to a HardCopy II structured ASIC for production volume.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50QC208-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50QC208-1 | EP1K50QC208-3 | EP1K50QC208-1N | EP1K50QC208-2N | EP1K50QC208-3N |
|---|---|---|---|---|---|---|
| Package | PQFP-208 (BFQFP) | PQFP-208 (BFQFP) | PQFP-208 (BFQFP) | PQFP-208 (BFQFP) | PQFP-208 (BFQFP) | PQFP-208 (BFQFP) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 2880 | 2880 | 2880 | 2880 | 2880 | 2880 |
| Total Gates | 50000 | 50000 | 50000 | 50000 | 50000 | 50000 |
| Embedded RAM (bits) | 40960 | 40960 | 40960 | 40960 | 40960 | 40960 |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -2 | -1 (slower) | -3 (faster) | -1 (slower) | -2 (matching) | -3 (faster) |
| Lead-Free Reflow | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Pin-compatible speed-grade scaling within the same ACEX-1K die (vs EP1K50QC208-1 vs EP1K50QC208-3)
- Lead-free reflow variants with 'N' suffix (vs EP1K50QC208-2 vs EP1K50QC208-2N)
- 147 user I/Os in PQFP-208 vs BGA alternatives (vs EP1K50QC208-2 vs EP1K50FC256-2)
Design Notes
Estimated: The EP1K50QC208-2 core draws approximately 5 mA quiescent and scales up with logic utilization and clock frequency. At full 2880-LE utilization with 200 MHz operation, ICCINT may reach 200-300 mA from the 2.5 V rail. Provide a low-impedance 2.5 V regulator (e.g., LM1117-2.5 or TPS7A4533) with at least 10 µF bulk and 0.1 µF decoupling at each VCCINT pin pair. For I/O banks, VCCIO must be supplied per-bank; bank 3/4 typically use 3.3 V for PCI compatibility.
The PQFP-208 package has a relatively high θJA (approximately 25-30 °C/W without airflow) compared to BGA equivalents. For designs operating above 70 % logic utilization at the maximum 200 MHz clock, attach a small clip-on heatsink or provide at least 200 LFM of forced airflow. Estimated: at 500 mW total power dissipation, the junction temperature rises ~15 °C above ambient with no heatsink and no airflow. Avoid placing the FPGA adjacent to high-power switching regulators; route heat away via copper pours connected to the thermal pad area under the package.
PQFP-208 has a 0.5 mm lead pitch which requires careful PCB layout: use 4-mil traces and 8-mil spaces between leads, with soldermask-defined or non-soldermask-defined pads per assembly house preference. Provide a generous ground pour beneath the package to control return paths and reduce EMI. All VCCINT and VCCIO pins must have a 0.1 µF decoupling capacitor placed within 100 mils of the pin; high-frequency switching I/O banks benefit from an additional 0.01 µF capacitor. Use differential pair routing for clock inputs (CLK0/CLK1) to maintain signal integrity at 200 MHz.
Common pitfalls when designing with the EP1K50QC208-2 include: (1) forgetting to connect nCONFIG and nSTATUS pull-ups to VCCIO during configuration, (2) selecting an EPC configuration PROM that is too small for the compressed bitstream, (3) tying MSEL pins incorrectly for the chosen configuration mode (PS vs AS vs JTAG), (4) exceeding 147 user I/Os when assigning pins in Quartus II pin planner, and (5) mixing 5 V input signals into a 3.3 V VCCIO bank without external clamping. Always run full Quartus II timing analysis at the worst-case PVT corner before committing to layout.
Compliance Information
RoHS, REACH, lead-free and halogen-free status were not present in the verified web data for the EP1K50QC208-2. Both SnPb and Pb-free (N-suffix) variants are believed to exist; verify exact compliance by lot via the manufacturer's certificate of conformance before assembly.
