EP1K50XXC - 50K Gate ACEX FPGA, 2880 LEs | Intel
MPN: EP1K50XXC ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.75 | $167.50 |
| 100 | $14.2 | $1,420.00 |
| 500 | $12.4 | $6,200.00 |
| 1,000 | $10.85 | $10,850.00 |
Drop-in alternatives for EP1K50XXC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50FC256-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$18.95 / Unit
View Datasheet →EP1K50FC256-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$62 / Unit
View Datasheet →EP1K50FC484-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$21.8 / Unit
View Datasheet →EP1K50QC208-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$20.95 / Unit
View Datasheet →EP1K50TC144-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$28.4 / Unit
View Datasheet →EP1K100FC484-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$33.4 / Unit
View Datasheet →EP1K50XXC Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | ACEX 1K |
| Logic Elements | 2,880 |
| Typical Gates | 50,000 |
| Embedded Array Blocks (EABs) | 40 |
| Maximum Embedded Memory | 40 Kbits |
| Maximum User I/O | 333 |
| Core Voltage | 2.5 V |
| Process Technology | 0.18 µm CMOS |
| I/O Tolerance | 5 V tolerant |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Active Serial |
| Operating Temperature | -40 °C to +85 °C (industrial) |
| Programming Tools | Quartus (legacy support required) |
| Logic Element Architecture | 4-input LUT |
EP1K50XXC [data_needed: exact package code per datasheet - likely bga or pqfp variant] Pin Configuration Guide
Complete pinout information for EP1K50XXC ([data_needed: exact package code per datasheet - likely bga or pqfp variant] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: exact package code per datasheet - likely bga or pqfp variant] package pinout diagram for EP1K50XXC](/assets/package-diagrams/default.svg?v=1788622528)
No detailed pinout data available for EP1K50XXC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50XXC is suitable for 6 applications: PCI Bus Bridge Logic, DSP Co-processor Glue Logic, Telecom Line Card Interface Logic, Industrial Control State Machines, Legacy ASIC Replacement, Test and Measurement Front-End Logic.
PCI Bus Bridge Logic
The EP1K50XXC's 2,880 logic elements and 5 V tolerant I/O are well-matched to legacy PCI bus bridge implementations. The 4,992-LE EP1K100 has been deployed as PCI-to-local bus bridges in industrial PCs; the EP1K50XXC fits smaller bus interfaces such as PCI-to-ISA or PCI-to-memory glue. With 333 maximum user I/O, the device accommodates full 32-bit data plus control signals plus local bus expansion. The dual-port EAB memory enables implementation of PCI transaction FIFOs without external SRAM. Designers should verify Quartus II 13.0sp1 support is retained for legacy PCI core IP.
Recommended
DSP Co-processor Glue Logic
The EP1K50XXC serves as interface glue between microcontrollers/DSP processors and external peripherals, offloading parallel data formatting, address decoding, and timing-critical handshake logic. The 2,880 four-input LUTs handle 16-bit address decoding plus 32-bit data multiplexing comfortably. Embedded EAB memory provides small dual-port FIFOs for sample buffering between DSP serial ports and parallel peripherals. The 5 V tolerant I/O interfaces directly to legacy TTL peripherals without level shifters, simplifying board layout in mixed-voltage designs.
Recommended
Telecom Line Card Interface Logic
Telecom line-card designs use the EP1K50XXC for TDM bus multiplexing, HDLC framing assist, and serial-to-parallel conversion. The device's 40 EABs of embedded memory (40 Kbits total) support small channel-assoc memory and time-slot lookup tables. Distributed logic elements handle TDM frame alignment and clock-domain crossing between backplane and line-side clocks. The industrial temperature grade (-40C to +85C) suits central-office deployments. Migration to MAX 10 or Lattice ECP5 is recommended for new line-card designs.
Recommended
Industrial Control State Machines
Factory automation controllers benefit from the EP1K50XXC's logic density and embedded memory for sequencer implementations. The 2,880 LEs handle multi-axis motion controllers, sensor-fusion pre-processing, and serial-protocol bridging (Modbus, Profibus, CANopen glue). Industrial temperature grade supports deployment in factory-floor enclosures. EAB memory provides parameter storage for tuning constants without external EEPROM. Engineers maintaining legacy installations continue to deploy EP1K50 in field-replacement modules.
Recommended
Legacy ASIC Replacement
The EP1K50XXC is a common drop-in replacement for low-to-medium volume ASIC designs in production today. Designers originally targeting 30-60K ASIC gates often prototype and produce with the EP1K50XXC, avoiding NRE charges. The 5 V tolerant I/O matches common 5 V ASIC libraries. Embedded EABs substitute for small ASIC-implemented ROM look-up tables. Risk-mitigation advantages include reprogrammability (re-spin for bugs is free) and second-source availability via EP1K100 upward migration.
Recommended
Test and Measurement Front-End Logic
Instrumentation designers use the EP1K50XXC as front-end data routing, format conversion, and trigger logic in oscilloscopes, logic analyzers, and data-acquisition systems. The 40 EABs of dual-port RAM implement deep capture FIFOs between ADC data streams and downstream DSP or display engines. Multiple clock domains are supported via the device's flexible clock network. The combination of logic density, embedded memory, and 5 V tolerance accommodates legacy front-end circuitry while interfacing to modern 3.3 V processors.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50XXC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50FC256-1 | EP1K50FC484-2 | EP1K100FC484-2 |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | [DATA_NEEDED: depends on EP1K50XXC suffix] | FBGA-256 | FBGA-484 | FBGA-484 (pin-compatible) |
| Logic Elements | 2,880 | 2,880 | 2,880 | 4,992 (upward migration) |
| Typical Gates | 50,000 | 50,000 | 50,000 | 100,000 |
| Embedded Memory | 40 Kbits | 40 Kbits | 40 Kbits | 80 Kbits |
| EABs | 40 | 40 | 40 | 80 |
| Maximum User I/O | 333 | 172 | 333 | 333 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | C (commercial) | -1 (slower) | -2 (faster) | -2 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Migration headroom via pin-compatible EP1K100 upward family (vs EP1K100FC484-2)
- Multiple package options within same die (vs EP1K50FC256-1)
- Higher I/O count in FC484 vs FC256 package (vs EP1K50FC256-2)
Design Notes
Quartus Prime versions newer than 13.0sp1 do NOT support ACEX 1K devices including EP1K50XXC. Maintain a Quartus II 13.0sp1 installation in your tool repository for any maintenance or bitstream regeneration on existing EP1K50 designs. Migrating to Quartus Prime without checking legacy support will result in 'device not supported' errors that block bitstream generation entirely.
ACEX 1K devices support both 2.5 V and 3.3 V I/O bank voltages but require 5 V tolerant inputs via specific bank configuration. The EP1K50XXC's I/O banks must be assigned in Quartus II to match board-level voltage rails. Mismatched VCCIO bank voltages cause permanent I/O damage. Verify bank assignments against the schematic before generating the bitstream, and lock the pins (Assignments > Pin Planner) once validated.
FBGA-packaged EP1K50XXC variants require careful PCB thermal management. The 256-ball and 484-ball BGAs rely on thermal vias under the package for heat dissipation into inner copper planes. Use at least 9 thermal vias in a 3x3 array under the BGA center, connecting to a 1 oz copper inner ground plane. Without this thermal pad design, FBGA EP1K50 devices can exceed junction temperature limits at full I/O toggle utilization.
EP1K50XXC outputs have limited slew-rate control compared to modern FPGAs. When driving long PCB traces (>5 cm) or fast (>50 MHz) signals, add 22-33 ohm series termination resistors near the FPGA output pin. For clock outputs, place termination within 1 cm of the FPGA pin to prevent reflections. Multiple synchronous clock outputs should be routed with matched trace lengths to avoid skew in source-synchronous interfaces.
Compliance Information
Original Altera EP1K50 devices shipped before 2006 typically non-RoHS; later RoHS-reflowed variants exist. Compliance varies by lot and date code. Verify with distributor for specific lot compliance status. Not AEC-Q100 qualified - ACEX 1K is not automotive-grade.
