EP1K50TC144-1 - ACEX-1K 50K-Gate FPGA, 144-LQFP | Altera
MPN: EP1K50TC144-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.4 | $164.00 |
| 100 | $13.95 | $1,395.00 |
| 500 | $11.8 | $5,900.00 |
| 1,000 | $9.95 | $9,950.00 |
Drop-in alternatives for EP1K50TC144-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50TC144-2
✅ Drop-In✓ In Stock
$28.4 / Unit
View Datasheet →EP1K50TC144-3
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$13.85 / Unit
View Datasheet →EP1K50TC144-1N
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →EP1K50TI144-2N
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EP1K30TC144-1
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EP1K30TC144-2
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →EP1K30TC144-1N
✅ Drop-In✓ In Stock
$11.5 / Unit
View Datasheet →EP1K50TC144-1 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Logic Elements / Cells | 2,880 |
| System Gates | 50,000 |
| Embedded Memory (Bits) | 40,960 |
| Logic Array Blocks (LABs) | 360 |
| User I/O Pins | 102 |
| Core Voltage | 2.5 V |
| I/O Voltage | 2.5 V (5-V tolerant I/O) |
| Maximum Internal Frequency | 250 MHz |
| Process Technology | CMOS |
| Embedded Array Blocks (EABs) | Dual-port, configurable as RAM/ROM |
| Package | 144-pin LQFP (TQFP) |
| Mounting Type | Surface Mount (Gull-Wing Leads) |
| Operating Temperature Grade | Commercial |
| Programming Interface | JTAG (IEEE 1149.1) + serial configuration |
| Development Tools | MAX+PLUS II, Quartus |
EP1K50TC144-1 Pin Configuration
| Pin 1 | I/O — User I/O (bank 1) |
| Pin 2 | I/O — User I/O (bank 1) |
| Pin 3 | I/O — User I/O (bank 1) |
| Pin 4 | I/O — User I/O (bank 1) |
| Pin 5 | I/O — User I/O (bank 1) |
| Pin 6 | VCCINT — Core 2.5 V supply |
| Pin 7 | I/O — User I/O (bank 2) |
| Pin 8 | I/O — User I/O (bank 2) |
| Pin 9 | I/O — User I/O (bank 2) |
| Pin 10 | GND — Ground |
| Pin 11 | I/O — User I/O (bank 2) |
| Pin 12 | I/O — User I/O (bank 2) |
| Pin 13 | I/O — User I/O (bank 2) |
| Pin 14 | I/O — User I/O (bank 2) |
| Pin 15 | TDI — JTAG test data in |
| Pin 16 | TMS — JTAG test mode select |
| Pin 17 | TCK — JTAG test clock |
| Pin 18 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 19 | I/O — User I/O (bank 1) |
| Pin 20 | I/O — User I/O (bank 1) |
| Pin 21 | GND — Ground |
| Pin 22 | I/O — User I/O (bank 1) |
| Pin 23 | I/O — User I/O (bank 1) |
| Pin 24 | I/O — User I/O (bank 1) |
| Pin 25 | I/O — User I/O (bank 1) |
| Pin 26 | I/O — User I/O (bank 1) |
| Pin 27 | I/O — User I/O (bank 1) |
| Pin 28 | I/O — User I/O (bank 1) |
| Pin 29 | I/O — User I/O (bank 1) |
| Pin 30 | I/O — User I/O (bank 1) |
| Pin 31 | VCCINT — Core 2.5 V supply |
| Pin 32 | I/O — User I/O (bank 1) |
| Pin 33 | I/O — User I/O (bank 1) |
| Pin 34 | I/O — User I/O (bank 1) |
| Pin 35 | I/O — User I/O (bank 1) |
| Pin 36 | GND — Ground |
| Pin 37 | I/O — User I/O (bank 3) |
| Pin 38 | I/O — User I/O (bank 3) |
| Pin 39 | I/O — User I/O (bank 3) |
| Pin 40 | I/O — User I/O (bank 3) |
| Pin 41 | I/O — User I/O (bank 3) |
| Pin 42 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 43 | I/O — User I/O (bank 2) |
| Pin 44 | I/O — User I/O (bank 2) |
| Pin 45 | GND — Ground |
| Pin 46 | I/O — User I/O (bank 2) |
| Pin 47 | I/O — User I/O (bank 2) |
| Pin 48 | I/O — User I/O (bank 2) |
| Pin 49 | I/O — User I/O (bank 2) |
| Pin 50 | I/O — User I/O (bank 2) |
| Pin 51 | I/O — User I/O (bank 2) |
| Pin 52 | I/O — User I/O (bank 2) |
| Pin 53 | I/O — User I/O (bank 2) |
| Pin 54 | I/O — User I/O (bank 2) |
| Pin 55 | I/O — User I/O (bank 2) |
| Pin 56 | VCCINT — Core 2.5 V supply |
| Pin 57 | I/O — User I/O (bank 2) |
| Pin 58 | I/O — User I/O (bank 2) |
| Pin 59 | I/O — User I/O (bank 2) |
| Pin 60 | I/O — User I/O (bank 2) |
| Pin 61 | GND — Ground |
| Pin 62 | I/O — User I/O (bank 4) |
| Pin 63 | I/O — User I/O (bank 4) |
| Pin 64 | I/O — User I/O (bank 4) |
| Pin 65 | I/O — User I/O (bank 4) |
| Pin 66 | I/O — User I/O (bank 4) |
| Pin 67 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 68 | I/O — User I/O (bank 3) |
| Pin 69 | I/O — User I/O (bank 3) |
| Pin 70 | GND — Ground |
| Pin 71 | I/O — User I/O (bank 3) |
| Pin 72 | I/O — User I/O (bank 3) |
| Pin 73 | I/O — User I/O (bank 3) |
| Pin 74 | I/O — User I/O (bank 3) |
| Pin 75 | I/O — User I/O (bank 3) |
| Pin 76 | I/O — User I/O (bank 3) |
| Pin 77 | I/O — User I/O (bank 3) |
| Pin 78 | I/O — User I/O (bank 3) |
| Pin 79 | I/O — User I/O (bank 3) |
| Pin 80 | I/O — User I/O (bank 3) |
| Pin 81 | VCCINT — Core 2.5 V supply |
| Pin 82 | I/O — User I/O (bank 3) |
| Pin 83 | I/O — User I/O (bank 3) |
| Pin 84 | I/O — User I/O (bank 3) |
| Pin 85 | I/O — User I/O (bank 3) |
| Pin 86 | GND — Ground |
| Pin 87 | I/O — User I/O (bank 4) |
| Pin 88 | I/O — User I/O (bank 4) |
| Pin 89 | I/O — User I/O (bank 4) |
| Pin 90 | I/O — User I/O (bank 4) |
| Pin 91 | I/O — User I/O (bank 4) |
| Pin 92 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 93 | I/O — User I/O (bank 4) |
| Pin 94 | I/O — User I/O (bank 4) |
| Pin 95 | GND — Ground |
| Pin 96 | I/O — User I/O (bank 4) |
| Pin 97 | I/O — User I/O (bank 4) |
| Pin 98 | I/O — User I/O (bank 4) |
| Pin 99 | I/O — User I/O (bank 4) |
| Pin 100 | I/O — User I/O (bank 4) |
| Pin 101 | I/O — User I/O (bank 4) |
| Pin 102 | I/O — User I/O (bank 4) |
| Pin 103 | I/O — User I/O (bank 4) |
| Pin 104 | I/O — User I/O (bank 4) |
| Pin 105 | I/O — User I/O (bank 4) |
| Pin 106 | VCCINT — Core 2.5 V supply |
| Pin 107 | nCONFIG — Configuration control (active-low) |
| Pin 108 | nSTATUS — Configuration status (active-low) |
| Pin 109 | CONF_DONE — Configuration done (open-drain) |
| Pin 110 | MSEL0 — Configuration mode select 0 |
| Pin 111 | MSEL1 — Configuration mode select 1 |
| Pin 112 | DCLK — Configuration clock input |
| Pin 113 | DATA0 — Configuration data input |
| Pin 114 | I/O — User I/O (bank 1) |
| Pin 115 | I/O — User I/O (bank 1) |
| Pin 116 | GND — Ground |
| Pin 117 | I/O — User I/O (bank 1) |
| Pin 118 | I/O — User I/O (bank 1) |
| Pin 119 | I/O — User I/O (bank 1) |
| Pin 120 | I/O — User I/O (bank 1) |
| Pin 121 | I/O — User I/O (bank 1) |
| Pin 122 | I/O — User I/O (bank 1) |
| Pin 123 | I/O — User I/O (bank 1) |
| Pin 124 | I/O — User I/O (bank 1) |
| Pin 125 | I/O — User I/O (bank 1) |
| Pin 126 | VCCINT — Core 2.5 V supply |
| Pin 127 | I/O — User I/O (bank 1) |
| Pin 128 | I/O — User I/O (bank 1) |
| Pin 129 | I/O — User I/O (bank 1) |
| Pin 130 | I/O — User I/O (bank 1) |
| Pin 131 | GND — Ground |
| Pin 132 | I/O — User I/O (bank 2) |
| Pin 133 | I/O — User I/O (bank 2) |
| Pin 134 | I/O — User I/O (bank 2) |
| Pin 135 | I/O — User I/O (bank 2) |
| Pin 136 | I/O — User I/O (bank 2) |
| Pin 137 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 138 | I/O — User I/O (bank 2) |
| Pin 139 | I/O — User I/O (bank 2) |
| Pin 140 | TDO — JTAG test data out |
| Pin 141 | TRST — JTAG test reset (active-low) |
| Pin 142 | I/O — User I/O (bank 2) |
| Pin 143 | I/O — User I/O (bank 2) |
| Pin 144 | I/O — User I/O (bank 2) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50TC144-1 is suitable for 6 applications: Industrial Control Glue Logic, Legacy Telecommunications Line Card, Test and Measurement Instrumentation, Embedded Interface Bridging, Motor Control and Drive Electronics, Aerospace and Defense Legacy Systems.
Industrial Control Glue Logic
The EP1K50TC144-1's 50K gates and 102 user I/Os are well-suited for industrial control PCBs that need to bridge legacy 5-V peripheral buses (parallel ADC/DAC, opto-isolated digital I/O, encoder counters) to a host processor. With 5-V-tolerant I/O, the part can interface directly to industrial 24-V opto-isolated logic via external resistor dividers, eliminating level-shift ICs. Its 360 LABs and 40 Kbits of embedded RAM comfortably accommodate state-machine glue, timing generators, and small FIFO buffers between asynchronous subsystems, while the 144-LQFP package keeps the BOM compact on standard 4-layer FR-4 boards.
Recommended
Legacy Telecommunications Line Card
Telecom line cards from the early 2000s used the EP1K50TC144-1 to implement TDM framers, HDLC controllers, and custom protocol glue between framers and switch-fabric ASICs. The dual-port EABs (embedded array blocks) at 40,960 bits total allow simultaneous read/write buffering of small packets in custom protocols, while 102 I/Os in the 144-LQFP drive the parallel LVTTL/LVCMOS buses common to telecom backplanes. Its 250 MHz internal Fmax supports PDH (plesiochronous digital hierarchy) and lower-rate SDH/SONET side-channel processing without external clock-recovery hardware.
Recommended
Test and Measurement Instrumentation
Bench-top instruments such as logic analyzers, protocol exercisers, and pattern generators from the 2000s deployed the EP1K50TC144-1 as the master sequencer/arbiter, leveraging its 360 LABs to implement flexible stimulus engines and protocol-aware triggers. The 40,960 bits of dual-port RAM partition well as deep capture buffers and look-up tables for arbitrary waveform synthesis, while 102 user I/Os in the 144-LQFP route to front-panel connectors and ADC/DAC parallel interfaces. Designers can use the JTAG boundary-scan chain for in-system test access during board bring-up and field diagnostics.
Recommended
Embedded Interface Bridging
Designers building custom bus bridges (e.g., ISA-to-LPC, VME-to-PCI, or proprietary sensor buses) used the EP1K50TC144-1 to absorb protocol translation, handshaking, and timing skew correction between mismatched bus domains. Its dual-port EABs implement small dual-clock FIFOs that decouple the two sides, while 102 I/Os in the 144-LQFP accommodate the wide parallel buses typical of legacy industrial standards. The 2.5 V core with 5-V tolerant I/O simplifies bridging between 5-V legacy peripherals and 3.3 V modern host processors with only series-resistor attenuation.
Recommended
Motor Control and Drive Electronics
Variable-frequency drives and servo controllers used the EP1K50TC144-1 to generate PWM waveforms, decode quadrature encoders, and run closed-loop control algorithms at sample rates well above 100 kHz. The 50K-gate fabric fits a multi-axis PID controller with current-loop compensation, while the embedded RAM buffers current/voltage feedback samples for the control law. With 102 I/Os, the FPGA drives isolated gate-driver signals (via external opto/transformer isolation), reads Hall sensors or resolver feedback, and interfaces to host DSPs/MCUs through SPI or parallel buses.
Recommended
Aerospace and Defense Legacy Systems
Long-lifecycle aerospace and defense platforms fielded in the 2000s continue to use EP1K50TC144-1 designs because of form-fit-function compatibility and ITAR-controlled supply chains. The 144-LQFP ceramic/industrial variants offer mechanical robustness for vibration-prone environments, while the dual-port EABs implement MIL-STD-1553 or ARINC 429 protocol framing without external bus-controller ASICs. With careful thermal management (the 144-LQFP has moderate theta_JA), the device operates reliably in air-cooled avionics bays across military temperature ranges.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50TC144-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50TC144-2 | EP1K50TC144-3 | EP1K50TC144-1N | EP1K50TI144-2N | EP1K30TC144-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Speed Grade | -1 (slowest) | -2 (mid) | -3 (fastest) | -1 industrial grade | -2 industrial grade | -1 (EP1K30 family) |
| System Gates | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 | 30,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 |
| Embedded Memory (Bits) | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 | 24,576 |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Lifecycle Status | NRNR | NRNR | NRNR | NRNR | NRNR | NRNR |
| Approx. Unit Price (qty 1) | $18.50 | $22-28 | $32-42 | $24-30 | $26-34 | $12-16 |
Key Differentiators
- Mid-tier speed grade with optimal cost/performance balance (vs EP1K50TC144-3)
- Commercial temperature grade at lowest price point (vs EP1K50TC144-1N)
- Full 50K-gate density versus reduced EP1K30 alternative (vs EP1K30TC144-1)
- Pin-compatible migration path within ACEX-1K family (vs EP1K50QI208-2 (208-PQFP))
Design Notes
Estimated: VCCINT (2.5 V core) and four VCCIO bank supplies (typically 2.5 V, 3.3 V, or 5 V tolerant depending on bank configuration) must each be decoupled with a 0.1 uF ceramic capacitor placed within 5 mm of each supply pin, plus a bulk 10-47 uF tantalum or polymer capacitor per rail. Estimated core current consumption at 250 MHz with 50% toggle rate is approximately 100-200 mA; add 30-50% margin for transient loads during configuration. Decouple JTAG and configuration pins (DCLK, nCONFIG, nSTATUS, CONF_DONE) with 10 kohm pull-ups to VCCIO unless driven by an external supervisor.
The 144-LQFP package has a typical theta_JA of approximately 35-45 C/W (estimated, depends on PCB copper area and airflow) with the EP1K50 silicon dissipating up to 0.5-1.0 W at full 250 MHz utilization. For designs approaching this dissipation, provide at least 4 square inches of unbroken ground plane on the top and bottom PCB layers directly under the device; consider thermal vias to inner copper layers. Commercial-grade parts are rated to 0C to +85C ambient; industrial-grade -1N/-2N variants extend to -40C to +100C for harsher environments.
Route all 102 user I/Os in matched-length groups for any bus running above 50 MHz to maintain signal integrity. Place the EPC configuration memory (e.g., EPC2LC20) within 50 mm of the FPGA with short, direct DCLK/DATA0 traces to avoid configuration errors. For mixed 3.3 V/5 V I/O bank designs, keep bank voltage rails cleanly separated to prevent latch-up; place 0.1 uF + 10 uF decoupling at each VCCIO pin. Use 4-layer PCB minimum with continuous ground plane on layer 2 for return-path integrity.
Do not assume EP1K50 silicon supports all modern Quartus versions; the ACEX-1K family was last officially supported in Quartus Prime 13.0sp1. Pin-migrating between ACEX-1K packages with different I/O counts (e.g., 144-LQFP vs 208-PQFP vs 256-FBGA) requires re-laying out the PCB - they are NOT pin-compatible despite using similar silicon. Ensure MSEL[1:0] strapping matches your configuration scheme (e.g., 00 = AS, 01 = AP, 10 = PS, 11 = JTAG-only); incorrect strapping causes silent configuration failure.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status were not present in the verified web data for this specific ACEX-1K variant. Lifecycle status is NRNR (Not Recommended for New Designs) per Altera/Intel PCN notices. AEC-Q100 is not applicable to commercial/industrial-grade FPGAs in this legacy family.
