EP1S30F780C7AA - Stratix 32K LE FPGA, 597 I/O, 780-FBGA | Intel
MPN: EP1S30F780C7AA ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142 | $142,000.00 |
Drop-in alternatives for EP1S30F780C7AA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1S30F780C7
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View Datasheet →EP1S30F780C7AA Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 32,470 |
| Total Memory Bits | 3,317,184 |
| Maximum User I/O | 597 |
| Package | 780-ball FCBGA (FineLine BGA) |
| Speed Grade | -7 |
| Operating Temperature | 0C to +85C (commercial) |
| Core Voltage | 1.5 V (VCCINT) |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, LVPECL, PCI, PCI-X |
| DSP Blocks | Embedded multiplier blocks (9x9, 18x18, 36x36) |
| DSP Performance | Up to 2.1 GMACS at -7 speed grade |
| PLLs | Multi-PLL architecture |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| Process Node | 0.13 µm SRAM |
| MSL Level | 3 (168 Hours) |
| Packaging | Tray |
EP1S30F780C7AA 780-ball fcbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1S30F780C7AA (780-ball fcbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F780C7AA.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F780C7AA is suitable for 6 applications: Telecommunications Line Cards, ASIC Prototyping and Emulation, Digital Signal Processing (DSP), Broadcast Video Processing, Medical Imaging Front-End, Industrial Test and Measurement.
Telecommunications Line Cards
The EP1S30F780C7AA's combination of 32,470 logic elements and approximately 3.3 Mbits of TriMatrix memory suits mid-density telecom line cards where packet processing, framing, and SERDES glue logic must coexist on a single device. Its 597 user I/O pins can absorb multiple UTOPIA/SPI-4.2 interfaces, fabric switch ports, and control-plane GPIO without external bus multiplexing. Designers typically pair it with external PHY devices and use the embedded multiplier blocks for forward error correction (FEC) and Viterbi decoding, achieving up to 2.1 GMACS throughput per block at the -7 speed grade.
Recommended
ASIC Prototyping and Emulation
With 32,470 LEs and abundant memory, the EP1S30F780C7AA serves as an effective platform for ASIC prototyping where multiple FPGA instances can be partitioned using dedicated I/O banks and JTAG chains. The Quartus II LogicLock feature allows designers to map RTL blocks to specific physical regions, preserving timing closure when migrating to ASIC. The 780-FBGA package exposes enough user I/O for chip-to-chip bridges between multiple FPGAs on the same prototyping board.
Recommended
Digital Signal Processing (DSP)
The EP1S30F780C7AA's embedded multiplier blocks implement 9x9, 18x18, and 36x36 signed/unsigned multiplications in a single clock cycle, supporting FIR filters, FFTs, and matrix operations without consuming general-purpose logic. At the -7 speed grade, these multipliers deliver up to 2.1 GMACS, making the device suitable for software-defined radio baseband processing, radar pulse compression, and image preprocessing pipelines. The TriMatrix memory blocks provide single-cycle access to coefficient and sample storage required by these DSP algorithms.
Recommended
Broadcast Video Processing
Broadcast video designs require wide data paths and high clock rates to handle uncompressed SDI streams, color space conversion, and frame-rate conversion in real time. The EP1S30F780C7AA's 597 user I/O can directly interface to multi-channel SDI serializers, while embedded RAM supports line buffers and motion-estimation windows. The -7 speed grade comfortably meets HD-SDI data rates at internal clock frequencies above 148.5 MHz, with margin for higher UHD prototyping.
Recommended
Medical Imaging Front-End
Ultrasound, CT, and MRI front-ends digitize wide-bandwidth analog signals and route them through real-time beam-formers and image reconstruction pipelines. The EP1S30F780C7AA's embedded multipliers handle the intensive convolution and FFT operations typical in these systems, while the TriMatrix memory holds sample windows and lookup tables. The 597 I/O count allows direct interfacing to multi-channel ADC/DAC clusters without external bus-switching logic, reducing board area and BOM cost.
Recommended
Industrial Test and Measurement
Automated test equipment (ATE) and bench-top instrumentation demand deterministic timing, dense logic, and abundant I/O for control and stimulus channels. The EP1S30F780C7AA meets these needs by providing 32,470 LEs for pattern generation, vector capture, and DSP-based signal conditioning, with 597 user I/O to drive scan chains, GPIB/LXI interfaces, and parallel ADC/DAC buses. The commercial 0°C to +85°C temperature range covers most lab and factory-floor environments without requiring industrial-grade parts.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F780C7AA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F780C7 | EP1S30F780C6 | EP1S40F780C7 | EP1S25F780C7 | EP1S30F1020C7 |
|---|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 1020-FBGA - different (larger) |
| Brand | Intel (formerly Altera) | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera | Intel/Altera |
| Logic Elements | 32,470 | 32,470 | 32,470 | 41,250 | 25,660 | 32,470 |
| Total Memory Bits | 3,317,184 | 3,317,184 | 3,317,184 | 3,423,744 | 1,944,576 | 3,317,184 |
| Maximum User I/O | 597 | 597 | 597 | 597 | 597 | 726 |
| Speed Grade | -7 | -7 | -6 | -7 | -7 | -7 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Identical silicon to EP1S30F780C7 with 100% drop-in compatibility (vs EP1S30F780C7)
- Faster -7 speed grade versus -6 speed grade (vs EP1S30F780C6)
- Higher logic density than EP1S25F780C7 at same 780-FBGA package (vs EP1S25F780C7)
Design Notes
The EP1S30F780C7AA requires multiple power rails: VCCINT (1.5 V core), VCCIO (per-bank I/O voltages), VCCA_PLL (analog PLL supply), and VCCPD (pre-driver). Decouple each rail with 0.1 µF and 0.01 µF ceramic capacitors placed as close as possible to the corresponding balls, plus bulk decoupling on each rail. Use Intel's PowerPlay Early Power Estimator (EPE) tool during schematic design to estimate worst-case power and to size the regulator accordingly.
The 780-FBGA package has a 1.0 mm ball pitch and requires a multi-layer PCB with microvia technology or an equivalent high-density interconnect process. Use at least a 6-layer stack-up with dedicated ground and power planes beneath the device. Match trace lengths for high-speed DDR or LVDS interfaces; the Stratix Device Handbook pin connection guidelines prescribe maximum skew targets for each I/O standard. Avoid routing signal traces beneath the BGA balls and provide a solid ground pad with thermal vias to the inner ground plane.
When migrating from a -6 to a -7 speed grade (or vice versa), regenerate the Quartus II timing constraints and re-run TimeQuest analysis; timing closure at one speed grade does not guarantee timing at another. Ensure unused I/O pins are configured as tri-stated inputs with weak pull-up in the Quartus device and pin options. Configure JTAG TCK with a defined pull-down to prevent inadvertent boundary-scan events during power-up.
For LVDS interfaces at 624 Mbps or higher, maintain 100 Ω differential impedance on PCB traces and use length matching within 20 mil (0.5 mm) for the P and N signals. Place series resistors near the FPGA output to dampen reflections; consult the Stratix Device Handbook's LVDS section for specific resistor values. For PCI/PCI-X, route the 66 MHz clock with controlled impedance and minimize stubs.
Compliance Information
RoHS compliant per Altera/Intel Stratix product declaration. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For automotive applications choose a Cyclone IV/V or newer automotive-qualified variant.
