EP1S30F780I6N - Stratix FPGA, 32.5K LE, 780-BGA | Intel / Altera
MPN: EP1S30F780I6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $248 | $24,800.00 |
| 250 | $235 | $58,750.00 |
| 500 | $225 | $112,500.00 |
Drop-in alternatives for EP1S30F780I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1S30F780I6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 32,470 |
| Total RAM Bits | 3,317,184 bits |
| User I/O Count | 597 |
| Package Type | 780-BBGA, FCBGA (FineLine BGA) |
| Operating Temperature | -40C to +100C (Industrial, I6) |
| Process Technology | 130 nm |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| Lead-Free / RoHS | Lead-free terminal finish (N suffix), RoHS-compliant |
| Speed Grade | -6 |
| DSP Blocks | Yes (TriMatrix + DSP blocks per Stratix family) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (per typical FBGA moisture sensitivity) |
| JEDEC Code (e1) | e1 (Pb-free / matte tin) |
EP1S30F780I6N 780-bbga, fcbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1S30F780I6N (780-bbga, fcbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F780I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F780I6N is suitable for 6 applications: Telecommunications Line Card, DSP Front-End for Base Station / Radar, Industrial Control and Factory Automation, Video / Image Processing Pre-Processor, High-Speed Memory and Bus Interface Bridge, Test & Measurement Instrumentation.
Telecommunications Line Card
The EP1S30F780I6N fits telecom line cards because its 32,470 logic elements and 597 user I/O pins can be configured as protocol bridges (e.g., SPI-to-Ethernet, I2C-to-UART), HDLC controllers, and packet-aggregation logic for legacy infrastructure. The 130 nm Stratix fabric supports high clock rates for TDM serial backplane glue logic, and the embedded 3.3 Mbit of TriMatrix memory is sufficient for several hundred microseconds of packet buffering per channel. Per the Stratix Device Handbook, the device's 597 I/O pins enable direct connection to multiple parallel bus segments without external bus switches, simplifying PCB layout for line-card daughter cards.
Recommended
DSP Front-End for Base Station / Radar
In radar and base-station DSP front-ends, the EP1S30F780I6N provides dedicated hardware multiplier blocks and embedded RAM needed for FIR filters, FFT cores, and pulse-Doppler processing. With 32,470 LEs and the Stratix DSP block architecture, designers can implement multi-channel beamforming or multi-stage FFT pipelines at high clock rates. Per the Stratix Device Handbook, the device supports up to several hundred DSP block operations per clock cycle in fixed-point configurations, suitable for receiver digital-down-conversion and matched-filter implementations in defense and wireless-infrastructure applications.
Recommended
Industrial Control and Factory Automation
The EP1S30F780I6N suits industrial-control systems because its industrial temperature rating (-40C to +100C) and 597 I/O pins can be configured as Profibus, CAN, RS-485, or parallel LVDS interface logic, plus custom state machines for PLC and motion-control subsystems. The 32,470 LEs enable on-chip integration of multiple fieldbus bridges without needing an external ASIC. Per Stratix Device Handbook documentation, the device supports LVDS signaling for noise-immune communication in factory-floor environments with high EMI, and the FBGA-780 package provides robust thermal performance when paired with adequate PCB copper pours for sustained industrial operation.
Recommended
Video / Image Processing Pre-Processor
The EP1S30F780I6N can serve as a video/image pre-processor for high-resolution camera systems, implementing Bayer demosaicing, gamma correction, scaling, and JPEG compression in firmware. With 32,470 LEs and 597 I/O pins, multiple parallel camera data lanes can be ingested simultaneously, and the embedded RAM is sufficient for line-buffering in pipelined image-processing architectures. Per Stratix Device Handbook reference designs, this device family supports multiple video standards (BT.656, BT.1120) and LVDS signaling for high-speed image sensor interfaces, making it a strong choice for medical imaging and surveillance front-ends.
Recommended
High-Speed Memory and Bus Interface Bridge
The EP1S30F780I6N functions as a custom bus/memory bridge that translates legacy parallel interfaces (VME, PCI, custom parallel buses) to modern DDR/DDR2 memory controllers. With 597 user I/O pins and 3.3 Mbit of embedded memory, designers can implement multiple FIFO depths and protocol conversion logic. The Stratix device's embedded memory can be configured as dual-port RAM or FIFO with selectable widths, enabling real-time buffering between asynchronous clock domains. Per Stratix Device Handbook timing specifications, the device supports DDR memory interfaces at industry-standard rates for bridging ASIC/FPGA co-designs.
Recommended
Test & Measurement Instrumentation
The EP1S30F780I6N enables custom logic-analyzer and protocol-analyzer instrumentation because its 597 I/O pins support multi-channel capture, real-time trigger generation, and inline protocol decoding. The 32,470 LEs and embedded TriMatrix memory allow real-time storage of high-speed event streams with custom compression logic. Per the Stratix Device Handbook, the device supports LVDS at hundreds of MHz, sufficient for capturing high-speed serial protocols on each channel in parallel. The FBGA-780 footprint and industrial temperature rating make it a reliable platform for benchtop test equipment deployed in labs and field installations.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F780I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F780I6 | EP1S30F780C8N | EP1S30F780C7N | EP1S30F780C6N | EP1S25F780I6N | EP1S20F780I6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (FineLine BGA) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 32,470 LEs | 32,470 LEs | 32,470 LEs | 32,470 LEs | 32,470 LEs | 24,960 LEs | 18,460 LEs |
| Total RAM Bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 1,944,576 bits | 1,287,168 bits |
| User I/O Count | 597 | 597 | 597 | 597 | 597 | 597 | 597 |
| Operating Temperature | -40C to +100C (industrial, I6) | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C |
| Speed Grade | -6 | -6 | -8 | -7 | -6 | -6 | -6 |
| Lead-Free Finish (RoHS) | Yes (Pb-free, JESD-609 e1) | No (leaded terminal) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Obsolete | Obsolete | Last Time Buy | Last Time Buy |
Key Differentiators
- Highest logic density in the 780-ball FBGA footprint of the EP1S family (vs EP1S25F780I6N)
- Industrial temperature grade combined with full logic capacity (vs EP1S30F780C8N)
- Pb-free lead-free terminal finish for RoHS-compliant manufacturing (vs EP1S30F780I6)
Design Notes
The 780-ball FineLine BGA package has a 1.0 mm ball pitch, requiring 4+ PCB routing layers with microvia technology for signal breakout. Per the Stratix Device Handbook, use a stack-up with ground and power planes adjacent to the BGA balls to provide low-impedance return paths. Power plane islands should follow the datasheet's recommended decoupling pattern: 0.1 uF X7R capacitors per power pin, plus 10 uF bulk capacitors every 10 mm. Keep total DC voltage drop across power planes below 25 mV for reliable I/O operation.
Estimated: at typical Stratix core utilization (50% LE + 50% RAM + 50% DSP blocks), the EP1S30F780I6N dissipates approximately 3-5 W. Junction temperature rises by 12-20C above ambient with a well-designed 8-layer PCB. Forced airflow is recommended for industrial deployments where ambient can reach +100C. Designers should measure Theta_JA on the actual PCB stack-up and provide heat-sinking via thermal vias under the die flag if the calculated junction temperature exceeds 125C. The 130 nm process tends to have higher leakage current than modern FPGAs, so cold-temperature ambient (-40C) does not relieve thermal concerns during warm-up transients.
Critical: The EP1S30F780I6N operates on a multi-rail power supply (typically 1.5V core, 2.5V PLL, 3.3V I/O) and requires power-sequencing per the Stratix Device Handbook. Out-of-sequence voltage application can cause permanent latch-up damage. Use a power-supply sequencer IC or implement external supervisory logic. Also note that the 'I6' suffix indicates -40C to +100C ambient operation; design margins for industrial safety certifications should treat this as the maximum case temperature. Finally, do not substitute the EP1S30F1020I6N (1020-ball FBGA) - that is a different package footprint and not drop-in compatible.
Compliance Information
RoHS compliant per 'N' suffix denoting Pb-free finish; REACH compliance per Intel/Altera documentation. Not AEC-Q100 qualified (industrial non-automotive classification). Conflict-minerals compliance per Intel supply-chain policy.
