EP1S30F780C7N - Stratix FPGA 32470 LE, 780-FBGA | Intel
MPN: EP1S30F780C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $951.9 | $951.90 |
| 10 | $880 | $8,800.00 |
| 100 | $780 | $78,000.00 |
| 500 | $695 | $347,500.00 |
| 1,000 | $620 | $620,000.00 |
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View Datasheet →EP1S30F780C7N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 32,470 |
| Logic Array Blocks (LABs) | 3,247 |
| Configurable Logic Blocks (CLBs) | 3,819 |
| Embedded Memory Bits | 3,317,184 bits |
| Maximum User I/O | 597 |
| PLLs | 4 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Package | 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1) / Passive Serial / Fast Passive Parallel |
| Internal Speed Grade | C7 |
| Lead Free / RoHS | Lead Free per FindIC datasheet entry (2014-12-09) |
EP1S30F780C7N 780-ball fc-fbga (29 x 29 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S30F780C7N (780-ball fc-fbga (29 x 29 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F780C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F780C7N is suitable for 7 applications: Telecommunications Backplane Switching, Network Interface Cards (NIC) / Protocol Bridging, Digital Video Broadcasting Equipment, High-Performance DSP Prototyping, Industrial Control / Test Equipment, Legacy Storage / RAID Controllers, Aerospace / Defense Signal Processing (legacy programs).
Telecommunications Backplane Switching
The EP1S30F780C7N fits telecom backplane switching applications because its 32,470 logic elements, 597 user I/Os, and 4 PLLs provide the parallel datapath width and clock-domain management required by multi-gigabit bus standards. Its embedded TriMatrix memory (3.3 Mbit) is large enough to buffer packet headers and traffic-manager queues between ingress and egress ports without external SSRAM, simplifying board layout. The 1.5 V VCCINT plus selectable 1.5/1.8/2.5/3.3 V VCCIO let one device bridge legacy LVTTL control logic with newer LVDS / SSTL backplane PHYs. Designers typically instantiate SPI-4.2 or UTOPIA Level 3 cores from the Altera MegaCore library and target fMAX around 100-133 MHz DDR on the source-synchronous bus.
Recommended
Network Interface Cards (NIC) / Protocol Bridging
In NIC and protocol-bridging designs, the EP1S30F780C7N is a strong fit because its Stratix architecture implements 10/100/1000 Ethernet MACs, SPI-3/SPI-4.2 PHY interfaces, and custom packet-classification engines in a single chip. The 130 nm process provides the headroom for sustained 125 MHz DDR on LVDS I/O, which is the typical rate for SPI-4.2 PL4 interfaces. The dedicated PLL count (4) supports independent transmit and receive clock domains plus a system reference. With 3.3 Mbit of embedded RAM, designers can build line-rate lookup tables and statistics counters without external memory.
Recommended
Digital Video Broadcasting Equipment
The EP1S30F780C7N suits DVB encoder / decoder and MPEG transport-stream processing because the TriMatrix memory blocks can be configured as dual-port buffers for video frame reordering, while the 32K LE fabric implements TS demultiplexers, PSI/SI table parsers, and PCR restamping logic in a single device. Source-synchronous LVDS I/O pairs cleanly receive DVB-ASI (270 Mbps) and parallel TS buses (up to ~1 Gbps). The 780-FBGA exposes enough user I/Os (597) for head-end chassis with multiple TS inputs and outputs plus Ethernet management. Industrial 0-85 C temperature operation covers the chassis-internal environment typical of head-end racks.
Recommended
High-Performance DSP Prototyping
The EP1S30F780C7N works well for DSP prototyping (FIR filters, FFTs, video codecs) because its dedicated DSP blocks implement hardened multipliers and add-accumulators at high fMAX, while the surrounding 32K-LE fabric implements control state machines and address generators. The 3.3 Mbit embedded memory is large enough to hold FFT twiddle tables and video line buffers, eliminating external SSRAM in many designs. LVDS source-synchronous I/O at up to 640 Mbps supports high-speed ADC/DAC interfacing in instrumentation front-ends. Quartus II 9.0 provides IP cores (FFT, FIR, NCO) optimized for the Stratix DSP block architecture.
Recommended
Industrial Control / Test Equipment
The EP1S30F780C7N fits industrial test-and-measurement chassis where its 597 user I/Os can be split among instrument buses (GPIB, LXI, USB, RS-485), front-panel display controllers, and FPGA-mezzanine-card (FMC) sites. The 1.5 V core plus selectable VCCIO levels simplifies level-shifting to mixed-voltage peripherals. Embedded 3.3 Mbit RAM holds waveform capture buffers and protocol trace memory. Industrial 0-85 C temperature operation covers the chassis-internal thermal envelope. The JTAG (IEEE 1149.1) boundary-scan interface simplifies board bring-up and in-system diagnostics.
Recommended
Legacy Storage / RAID Controllers
Storage and RAID controller cards in the late 2000s frequently used the EP1S30F780C7N because its 597 I/Os are sufficient to drive multiple SATA / SAS PHYs plus a PCIe x4 endpoint, while the 3.3 Mbit embedded RAM serves as on-chip command-queue and write-back cache scratchpad. The 4 PLLs generate the precise reference clocks required by SATA 1.5/3.0 Gbps serial interfaces. The 780-FBGA's 1 mm pitch is compatible with standard high-layer-count PCB stackups used in storage backplanes. Migration paths to Cyclone V or Stratix V are documented in Altera application notes AN 532 and AN 633.
Recommended
Aerospace / Defense Signal Processing (legacy programs)
Although the EP1S30F780C7N is not radiation-hardened, it is widely found in commercial-off-the-shelf (COTS) aerospace and defense signal-processing subsystems (radar IF stages, electronic-warfare test rigs, flight-simulator I/O) that operate in temperature-controlled enclosures. The 32K-LE fabric and 4 PLLs enable multi-channel beamforming and IF digitizer fan-out. The 780-FBGA is mechanically compatible with standard VITA 57 FMC mezzanine sites. For new aerospace programs, the Altera (now Intel) recommendation is to migrate to radiation-tolerant Cyclone V or Microsemi RTG4 families.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F780C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F780C7 | EP1S30F780C7AA | EP1S30F780C6N | EP1S30F780C6 | EP1S30F780C6GA |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA (29x29 mm, 1 mm pitch) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 |
| Speed Grade | C7 | C7 | C7 | C6 (slower) | C6 (slower) | C6 (slower) |
| Ball Finish | Lead-Free (Pb-free) | SnPb (tin-lead) | Per AA suffix spec | Lead-Free | SnPb | Per GA suffix spec |
| User I/O Count | 597 | 597 | 597 | 597 | 597 | 597 |
| Embedded Memory | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | Per AA suffix spec | 0 C to 85 C | 0 C to 85 C | Per GA suffix spec |
| Lifecycle Status | NRNR (Not Recommended for New Designs) | NRNR | NRNR | NRNR | NRNR | NRNR |
Key Differentiators
- Mid-density Stratix silicon with 32K LEs in 780-BGA package (vs EP1S25F780C7N)
- Higher internal speed grade (C7) than C6 alternatives (vs EP1S30F780C6N)
- Lead-free (Pb-free) ball finish (vs EP1S30F780C7)
Design Notes
Stratix EP1S30F780C7N requires three power rails: VCCINT at 1.5 V, VCCIO at 1.5/1.8/2.5/3.3 V per bank, and VCC_PLL for the 4 PLLs (typically 1.5 V). VCCINT must ramp monotonically within the POR timing window (typically <100 ms from 0 V to 1.5 V). Bulk decoupling of 100-220 uF plus 10 uF per VCC_PLL pin is recommended; high-frequency decoupling uses 100 nF X7R placed within 5 mm of each VCC/GND ball pair. Altera AN 366 (Stratix PowerPlay) provides detailed power-budget worksheets for the C7 speed grade at typical 100 MHz logic utilization.
The 780-FBGA uses 1.0 mm ball pitch (JEDEC MO-151). Use a minimum 10-layer PCB stackup with dedicated ground and power planes. Microvia (laser-drilled) or stacked-via structures are required for fan-out from inner-row balls. Maintain a continuous reference plane under all LVDS pairs and source-synchronous buses to control impedance (target 100 ohm differential, 50 ohm single-ended). Per Altera AN 315, via-in-pad is acceptable but should not exceed 20% of total ball count to maintain assembly yield. Pin 1 (A1 ball) is located per the JEDEC MO-151 top-left convention.
Assign high-speed LVDS pairs (TX/RX clocks) to bank edges nearest the corresponding PLL inputs to minimize clock-distribution skew. The 4 PLLs are physically distributed across the die; consult the Stratix pinout file in Quartus II 9.0 to map PLL numbers to specific I/O banks. Keep PLL analog VCC_PLL balls separated from noisy digital VCC by a ferrite bead or pi-filter. JTAG TCK should be a 10-25 MHz signal routed on an inner layer to reduce EMI; include a TCK pull-down to ensure defined state during configuration.
Stratix I/O supports LVDS at up to 640 Mbps source-synchronous and 1 Gbps with external termination. For DDR LVDS interfaces, use the dedicated DPA (Dynamic Phase Alignment) circuitry available in C7-speed-grade parts to recover clock-to-data phase at the receiver. SSTL and HSTL Class I/II outputs require external series termination (typically 25-33 ohm) within 5 mm of the FPGA pin. Refer to Altera AN 477 (Stratix High-Speed I/O) for detailed IBIS model usage and channel-budget analysis.
Do not confuse the EP1S30F780C7N with the EP1S30F1020C7N: same die, different packages (780-BGA vs 1020-BGA), different PCB footprints. Do not confuse the C7 speed grade with the I7 industrial-temperature grade; the latter uses an 'I' prefix (e.g., EP1S30F780I7N). Quartus Prime (>=15.0) does not officially support first-generation Stratix, so retain Quartus II 9.0 in your toolchain if you must continue using this silicon. Configuration via fast passive parallel (FPP) requires an enhanced configuration device (EPC16 or EPC64); standard EPC2 / EPC4 devices only support passive serial.
Compliance Information
N suffix denotes lead-free (Pb-free) ball finish per FindIC datasheet entry dated 2014-12-09; AEC-Q100 is not applicable for FPGAs (automotive-grade variants use a separate part numbering scheme). REACH and conflict-minerals status not confirmed in the verified web data.
