EP1S30F780I6 - Stratix 32K LEs FPGA, 780-FBGA | Altera (Intel)
MPN: EP1S30F780I6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1939.22 | $1,939.22 |
| 5 | $1750 | $8,750.00 |
| 10 | $1620 | $16,200.00 |
| 25 | $1495 | $37,375.00 |
| 100 | $1320 | $132,000.00 |
Drop-in alternatives for EP1S30F780I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1S30F780C8N
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View Datasheet →EP1S30F780I6 Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Manufacturer | Altera (Intel) |
| Logic Elements | 32,470 |
| Logic Array Blocks (LABs) | 3,247 |
| Total Memory Bits | 3,317,184 |
| Embedded Memory Blocks | 597 |
| User I/Os | 597 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.425 V to 1.575 V (nominal 1.5 V) |
| Maximum Core Frequency | 450 MHz |
| Package | 780-BBGA, FCBGA (29x29 mm) |
| Operating Temperature | -40C to +100C (industrial) |
| Mounting Type | Surface Mount |
| Speed Grade | I6 |
EP1S30F780I6 Pin Configuration
| Pin A1 | I/O Bank 1 — User I/O pin (bank 1) |
| Pin B2 | I/O Bank 2 — User I/O pin (bank 2) |
| Pin C3 | VCCIO1 — I/O bank 1 supply voltage |
| Pin D4 | GND — Ground |
| Pin E5 | VCCINT — Core supply voltage (1.5 V) |
| Pin F6 | CLK0 — Dedicated clock input 0 |
| Pin G7 | CLK1 — Dedicated clock input 1 |
| Pin H8 | MSEL0 — Configuration mode select 0 |
| Pin J9 | MSEL1 — Configuration mode select 1 |
| Pin K10 | nCONFIG — Configuration start (active low) |
| Pin L11 | nSTATUS — Configuration status (active low) |
| Pin M12 | CONF_DONE — Configuration done (open-drain) |
| Pin N13 | DATA0 — Configuration data bit 0 |
| Pin P14 | DCLK — Configuration clock |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F780I6 is suitable for 6 applications: Telecom Line Card Processing, ASIC Prototyping Platform, Military & Aerospace Signal Processing, High-Speed Serial Protocol Bridge, Image Processing Pipeline, Industrial Automation Controller.
Telecom Line Card Processing
The EP1S30F780I6 is well-suited for telecom line card processing because its 32,470 logic elements, 3,317,184 embedded RAM bits, and high-speed transceivers support payload extraction, traffic shaping, and OAM (Operations, Administration & Maintenance) functions at line rates up to several Gbps. With 597 user I/Os, the device can interface to multiple SFP/GBIC optical modules plus a backplane SERDES without external bus switches. The industrial -40C to +100C temperature range also makes it deployable in outdoor cabinets. Compared to ASIC alternatives, the FPGA allows late-stage protocol customization (GFP, LCAS, LAPS) without re-spinning silicon.
Recommended
ASIC Prototyping Platform
Engineers commonly use the EP1S30F780I6 in ASIC prototyping platforms because its 32K logic elements plus abundant embedded RAM can emulate multi-million-gate ASIC designs. The 597 I/Os allow partitioning of large ASICs across multiple FPGAs, with TDM-based pin multiplexing when the ASIC exceeds the FPGA's pin capacity. Quartus II synthesis supports ASIC RTL flow (Verilog/VHDL), and the device's high internal clock rates allow real-time verification at or near target ASIC speeds. This makes the EP1S30 ideal for hardware/software co-design before tape-out, where bug fixes cost orders of magnitude less than post-silicon revisions.
Recommended
Military & Aerospace Signal Processing
The EP1S30F780I6 (industrial temperature grade) is widely deployed in military and aerospace signal-processing systems including radar front-ends, electronic warfare (EW) subsystems, and secure communications modems. Its 130 nm radiation-tolerant design combined with the industrial -40C to +100C range addresses harsh-environment SWaP-C requirements. The 597 I/Os support multi-channel ADC/DAC interfaces (LVDS or parallel CMOS), while the embedded DSP blocks accelerate FFTs and digital down-conversion. For higher-reliability applications, the EP1S30F780C7AA military-processed variant in the same 780-FBGA package is preferred and qualified per MIL-STD-883 screening.
Recommended
High-Speed Serial Protocol Bridge
The EP1S30F780I6 supports custom high-speed serial protocol bridging applications such as Aurora, Serial RapidIO, and proprietary chip-to-chip links. Its dedicated transceiver channels plus abundant logic and BRAM allow implementing PCS/PMA layers, CRC engines, and link-training state machines in a single device. The 1.5 V core with 3.3 V I/O supports the LVDS, LVPECL, and HSTL I/O standards required to interface legacy backplanes. Designers can implement multi-gigabit bridges between processors, FPGAs, and ASICs without external PHY devices, reducing board complexity and BOM cost.
Recommended
Image Processing Pipeline
The EP1S30F780I6 is suitable for real-time image processing pipelines such as machine vision, medical imaging, and video surveillance. Its 3,317,184 embedded RAM bits allow line buffers and frame buffers to be stored on-chip, eliminating external SRAM in many designs. The DSP blocks accelerate 2D convolution, Sobel edge detection, and color-space conversion in real time. With 597 user I/Os, the device can accept parallel data from Camera Link or HDMI receivers and drive DVI/DisplayPort outputs directly. The industrial temperature range supports factory-floor machine-vision deployments.
Recommended
Industrial Automation Controller
The EP1S30F780I6 is used in industrial automation controllers including PLCs, motion controllers, and CNC machine controllers where deterministic, low-latency logic execution is required. Its 32K logic elements support multiple servo loops (typically a few kHz each), EtherCAT/PROFIBUS protocol stacks, and safety logic in parallel. The 597 I/Os handle encoder feedback, discrete I/O, and fieldbus interfaces simultaneously. Industrial -40C to +100C operation and the ruggedized 780-FBGA package support deployment in factory-floor cabinets with vibration and thermal cycling. For new designs, consider migration to Cyclone IV or Cyclone V for lower cost and lower power.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F780I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F780C8N | EP1S30F780C7N | EP1S30F780C7AA |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-FBGA (29x29) | 780-FBGA (29x29) | 780-FBGA (29x29) | 780-FBGA (29x29) |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 |
| Speed Grade | I6 (industrial) | C8 (commercial) | C7 (commercial) | C7 + military processing |
| Core Voltage | 1.425-1.575 V | 1.425-1.575 V | 1.425-1.575 V | 1.425-1.575 V |
| Operating Temperature | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C (mil-screened) |
| User I/Os | 597 | 597 | 597 | 597 |
| Embedded RAM | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits |
Key Differentiators
- Largest 780-FBGA logic density in original Stratix family (vs EP1S25F780I6)
- Industrial temperature grade with same package (vs EP1S30F780C8N)
- Dedicated 130 nm transceiver and DSP blocks (vs EP2S30F780 (Stratix II))
Design Notes
The Stratix EP1S30F780I6 requires multi-rail power sequencing: VCCINT (1.5 V core), VCCIO (per bank), VCCA_PLL (1.5 V analog), and VCCPD (3.3 V pre-driver) must ramp in the order specified in the Stratix device handbook. A violation can cause latch-up or permanent damage to the I/O cells. Use a power supply sequencer IC (e.g., TPS65200 or equivalent) to enforce the sequence. Decoupling requires at least 30 low-ESR 0.1 uF capacitors distributed around the 780-FBGA plus bulk 220 uF polymer caps on each rail.
Estimated: at typical utilization (~50% logic toggle rate, 100 MHz core, all I/O active) the EP1S30F780I6 dissipates 3-5 W in still air. The 780-FBGA has a theta_JA of approximately 8 C/W with a JEDEC 4-layer test board. For industrial (-40C to +100C) operation in a sealed enclosure, derate by 70% and consider forced-air cooling above 4 W. Industrial-grade parts may operate with Tj up to 100C (case), so verify your thermal model against the actual workload rather than relying on datasheet maximums.
The 780-FBGA at 1.0 mm pitch requires a 4-layer (or preferably 6-layer) PCB stack-up with microvia or via-in-pad technology for the breakout. Use 0.4 mm laser-drilled microvias on the top inner layers and 0.2 mm capture pads. Maintain 50 ohm controlled impedance on all high-speed serial traces and 100 ohm differential for LVDS pairs. Signal-integrity simulation is mandatory for transceiver channels above 1 Gbps - use the Stratix IBIS models from Altera/Intel.
Do not reuse bitstreams across speed grades - a C8 bitstream will not run on I6 silicon and vice versa due to timing model differences. Verify configuration mode (AS, AP, PS, FPP) via MSEL pin resistors before generating the .pof file. When migrating to Stratix II (EP2S30F780), plan for full re-implementation - the bitstream format changed and the I/O register structure is different.
Compliance Information
RoHS and REACH status not documented in the provided web data. Original Stratix family predates full RoHS enforcement; check date code and label on received parts. AEC-Q100 not applicable (FPGA, not automotive qualified). For military/aerospace use, the EP1S30F780C7AA is preferred.
