EP1S40F780I6N - Stratix FPGA 41,250 LEs, 615 I/O, 780-FBGA | Intel
MPN: EP1S40F780I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 500 | $102 | $51,000.00 |
| 1,000 | $89.5 | $89,500.00 |
Drop-in alternatives for EP1S40F780I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S40F780C8N
✅ Drop-In✓ In Stock
$130 / Unit
View Datasheet →EP1S40F780C7N
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP1S40F780C6N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S40F780I6
✅ Drop-In✓ In Stock
$305 / Unit
View Datasheet →EP1S30F780I6N
✅ Drop-In✓ In Stock
$225 / Unit
View Datasheet →EP1S40F780I6N Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Logic Elements | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| Total RAM Bits | 3,423,744 |
| User I/O Pins | 615 |
| Core Voltage (VCCINT) | 1.425 V to 1.575 V |
| DSP Blocks | 12 |
| Embedded Multipliers | Yes (per DSP block) |
| Configuration Method | SRAM-based, volatile |
| Package | 780-FBGA (29 x 29 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (industrial) |
| MSL Level | 3 |
| Lead Free | Yes |
| Process Node | 150 nm CMOS |
| RoHS Status | Compliant |
EP1S40F780I6N 780-fbga (29 x 29 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S40F780I6N (780-fbga (29 x 29 mm, 1.0 mm pitch) package) with 615 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S40F780I6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 615 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S40F780I6N is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, Telecom Line-Card Protocol Bridging, Industrial Machine Vision and Motion Control, ASIC Prototyping and Emulation, Radar Signal Processing, High-Speed Serial Protocol Aggregation.
Software-Defined Radio (SDR) Baseband
The EP1S40F780I6N fits SDR baseband processing because its 41,250 logic elements and 12 DSP blocks deliver the multiply-accumulate throughput required for channelization, FFTs, and digital up/down conversion. The 3,423,744 bits of TriMatrix memory buffer IQ samples and FFT coefficients close to the DSP fabric, avoiding external memory round-trips. The 615 user I/Os aggregate multiple LVDS data paths and external ADC/DAC interfaces; the 780-FBGA package's 1.0 mm pitch is compatible with the multi-layer PCB stackup used in telecom line cards. Placed as the central reconfigurable fabric between front-end ADCs and a host processor, it provides the deterministic latency and parallel datapath that CPUs cannot.
Recommended
Telecom Line-Card Protocol Bridging
The EP1S40F780I6N bridges telecom protocols such as POS-PHY, SPI-4.2, and custom SERDES backplanes because its 615 user I/O pins expose dozens of high-speed LVDS lanes needed for parallel telecom interfaces. The 1.5 V core is tolerant of the noise-coupled environment in central-office line cards when paired with proper decoupling, and the industrial -40C to +100C range covers outside-plant cabinets. The 12 DSP blocks accelerate framing and FEC tasks while the TriMatrix memory buffers packet bursts. Placed between a network processor and the PHY, the device replaces multiple fixed-function bridge chips and adapts to evolving line-card standards.
Recommended
Industrial Machine Vision and Motion Control
The EP1S40F780I6N suits machine-vision pipelines and multi-axis motion controllers because the 41,250 logic elements can host several Camera Link or CoaXPress channelizers in parallel, and the 12 DSP blocks accelerate image convolution, edge detection, and PID loops. The 3,423,744 RAM bits frame-buffer multiple image lines without external SRAM, while the 615 I/Os aggregate parallel pixel buses, encoder inputs, and PWM outputs to motor drivers. Industrial -40C to +100C operation tolerates factory-floor temperatures. Placed at the heart of a vision controller, the FPGA ingests raw pixel data and outputs processed results with deterministic microsecond latency.
Recommended
ASIC Prototyping and Emulation
The EP1S40F780I6N is widely used as an ASIC prototype vehicle because the Stratix logic architecture maps cleanly from RTL targeting ASIC libraries, and the abundant TriMatrix memory models large register files or scratchpad RAMs. With 41,250 LEs and 615 I/Os, it can host a significant fraction of a modern SoC for bring-up, firmware development, and pre-silicon software validation. The SRAM-based volatile configuration supports rapid design iteration. Placed on a multi-FPGA prototyping board, the device provides cycle-accurate execution for design teams validating pre-tapeout silicon.
Recommended
Radar Signal Processing
The EP1S40F780I6N serves radar pulse-compression, MTI, and beamforming cores because the 12 DSP blocks deliver the multiply-accumulate throughput for matched filters, FFTs, and adaptive beamforming weights. The 3,423,744 RAM bits stage range-Doppler maps and adaptive weights on-chip, eliminating external memory accesses in the critical loop. The industrial temperature range supports ground-based radar enclosures. Placed between the RF front-end and the radar display processor, the FPGA compresses pulse data and forms beams in real time.
Recommended
High-Speed Serial Protocol Aggregation
The EP1S40F780I6N aggregates multiple lower-speed serial links (UART, SPI, I2C, custom LVDS) because its 615 I/O pins and abundant logic can implement dozens of soft serial controllers plus a high-speed uplink. The TriMatrix memory buffers packet bursts and the 12 DSP blocks handle CRC, encryption, and compression offload. The 780-FBGA package supports the controlled-impedance stackup required for clean LVDS. Placed as a protocol-aggregation gateway, the FPGA offloads the host CPU and consolidates disparate industrial buses into a single high-speed uplink.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F780I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F780C8N | EP1S40F780C7N | EP1S40F780C6N | EP1S40F780I6 | EP1S30F780I6N |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm, 1.0 mm pitch) | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 33,880 (-18%) |
| Total RAM Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | [DATA_NEEDED] (proportionally less) |
| User I/O Pins | 615 | 615 | 615 | 615 | 615 | 615 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 6 | 8 (faster) | 7 | 6 | 6 | 6 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-package speed-grade upgrade path (vs EP1S40F780C8N)
- Industrial temperature range (vs EP1S40F780C6N)
- Full 41,250-LE capacity at industrial temp (vs EP1S30F780I6N)
Design Notes
Estimated: routing the 780-FBGA at 1.0 mm pitch requires at minimum a 4-layer PCB with HDI microvias (laser-drilled, ~0.1 mm via diameter) and 0.5 oz copper on outer layers. Use via-in-pad or staggered microvia fan-outs to escape the inner ball rows. Maintain a continuous reference plane on layer 2 and layer N-1 for controlled-impedance LVDS traces (typically 100 ohm differential). For full device utilization at >250 MHz, target 8-10 layer stackup with dedicated power planes.
Estimated: VCCINT at 1.5 V can draw 1.5-3 A during configuration burst and high-utilization operation; budget a DC-DC converter rated for at least 5 A peak with low output ripple (<30 mVpp). Each VCCIO bank draws additional current scaled to the number of switching outputs; place 0.1 uF + 10 uF ceramic decoupling within 100 mil of every supply pin. A power-sequencer or rail-sequencing IC is required so that VCCINT comes up before VCCIO to avoid I/O latch-up during FPGA configuration.
High-speed LVDS and clock traces must be length-matched within 20 mil for clocks and 50 mil for data to avoid bit-error skew. Per Stratix handbook, use IBIS models to simulate worst-case reflections on multi-load buses. Series-damping resistors on lightly-loaded outputs dampen ringing; place them within 200 mil of the driver. For source-synchronous interfaces, route clock and data on the same layer with matched impedance and minimal vias.
Do not assume the EP1S40F780I6N is in production - the Stratix family was discontinued by Intel/Altera in the late 2000s. Plan a migration path to Cyclone IV/V or Arria II/10 GX families for new designs. When sourcing from independent distributors, validate date code, lot traceability, and authenticity (X-ray, decapsulation) before placing volume orders, as counterfeit Stratix parts have been observed in the open market.
Compliance Information
RoHS and lead-free per Stratix device datasheet 'LEAD FREE' marking. No AEC-Q100 automotive qualification - original Stratix family was not designed for automotive reliability. Halogen-free status not explicitly stated in verified data - marked unknown.
