EP1S20F780C5 - Stratix FPGA 18460 LE, 586 I/O, 780-FBGA | Intel
MPN: EP1S20F780C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1066.18 | $1,066.18 |
| 10 | $950 | $9,500.00 |
| 100 | $820 | $82,000.00 |
| 500 | $720 | $360,000.00 |
| 1,000 | $645 | $645,000.00 |
Drop-in alternatives for EP1S20F780C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1S20F780C6
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View Datasheet →EP1S10F780C5
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View Datasheet →EP1S10F780C7
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View Datasheet →EP1S20F780C5 Maximum Ratings & Electrical Characteristics
| Device Family | Stratix |
| Logic Elements | 18460 |
| Logic Array Blocks (LABs) | 1846 |
| Total RAM Bits | 1669248 |
| User I/O Count | 586 |
| DSP Blocks | 17 |
| PLLs | 16 |
| Clock Networks | 8 |
| Package | 780-BBGA, FCBGA (FineLine BGA) |
| Speed Grade | -5 |
| Operating Temperature Grade | Commercial |
| Core Voltage (VCCINT) | 1.5 V |
| Process Technology | 0.13 µm CMOS |
| Memory Type | TriMatrix (MRAM, M4K, M512) |
| Configuration Scheme | Serial (EPCS) or JTAG |
EP1S20F780C5 780-bbga, fcbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1S20F780C5 (780-bbga, fcbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S20F780C5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S20F780C5 is suitable for 6 applications: High-Speed Data Acquisition Systems, Telecom Baseband Signal Processing, ASIC Prototyping and Emulation, Video Broadcast and Image Processing, Industrial Networking and Packet Processing, Military and Aerospace Signal Intelligence.
High-Speed Data Acquisition Systems
The EP1S20F780C5's 586 user I/O pins and 18,460 logic elements make it well suited for high-speed parallel data acquisition front-ends. With 1.5 V core and support for LVDS/LVPECL/LVCMOS signalling on independently powered I/O banks, the device can simultaneously capture multiple 10- to 16-bit ADC streams at rates approaching 200 MHz DDR. The 17 dedicated DSP blocks accelerate per-channel FIR filtering, decimation, and FFT processing on the acquired data. Compared with a discrete DSP+ASIC architecture, the Stratix FPGA integrates the timing control, memory buffering, and signal-processing chain into a single re-programmable device, reducing board area and BOM cost.
Recommended
Telecom Baseband Signal Processing
In telecom baseband designs the EP1S20F780C5 provides the fabric needed for rake receivers, channel equalisation, and Turbo decoding. The TriMatrix memory architecture gives 1,669,248 bits of distributed RAM, sufficient to hold QAM constellations, Viterbi trellis state tables, and per-user buffer descriptors. The 16 PLLs and 8 global clock networks allow low-jitter distribution of multiple symbol-rate clocks across the chip. Designers can implement multi-carrier OFDM downlink paths and WCDMA rake receivers in a single device, while the 780-FBGA package provides the signal-integrity margin required for high-speed memory and backplane interfaces.
Recommended
ASIC Prototyping and Emulation
The 18,460 logic elements, 17 DSP blocks, and rich memory hierarchy of the EP1S20F780C5 make it a practical target for ASIC prototyping and hardware emulation. Designers map ASIC RTL to the Stratix fabric, partition across multiple FPGAs when needed, and use the 586 I/O pins to bring out emulation probes. The Quartus II software flow supports incremental compilation and logic-lock regions to speed compile time. Compared with slower software simulation, RTL running at hardware speed on this FPGA validates multi-million-gate ASIC designs in days rather than months. The commercial temperature grade and BGA package suit lab and chassis-level prototyping.
Recommended
Video Broadcast and Image Processing
For SDI/HD-SDI video broadcast, the EP1S20F780C5's 586 I/O and 17 DSP blocks deliver real-time 4:2:2 and 4:4:4 chroma processing, scaling, and overlay blending. Each DSP block can be configured as 9-, 18-, or 36-bit multipliers supporting full-rate FIR filtering for image scaling and colour-space conversion. The TriMatrix memory allows line-buffer storage on-chip, reducing external SDRAM bandwidth by 30-50 %. Compared with an ASIC implementation, the FPGA solution enables rapid reconfiguration when broadcast standards evolve, and the 780-FBGA package provides the BGA breakout density needed for parallel SDI links.
Recommended
Industrial Networking and Packet Processing
In industrial router and switch designs, the EP1S20F780C5 provides wire-speed packet classification, IPv4/IPv6 forwarding, and QoS queue management. The 1.5 V core and 17 DSP blocks accelerate hash computations, CRC verification, and encryption primitives, while the 586 I/O enables simultaneous 10/100/1000 Ethernet and SPI/UART serial management interfaces. TriMatrix memory stores routing tables and packet descriptors on-chip, reducing external TCAM/SSRAM cost. Compared with discrete NPU + memory solutions, this single FPGA integrates all packet-processing logic in one programmable device, simplifying PCB layout and shortening design cycles.
Recommended
Military and Aerospace Signal Intelligence
The EP1S20F780C5 has been used in ruggedised military and aerospace signal-intelligence platforms where flexibility and high compute density matter. With 18,460 logic elements and 17 DSP blocks the device can run wideband digital down-conversion, polyphase filter banks, and adaptive beamforming in real time. The Stratix family was historically offered in industrial-temperature variants for military systems; designers should check the specific temperature grade before deployment. Compared with fixed-function ASICs, the FPGA approach lets system integrators update algorithms as new signal threats emerge in the field.
Recommended
Recommended Products Summary
Engineering reference data for EP1S20F780C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S20F780C6 | EP1S20F780C7 | EP1S10F780C5 | EP1S10F780C6 | EP1S10F780C7 | EP1S10F780C5N |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA, FCBGA | 780-FBGA, FCBGA - same | 780-FBGA, FCBGA - same | 780-FBGA, FCBGA - same | 780-FBGA, FCBGA - same | 780-FBGA, FCBGA - same | 780-FBGA, FCBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 18460 | 18460 | 18460 | 10570 (-43%) | 10570 (-43%) | 10570 (-43%) | 10570 (-43%) |
| Speed Grade | -5 (slowest) | -6 | -7 | -5 | -6 | -7 | -5 |
| RAM Bits | 1669248 | 1669248 | 1669248 | 920448 | 920448 | 920448 | 920448 |
| DSP Blocks | 17 | 17 | 17 | 6 | 6 | 6 | 6 |
| User I/O | 586 | 586 | 586 | 426 | 426 | 426 | 426 |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Lowest-cost Stratix 780-FBGA option with broadest availability (vs EP1S20F780C6 / EP1S20F780C7)
- Higher logic and DSP capacity within the same 780-FBGA (vs EP1S10F780C5 / EP1S10F780C6 / EP1S10F780C7)
- Highest logic density per ball in the Stratix family (vs All other 780-FBGA Stratix parts)
Design Notes
The EP1S20F780C5 requires at least four independent supply rails: VCCINT (1.5 V core), VCCIO (1.5/1.8/2.5/3.3 V per bank), VCCPD (3.3 V for pre-drivers), and VCCA_PLL (1.5 V for PLL analog). Decoupling must follow the Stratix Device Handbook reference: 0.1 µF and 0.01 µF ceramic capacitors at every VCCINT/VCCIO pin, plus 100 µF bulk tantalum or polymer caps per supply. Power sequencing should hold the FPGA in reset until VCCINT and VCCPD reach their thresholds to avoid partial-power latch-up.
The 780-FBGA 1.0 mm pitch package demands a 4- to 6-layer PCB stack-up with microvia fan-out or via-in-pad. Matched-length routing for DDR SDRAM interfaces should keep DQ/DQS skew below ±25 ps, and reference the differential clock pair to a continuous ground layer. Use the Altera DDR SDRAM controller with pin skew reports generated by Quartus II to validate signal integrity before committing to PCB fabrication. The -5 speed grade requires looser skew tolerance than -6/-7 designs, but still demands clean power and ground planes.
Do not assume JTAG or AS configuration bitstreams are interchangeable between Stratix and Stratix II - the proprietary bitstream formats differ. Mixing EP1S and EP2S configuration files will brick the device. Always regenerate the .sof and .pof in the matching Quartus II version for the target FPGA. Also note that the original Stratix EPCS bitstream uses little-endian PROM format, while newer Quartus versions default to 32-bit format; verify your EPCS layout tool settings before programming.
Estimated: at full logic utilisation with 200 MHz clock and 80% toggle rate, power consumption can reach 5-8 W. Using the typical theta_JA of 12 °C/W (4-layer board, 1 m/s airflow), junction temperature rise above ambient is approximately 60-95 °C, putting commercial-grade Tj near 145 °C under worst case. Adding a heatsink or forced airflow extends margin; designers should use the Quartus II PowerPlay power estimator and the published theta_JA to confirm. Thermal vias under the BGA thermal pad dramatically reduce theta_JC.
Compliance Information
RoHS non-compliant per multiple distributor datasheets. Lead-free variants exist only as EPCS companion flashes, not as Stratix FPGA re-issues. AEC-Q100 not applicable since this is a programmable logic device, not an automotive qualified IC. Designers with RoHS-mandated end products should migrate to Stratix II or later.
