EP1S40F1020I6N - Stratix 41K LE FPGA 1020-FBGA | Intel (Altera)
MPN: EP1S40F1020I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462 | $4,620.00 |
| 100 | $425 | $42,500.00 |
| 500 | $395 | $197,500.00 |
| 1,000 | $365 | $365,000.00 |
Drop-in alternatives for EP1S40F1020I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S40F1020I6GB
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View Datasheet →EP1S40F1020I6AA
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View Datasheet →EP1S40F1020I6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Series | Stratix I |
| Logic Elements (LE) | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| Total Memory Bits | 3,423,744 |
| User I/Os | 773 |
| Core Voltage | 1.5 V |
| Supply Voltage | 1.5 V |
| Operating Temperature | 0 C to 85 C (commercial) |
| Package Type | FC-FBGA |
| Package Pins/Balls | 1020 |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Unknown - pre-RoHS Altera-era part |
EP1S40F1020I6N 33 x 33 mm Pin Configuration Guide
Complete pinout information for EP1S40F1020I6N (33 x 33 mm package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S40F1020I6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S40F1020I6N is suitable for 6 applications: ASIC Prototyping and Emulation, Software-Defined Radio (SDR) Baseband, High-Speed Image and Video Processing, Telecom Baseband and Protocol Processing, Industrial Control and Motor Drive, Military and Aerospace Signal Processing.
ASIC Prototyping and Emulation
The EP1S40F1020I6N delivers 41,250 logic elements with 3.4 Mbits of embedded TriMatrix memory, making it well-suited for ASIC prototyping and in-circuit emulation of mid-complexity ASIC designs. Engineers typically map RTL blocks one-to-one to LAB clusters and use the abundant M4K/M512 RAM blocks for transaction recording and bus-level monitoring. Compared with gate-array emulation, the 4,125 LABs offer roughly 500K-1M usable gates at typical 70% utilization. The 1020-FBGA footprint supports 773 user I/Os, enabling full visibility on ASIC pins up to ~600 signal count designs.
Recommended
Software-Defined Radio (SDR) Baseband
The EP1S40F1020I6N's dedicated DSP blocks and high-density logic make it a strong fit for SDR baseband processing, including DDC/DUC, channelization, and FFT-based OFDM demodulation. The 3.4 Mbits of on-chip memory support multi-symbol buffering without external SRAM, and 773 user I/Os accommodate parallel ADC/DAC interfaces such as LVDS at 400+ MSPS. The 1.5 V core plus selectable VCCIO banks (1.5/1.8/2.5/3.3 V) allow direct connection to common RF ADC/DAC logic levels. SDR reference designs typically achieve 70-80% DSP block utilization on this part.
Recommended
High-Speed Image and Video Processing
With 41,250 logic elements, embedded DSP blocks, and 3.4 Mbits of fast on-chip memory, the EP1S40F1020I6N supports real-time image processing pipelines including 2D convolution, Sobel edge detection, and H.264 motion estimation at CIF to VGA resolutions. The 773 user I/Os easily interface to 16-bit parallel camera links and DDR memory controllers for frame buffering. The LVDS-capable I/O banks can run video serializers/deserializers at 400-600 Mbps per pair, enabling direct connection to CameraLink or FPD-Link channels. Designers typically hit 80-100 MHz pixel clock on this part.
Recommended
Telecom Baseband and Protocol Processing
The EP1S40F1020I6N's logic density, embedded memory bandwidth, and multi-standard I/O support make it applicable for telecom baseband and protocol processing nodes, including Ethernet MAC aggregation, SONET/SDH framer implementations, and HDLC/PPP protocol engines. The 1020-BGA package supports up to 773 user I/Os, enough for parallel UTOPIA / POS-PHY interfaces to network processors. With embedded PLLs and abundant routing resources, designers commonly achieve 200+ MHz on critical paths in Stratix I telecom reference designs, leveraging the TriMatrix memory for cell/packet buffering.
Recommended
Industrial Control and Motor Drive
The EP1S40F1020I6N suits industrial control and multi-axis motor drive controllers where deterministic logic and high I/O count are required. With 773 user I/Os the part interfaces directly to multi-encoder feedback lines, gate driver PWM outputs, and fieldbus transceivers (EtherCAT, Profibus, CAN). The embedded TriMatrix memory allows current/torque loop tables to be stored on-chip for sub-microsecond access. Industrial applications commonly run this part at 100-150 MHz system clock, leveraging the dedicated PLLs for synchronized PWM generation across multiple axes.
Recommended
Military and Aerospace Signal Processing
For legacy military and aerospace programs, the EP1S40F1020I6N remains a viable COTS DSP engine for radar signal processing, electronic warfare (EW) receivers, and secure communications modems. The 41,250 LE density supports beamforming weights for 16-32 element arrays and chirp generation for FMCW radar at L/S-band frequencies. While the part does not meet MIL-STD-883 or rad-hard requirements on its own, programs typically pair it with ruggedized board-level screening and sealed FC-FBGA assemblies. Aerospace users value the abundant LVDS pairs for high-speed ADC/DAC interfaces in digital receivers.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F1020I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F1020I6GB | EP1S40F1020I6AA | EP1S40F1020I6 | EP1S40F1020C7N | EP1S40F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-FBGA (33 x 33 mm) | 1020-FBGA (33 x 33 mm) - same | 1020-FBGA (33 x 33 mm) - same | 1020-FBGA (33 x 33 mm) - same | 1020-FBGA (33 x 33 mm) - same | 1020-FBGA (33 x 33 mm) - same |
| Logic Elements | 41,250 LE | 41,250 LE | 41,250 LE | 41,250 LE | 41,250 LE | 41,250 LE |
| LABs | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 |
| Memory Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| User I/Os | 773 | 773 | 773 | 773 | 773 | 773 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 to 85 C (industrial 'I') | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C |
| RoHS / Lead-Free | Unknown (pre-RoHS Altera era) | Yes (lead-free matte-Sn) | Unknown | Unknown | Unknown | Unknown |
Key Differentiators
- Only drop-in replacement with confirmed lead-free ball finish (vs EP1S40F1020I6GB)
- Same die as other EP1S40F1020 variants (vs EP1S40F1020C7N)
- Higher logic density than smaller Stratix I variants (vs EP1S30F1020I6N)
- Higher I/O count vs smaller Stratix I variants (vs EP1S40F1020C6N)
Design Notes
The EP1S40F1020I6N requires a multi-rail power architecture: VCCINT 1.5 V core, VCCIO bank voltages (1.5/1.8/2.5/3.3 V), VCCPD, VCCA_PLL (2.5 V), and VCCAUX. According to the Stratix I datasheet, all rails must ramp in a defined sequence during power-up to avoid configuration failure and latch-up. Recommended practice: use a sequencing controller such as LTC2974 or UCD90120A, with VCCINT last to ramp (after VCCAUX) so configuration logic is stable before the core array is powered.
Estimated: at full DSP utilization (80% DSP blocks active) with 200 MHz toggling, the EP1S40F1020I6N dissipates approximately 3-5 W typical and up to 7-8 W worst case. The 1020-FBGA package has theta_JA around 15-20 C/W with 4-layer PCB and adequate thermal vias. Design the PCB with a full thermal via array under the central ground balls and connect to an inner ground plane; consider a top-side heatsink for sustained full-utilization workloads in enclosed industrial enclosures.
The 1020-FBGA 33 x 33 mm package at 1.0 mm pitch requires a 4-layer or higher PCB with microvia-in-pad or via-on-pad technology. Outer signal layers should be 4 mil trace/space with 8 mil drill. Match all LVDS pairs to 100 ohm differential impedance and length-match within 50 mil. Per the Stratix I hardware reference, place at least 4 decoupling capacitors (0.1 uF + 10 uF bulk) within 0.25 inch of each VCCIO bank pin cluster to suppress switching transients.
Use AS (Active Serial) configuration mode with an EPC16 or EPCS16 boot flash for production boards - this lets the FPGA load its bitstream on power-up without an external controller. Keep MSEL[2:0] pins strapped to the correct mode (typically 000 for AS, 001 for AP, 010 for PS). Pull nCONFIG high via 10 kohm resistor to VCCPD and provide a 1 nF cap to ground for clean reset behaviour; missing this cap is a common cause of intermittent configuration failures on Stratix I designs.
Common pitfalls on EP1S40F1020I6N designs: (1) forgetting that Quartus II 13.1 is the last version supporting Stratix I - newer Quartus Prime will reject the device. (2) Driving JTAG TCK faster than 33 MHz during ISP, which can corrupt configuration SRAM. (3) Routing LVDS pairs across split reference planes, causing severe EMI and signal-integrity issues. (4) Powering VCCIO before VCCINT, which can trigger I/O latch-up. (5) Using the wrong speed grade - the -6 suffix here provides the fastest Fmax; -7 is ~15% slower.
Compliance Information
EP1S40F1020I6N is a pre-RoHS Altera-era part with SnPb eutectic ball finish (non-lead-free). RoHS-compliant equivalent is EP1S40F1020I6GB with matte-Sn lead-free balls. AEC-Q100 not applicable for FPGAs. Reach/halogen/conflict-mineral status not disclosed in available datasheets; consult XAIPART or the broker for up-to-date compliance documentation.
