EP1SGX40DF1020I7N - 41,250 Logic Cells Stratix GX FPGA | Intel
MPN: EP1SGX40DF1020I7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 25 | $2550 | $63,750.00 |
| 50 | $2420 | $121,000.00 |
| 100 | $2290 | $229,000.00 |
Drop-in alternatives for EP1SGX40DF1020I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX40DF1020I7N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Device Model | EP1SGX40 |
| Logic Cells | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Logic Family | CMOS |
| Process Technology | 130 nm |
| Nominal Supply Voltage | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| Operating Temperature | 0 C to 85 C (commercial) |
| Package Type | FC-FBGA, 33 x 33 mm, 1 mm pitch |
| Number of Pins / Balls | 1020 |
| Package Code | BGA |
| Terminal Form | Ball |
| Package Shape | Square |
| Maximum Clock Frequency | 4385.97 MHz |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel |
| Mounting Type | Surface Mount |
EP1SGX40DF1020I7N square Pin Configuration Guide
Complete pinout information for EP1SGX40DF1020I7N (square package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40DF1020I7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40DF1020I7N is suitable for 7 applications: SONET/SDH Line Card Aggregation, PCI Express Endpoint / Bridge, Serial RapidIO Switch / Endpoint, Test & Measurement Instrumentation, XAUI / 10G Backplane Bridging, Legacy DSP Front-End Processing, Industrial Imaging & Video Processing.
SONET/SDH Line Card Aggregation
The EP1SGX40DF1020I7N's hard multi-gigabit transceivers make it a strong fit for SONET/SDH line cards that aggregate multiple OC-48/OC-192 streams into a backplane. With 41,250 logic cells and 4,125 CLBs, the device can host framer/mapper logic, payload processing, and overhead termination without external FPGAs. The 1020-ball FC-FBGA provides ample I/O for parallel backplane interfaces and tributary ports. Designers should plan power sequencing for the 1.5 V core alongside the transceiver analog supplies, and use Quartus II's transceiver toolkit for eye-diagram validation during bring-up.
Recommended
PCI Express Endpoint / Bridge
The EP1SGX40DF1020I7N integrates PCIe-capable transceivers and a large programmable fabric, making it suitable for custom PCIe endpoints and protocol bridges. With 41,250 logic cells, designers can implement protocol layers, DMA engines, and user logic alongside the hard PCIe IP. The 1.5 V core and 1020-ball FC-FBGA provide I/O headroom for additional PCIe lanes or sideband signals. Note that newer Stratix II GX devices are preferred for PCIe Gen2+ designs; the EP1SGX40 is recommended only when matching existing qualification artifacts.
Recommended
Serial RapidIO Switch / Endpoint
The EP1SGX40DF1020I7N's transceiver channels support Serial RapidIO (sRIO) at 1.25 to 3.125 Gbaud, enabling switch-fabric endpoints and DSP cluster interconnects. The 41,250-cell fabric can host sRIO logical layers, DMA, and message-passing logic; the 1020-ball package supplies I/O for parallel DSP links. For multi-device clusters, designers should budget power at peak packet rates and verify link-training margins across process-voltage-temperature corners using Quartus II timing closure reports.
Recommended
Test & Measurement Instrumentation
The EP1SGX40DF1020I7N is well matched to high-channel-count test equipment: digitizer front ends, arbitrary waveform generators, and protocol analyzers. Its 41,250 logic cells support channel-synchronization state machines, trigger logic, and on-chip DSP blocks for real-time decimation/filtering; the transceivers stream aggregated data to a host processor. The 1020-ball FC-FBGA simplifies layout for dense multi-channel analog front-end boards. Designers should leverage the TriMatrix memory blocks for capture buffers and verify JTAG chain integrity for production test.
Recommended
XAUI / 10G Backplane Bridging
The EP1SGX40DF1020I7N's 3.125 Gbaud-capable transceivers are well suited to XAUI (10 Gigabit Attachment Unit Interface) bridging between line cards and switch fabrics. With 41,250 logic cells the device can implement XAUI PCS, MAC, and bridging tables. The 1020-ball FC-FBGA package supplies ample I/O for sideband signals, MDIO, and status LEDs. Designers targeting this use case should follow Altera's XAUI reference design and validate eye-mask compliance on actual backplane traces.
Recommended
Legacy DSP Front-End Processing
The EP1SGX40DF1020I7N's DSP blocks and embedded memory support high-throughput DSP front ends in radar, software-defined radio, and baseband processing. With 41,250 logic cells and dedicated multipliers, designers can implement FFTs, channelizers, and pulse-compression filters. The transceivers stream digitized RF data into the FPGA from high-speed ADCs. Designers should map DSP utilization against the device's multiplier budget and leverage the Quartus II DSP Builder for rapid IP integration, while planning for migration to newer Stratix generations in future revisions.
Recommended
Industrial Imaging & Video Processing
The EP1SGX40DF1020I7N supports multi-channel industrial imaging pipelines - Camera Link aggregation, frame buffering, and real-time image preprocessing - by combining its 41,250 logic cells with embedded TriMatrix memory and transceivers for high-speed sensor links. The 1020-ball FC-FBGA package exposes enough pins for parallel sensor interfaces and HDMI/DVI output. Designers should validate frame-buffer bandwidth against the memory controller's clock rate and apply thermal management for continuous full-frame-rate operation.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40DF1020I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40DF1020I7 | EP1SGX40DF1020I6N | EP1SGX40DF1020C7N | EP1SGX40DF1020C5N | EP1S40F1020I6N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA, 33x33 mm, 1 mm pitch | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Cells | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 (Stratix S-series, no transceivers) |
| Speed Grade | -7 (fastest) | -7 | -6 (~15-20% slower than -7) | -7 | -5 (~25-30% slower than -7) | -6, Stratix S-series |
| Temperature Grade | Industrial (I) 0-85 C | Industrial | Industrial | Commercial (C) 0-85 C | Commercial (C) 0-85 C | Industrial |
| Hard Transceivers | Yes (Stratix GX family) | Yes | Yes | Yes | Yes | No (Stratix S-series, soft IP only) |
| Process Technology | 130 nm CMOS | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
| Supply Voltage | 1.5 V nominal (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete (2026) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest -7 speed-grade within the EP1SGX40 family (vs EP1SGX40DF1020I5N)
- Industrial temperature grade option for harsh environments (vs EP1SGX40DF1020C7N)
- Hard multi-gigabit transceivers integrated (vs EP1S40F1020I6N)
Design Notes
Estimated: at 1.5 V core, with the FPGA drawing approximately 3 A during typical operation (about 4.5 W), the 1020-ball FC-FBGA package requires a thermal management strategy of either a 4-layer PCB with continuous ground/power planes or an attached heatsink with thermal interface material. Designers should validate junction temperature under worst-case utilization with the Quartus II PowerPlay analyzer and apply adequate airflow to keep Tj below 100 C in the 0-85 C ambient range.
The 1.00 mm ball pitch FC-FBGA demands a PCB stack-up with microvia or via-in-pad technology for reliable breakout. Use a 4-6 layer board with continuous power/ground planes directly under the BGA to provide decoupling and a low-impedance return path. Per Altera application notes, place 0.1 uF and 0.01 uF decoupling capacitors on each power pin within 100 mils, and use the Stratix GX handbook's recommended footprint for solder paste and stencil apertures.
Do not assume configuration mode without verifying - EP1SGX40 supports JTAG, Passive Serial (PS), and Fast Passive Parallel (FPP), and the wrong mode can brick the device on power-up. Per the Stratix GX configuration handbook, designers should also validate MSEL pin strapping and provide a clean POR sequence before asserting CONFIG_DONE. For production programming, JTAG-based tools (USB-Blaster or compatible) are recommended for board-level bring-up.
Estimated: the high-speed transceiver channels require impedance-controlled routing of 50-ohm differential pairs (100-ohm differential), with length matching to within 5 mils for lanes within a group. Per Altera's Stratix GX transceiver design guidelines, isolate transceiver analog supplies from digital switching noise with ferrite beads and dedicated ground planes, and minimize via stubs on high-speed serial traces to preserve signal integrity at multi-gigabit rates.
Compliance Information
Compliance data for the legacy Stratix GX EP1SGX40 family is not in the verified source data. AEC-Q100 is not applicable - this is a programmable logic device, not an automotive-grade analog IC. Refer to Intel/Altera product documentation for definitive compliance certifications on specific date codes.
