EP1S40F1020I6GB - Stratix FPGA 41250 LE FBGA-1020 | Altera
MPN: EP1S40F1020I6GB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 250 | $335 | $83,750.00 |
| 500 | $310 | $155,000.00 |
Drop-in alternatives for EP1S40F1020I6GB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S40F1020I6
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View Datasheet →EP1S40F1020I6GB Maximum Ratings & Electrical Characteristics
| Device Family | Stratix |
| Logic Elements | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| Embedded Memory Bits | 3,423,744 |
| Maximum User I/Os | 773 |
| DSP Blocks | 14 |
| PLLs | 12 |
| Global Clock Networks | 16 |
| Package | FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| Process Technology | 0.13 µm CMOS |
| Core Supply Voltage | 1.5 V |
| Speed Grade | I6 |
| Operating Temperature | -40C to +100C (industrial) |
| Configuration Modes | PS, FPP, JTAG |
EP1S40F1020I6GB fbga-1020 (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S40F1020I6GB (fbga-1020 (33 x 33 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S40F1020I6GB.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S40F1020I6GB is suitable for 7 applications: 10 Gbps Optical Line Card / Telecom Backhaul, Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, Military and Aerospace Avionics, Digital Video Broadcast / Image Processing, Industrial Machine Vision and Inspection.
10 Gbps Optical Line Card / Telecom Backhaul
The EP1S40F1020I6GB fits 10 Gbps telecom line cards because its 41,250 logic elements and 14 DSP blocks sustain multi-channel SERDES framer, Ethernet MAC, and forward-error-correction (FEC) dataplanes simultaneously. Placed on the line-card PCB alongside an optical transceiver, the FPGA runs the OTU/SONET mapping at line rate while its TriMatrix memory buffers packet bursts and feeds the network processor. Compared with a discrete ASIC approach, the EP1S40 lets the OEM field-upgrade protocols via Quartus bitstream updates, avoiding respins when the telecom standard evolves.
Recommended
Software-Defined Radio (SDR) Baseband
The EP1S40F1020I6GB is well matched to SDR baseband processing because its 14 dedicated DSP blocks and 3,423,744 bits of TriMatrix memory sustain multi-tap FIR filters, FFT/iFFT pipelines, and channelizer logic in parallel. Placed between the ADC/DAC and the host CPU, the FPGA runs the digital down-conversion (DDC) and digital up-conversion (DUC) chains at full sample rate. Compared with DSP-only architectures, the EP1S40's parallel fabric reduces latency for closed-loop beamforming and adaptive-modulation designs.
Recommended
ASIC Prototyping and Emulation
The EP1S40F1020I6GB's 41,250 logic elements, 3,423,744 RAM bits, and 773 user I/Os make it suitable for ASIC prototyping platforms, where a single FPGA can map a 200k-300k gate ASIC netlist. Multiple EP1S40 FPGAs can be tiled via LVDS inter-FPGA links to emulate larger ASICs at near-real-time speed. Compared with simulation, the EP1S40-based prototype runs the actual design at MHz speeds, allowing real-world software bring-up and I/O traffic verification before the ASIC tape-out.
Recommended
High-Speed Data Acquisition Systems
The EP1S40F1020I6GB fits high-speed data-acquisition systems (oscilloscopes, radar receivers, scientific instrumentation) where 14-bit ADCs stream hundreds of MSPS into the FPGA's parallel LVDS receivers, with TriMatrix M-RAM blocks serving as deep circular capture buffers. Placed on the acquisition board, the FPGA triggers, decimates, and pre-processes data before forwarding bursts to the host via PCIe or Ethernet. Compared with ASSP FPGA-alternatives, the EP1S40's 1.5 V core and 1 mm-pitch FBGA allow denser acquisition channels per board.
Recommended
Military and Aerospace Avionics
The EP1S40F1020I6GB's industrial temperature range (-40C to +100C junction), MIL-STD-1553 bus support, and high logic density make it a fit for avionics and military signal-processing subsystems. Placed on a conduction-cooled VPX card, the FPGA runs radar pre-processing, secure-comms encryption, or video-tracking pipelines while surviving altitude, vibration, and temperature cycling. Compared with newer rad-tolerant FPGAs, the EP1S40 trades radiation tolerance for cost-effectiveness in non-space-grade defense systems.
Recommended
Digital Video Broadcast / Image Processing
The EP1S40F1020I6GB's 41,250 logic elements and TriMatrix memory suit broadcast video processing (HD/SDI routing, MPEG-2/4 encode-decode, motion-compensated temporal filtering). Placed on a broadcast-equipment mainboard, the FPGA performs real-time video scaling, de-interlacing, and chroma-keying across multiple SDI streams. Compared with ASSP video processors, the EP1S40's reprogrammability lets broadcasters add new codecs and overlays without hardware redesign.
Recommended
Industrial Machine Vision and Inspection
The EP1S40F1020I6GB fits high-throughput machine-vision systems where multi-megapixel Camera Link or LVDS cameras stream pixel data into the FPGA at line rates up to 80 MHz. Its 3,423,744 bits of embedded memory buffer line-scan images while 14 DSP blocks accelerate 2D convolution, edge detection, and pattern-matching kernels in real time. Placed between the industrial camera and the host PC or PLC, the EP1S40 reduces false-reject rates by enabling per-pixel adaptive thresholding that off-the-shelf vision processors cannot perform.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F1020I6GB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F1020I6 | EP1S40F1020I6AA | EP1S40F1020C7N | EP1S40F1020C6N | EP1S40F1020C5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | FBGA-1020 (33x33 mm, 1 mm pitch) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Embedded Memory Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| Speed Grade | I6 (industrial, fast) | I6 - same | I6 - same | C7 (commercial, slower) | C6 (commercial) | C5 (commercial, fast) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Maximum User I/Os | 773 | 773 | 773 | 773 | 773 | 773 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial-grade speed-grade I6 in FBGA-1020 - fastest industrial variant of EP1S40 (vs EP1S40F1020C7N)
- Highest-density original Stratix with 41,250 LEs and 14 DSP blocks (vs EP1S30F1020I6)
- TriMatrix memory architecture (M512/M4K/M-RAM) with 3,423,744 RAM bits (vs Xilinx Virtex-II XC2V2000)
Design Notes
The EP1S40F1020I6GB's FBGA-1020 package at 1 mm ball pitch requires a 6- or 8-layer PCB with microvia or buried-via technology to break out the inner balls. Use the manufacturer's recommended land pattern with non-solder-mask-defined (NSMD) pads; signal layers should reference an uninterrupted ground plane to control impedance (typically 50 ohm single-ended, 100 ohm differential). Matched-length trace tuning (±25 mil tolerance) is required for DDR/SDR external-memory interfaces, LVDS pairs, and global clock networks to meet Quartus timing-closure constraints.
Estimated: With all 41,250 logic elements at 100% toggle rate plus 14 DSP blocks at full utilization, the EP1S40F1020I6GB's worst-case core current can exceed 2 A at 1.5 V. Decouple each VCCINT/VCCIO power pin with a 0.1 µF X7R ceramic placed within 100 mil of the ball; bulk-decouple each voltage rail with 100 µF tantalum or polymer. Power sequencing must follow the Stratix Hardware Reference: VCCIO must come up before or simultaneously with VCCINT to prevent I/O latch-up; use a sequenced power-supply controller such as the LTC3543 or TI TPS74xxx family.
Common pitfalls when designing with the EP1S40F1020I6GB: (1) do not assume all 1020 BGA balls are user I/O - power, GND, JTAG (TCK/TMS/TDO/TDI), and configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0], DCLK) are reserved; (2) MSEL[3:0] must be tied to specific values per configuration mode - consult the Stratix Handbook Chapter 8; (3) MSEL lines for AS mode require external 25 ohm series termination; (4) leave at least 4 GND balls between any two JTAG-chain devices to avoid signal-integrity issues; (5) verify that Quartus II software version supports the I6 speed grade of the chosen device family.
Estimated: The EP1S40F1020I6GB's thermal resistance (theta_JA) on a JEDEC 4-layer test board is approximately 15 C/W with 1 m/s airflow and 12 C/W with 2 m/s airflow. At 3 W dissipation the junction rises 36-45 C above ambient; at 6 W it rises 72-90 C. For industrial-grade parts with a +100 C junction limit, derate ambient temperature by this rise to keep Tj within spec. A small heatsink or thermal pad is recommended for sustained >5 W designs in enclosed enclosures without forced-air cooling.
Compliance Information
EP1S40F1020I6GB is an obsolete 2002-era Altera Stratix FPGA. RoHS/REACH/lead-free status for the GB suffix was not specified in the verified web data; the AA suffix variants are documented as lead-free. AEC-Q100 is not applicable to FPGAs.
