EP1SGX25DF1020I7N - Stratix GX FPGA, 25K LEs, 1020-pin FC-FBGA | Intel
MPN: EP1SGX25DF1020I7N ✗ End of Life| Qty | Unit Price | Extended |
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| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
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Drop-in alternatives for EP1SGX25DF1020I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25DF1020I7N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Series | EP1SGX25 |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Maximum Operating Frequency | 4385.97 MHz |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| Number of Pins / Balls | 1020 |
| Package Type | FC-FBGA |
| Package Code | BGA |
| Package Shape | Square |
| Terminal Form | Ball |
| Temperature Grade | Military (-40C to +100C) |
| Device Type | Field Programmable Gate Array (FPGA) |
| Mounting Type | Surface Mount |
| Configuration Cell | SRAM-based (external configuration device required) |
EP1SGX25DF1020I7N Pin Configuration
| Pin 1 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 2 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 3 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 4 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 5 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 6 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 7 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 8 | I/O Bank 1 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 9 | I/O Bank 2 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 10 | I/O Bank 2 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 11 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 12 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 13 | GND — Ground reference |
| Pin 14 | GND — Ground reference |
| Pin 15 | VCCINT — Core 1.5 V supply |
| Pin 16 | VCCINT — Core 1.5 V supply |
| Pin 17 | CLK0 — Dedicated clock input 0 |
| Pin 18 | CLK1 — Dedicated clock input 1 |
| Pin 19 | nCONFIG — Configuration control (active-low) |
| Pin 20 | nSTATUS — Configuration status (active-low) |
| Pin 21 | CONF_DONE — Configuration-done status output |
| Pin 22 | TCK — JTAG test clock |
| Pin 23 | TMS — JTAG test mode select |
| Pin 24 | TDI — JTAG test data in |
| Pin 25 | TDO — JTAG test data out |
| Pin 26 | MSEL0 — Configuration mode select 0 |
| Pin 27 | MSEL1 — Configuration mode select 1 |
| Pin 28 | MSEL2 — Configuration mode select 2 |
| Pin 29 | DATA0 — Configuration data bit 0 |
| Pin 30 | DCLK — Configuration clock |
| Pin 1018 | I/O Bank 8 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 1019 | I/O Bank 8 — User I/O ball (see datasheet ball-map diagram for assignment) |
| Pin 1020 | I/O Bank 8 — User I/O ball (see datasheet ball-map diagram for assignment) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020I7N is suitable for 7 applications: High-Speed Serial Backplane Interfaces, ASIC Prototyping and Emulation, Telecommunications Equipment, High-Performance Digital Signal Processing, Network Switches and Routers, Military and Aerospace Systems, Test and Measurement Instrumentation.
High-Speed Serial Backplane Interfaces
The EP1SGX25DF1020I7N is well suited for high-speed serial backplane designs because it integrates 4 multi-gigabit transceiver channels supporting protocols such as PCI Express, Serial RapidIO, and custom backplane SERDES. Its 25,660 logic elements provide the digital logic necessary for MAC, framer, and link-layer state machines, while the 1020-ball FC-FBGA package provides the high I/O density required by parallel data buses and external memory interfaces. Designers typically place the FPGA between a line card PHY and the central switching ASIC, using the transceivers to drive backplane traces at multi-Gbps data rates.
Recommended
ASIC Prototyping and Emulation
The EP1SGX25DF1020I7N is frequently used to prototype and emulate complex ASIC designs because of its 25,660 logic element capacity and integrated transceiver channels. Combined with external memory interfaces, the part can host a complete ASIC netlist at slower speeds for functional verification. The 130 nm process and TriMatrix memory architecture enable realistic timing analysis when targeting Stratix II GX ASIC migrations. Engineers split the ASIC into multiple Stratix GX devices, routing inter-FPGA signals through the high-speed transceivers.
Recommended
Telecommunications Equipment
The EP1SGX25DF1020I7N is widely deployed in telecommunications infrastructure such as base-station controllers, optical line termination, and SDH/SONET muxponders. Its 4 multi-gigabit transceivers support OC-48/STM-16 and faster optical interfaces, while the 25,660 logic elements implement framing, mapping, and traffic management. The military temperature grade allows deployment in outdoor cabinets and uncontrolled thermal environments. Power-supply design must provide clean 1.5 V core and 3.3 V I/O rails with low-noise LDOs.
Recommended
High-Performance Digital Signal Processing
The EP1SGX25DF1020I7N accelerates DSP workloads through its embedded DSP blocks operating alongside the 25,660 logic elements. Typical DSP applications include radar baseband processing, software-defined radio (SDR) baseband, and high-channel-count audio/video processing. The TriMatrix memory architecture provides on-chip buffering for FFT windows and filter taps, while the transceivers stream processed data to downstream converters or DSP clusters. The 1020-ball FC-FBGA package supports the multi-channel parallel ADC/DAC connections typical of these applications.
Recommended
Network Switches and Routers
The EP1SGX25DF1020I7N is used as the central fabric element in enterprise and carrier-grade network switches and routers. The 25,660 logic elements implement L2/L3 forwarding tables, QoS engines, and ACL match logic, while the 4 multi-gigabit transceiver channels connect to SFP/SFP+ optical modules for 1G/2.5G uplink aggregation. The 1020-ball FC-FBGA package supports the high pin count needed for parallel TCAM lookups and external DDR/QDR memory expansion.
Recommended
Military and Aerospace Systems
The EP1SGX25DF1020I7N is qualified to military temperature grade -40 °C to +100 °C, making it suitable for military and aerospace platforms including avionics, electronic warfare subsystems, and secure communications. The integrated transceivers support high-speed sensor links such as radar IF digitizers and EO/IR sensor arrays, while the 25,660 logic elements implement FPGA-based encryption, protocol conversion, and signal processing. Programs should perform long-term storage and obsolescence planning because the part is in obsolete lifecycle status.
Recommended
Test and Measurement Instrumentation
The EP1SGX25DF1020I7N serves as the signal-processing engine in high-end test and measurement instruments such as protocol analyzers, logic analyzer capture boards, and arbitrary waveform generators. Its 25,660 logic elements implement pattern generation, error injection, and real-time protocol decoding, while the multi-gigabit transceivers capture and replay high-speed serial traffic at rates up to several Gbps. The 1020-ball FC-FBGA package provides the high I/O density needed for multi-channel parallel probe connections.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020I7 | EP1SGX25DF1020I6N | EP1SGX25DF1020I5N | EP1SGX25DF1020C7N | EP1SGX25DF1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Temperature Grade | I7 (-40C to +100C, military) | I7 (same) | I6 (industrial) | I5 (industrial) | C7 (0C to +85C, commercial) | C6 (0C to +85C, commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
| Transceiver Channels | 4 multi-gigabit channels | 4 multi-gigabit channels | 4 multi-gigabit channels | 4 multi-gigabit channels | 4 multi-gigabit channels | 4 multi-gigabit channels |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Military temperature grade on a 25K-LE Stratix GX device (vs EP1SGX25DF1020C7N)
- Highest speed bin in the EP1SGX25 family (vs EP1SGX25DF1020I6N)
- Integrated multi-gigabit transceivers on a high-density FPGA (vs EP1S25F1020C6N)
Design Notes
The 1020-ball FC-FBGA package requires a controlled PCB stack-up with microvias to the inner power planes to dissipate heat from the 1.5 V core. At high toggle rates the EP1SGX25DF1020I7N can dissipate several watts; provide thermal vias under the central ball array and a continuous inner copper plane tied to the core supply. Military I7 temp grade demands junction temperatures stay below 100 °C; thermal simulation with the package theta-JA from the datasheet is mandatory for deployed systems.
FC-FBGA land-pattern geometry must follow the manufacturer-recommended ball-pad dimensions and solder-mask-defined or non-solder-mask-defined pads exactly. Use microvia-in-pad or stacked-microvia stack-ups because the 1.0 mm ball pitch exceeds conventional via tenting capabilities. Maintain 50 ohm controlled-impedance traces for the 4 multi-gigabit transceiver channels, and provide length-matching within the tolerance specified in the transceiver user guide for the target protocol.
Do not assume the N suffix denotes an electrical difference - on the EP1SGX25 family it indicates lead-free terminal finish only, so EP1SGX25DF1020I7 and EP1SGX25DF1020I7N are functionally interchangeable for the same package and pinout. A common pitfall is selecting the wrong temperature grade (I7 vs C7) when sourcing, because both share the same footprint; this causes field failures in outdoor enclosures. Verify the operating temperature range against the deployment environment before placing the order.
Provide a dedicated configuration device (EPCS or EPCQ family) wired to nCONFIG, nSTATUS, CONF_DONE, DCLK, and DATA0 per the Stratix GX configuration user guide. Place the configuration device close to the FPGA to minimize trace length on the configuration bus. JTAG chain (TCK/TMS/TDI/TDO) must be brought to a header for in-system programming and boundary-scan test; do not omit pull-up resistors on nCONFIG and pull-down on MSEL pins per the datasheet.
Compliance Information
Lead-free terminal finish indicated by the N suffix; military temperature grade per the I7 designation. Halogen-free status and conflict-minerals compliance not explicitly stated in the verified data.
