EP1SGX25DF676C7 - Stratix GX FPGA, 25K LEs, 676-BGA | Altera
MPN: EP1SGX25DF676C7 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $765 | $7,650.00 |
| 50 | $680 | $34,000.00 |
| 100 | $595 | $59,500.00 |
| 250 | $510 | $127,500.00 |
Drop-in alternatives for EP1SGX25DF676C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1SGX25DF676C7N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP1SGX25DF676I7
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP1SGX25DF676C6
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP1SGX25DF676I6N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP1SGX10DF672C7
β Drop-Inβ In Stock
$98.5 / Unit
View Datasheet βEP1SGX25DF676C7 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25660 |
| Total Memory Bits | 1944576 |
| Transceiver Channels | Up to 20 |
| Transceiver Data Rate | Up to 3.1875 Gbps |
| Package | 676-BGA FineLine |
| Core Voltage | 1.5 V (typical) |
| Process Technology | 0.13 Β΅m |
| Embedded CDR | Yes |
| Embedded SERDES | Yes |
| Operating Temperature | Commercial (0C to +85C inferred from C7 speed grade) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per typical BGA JEDEC J-STD-020) |
| Configuration | SRAM-based, requires EPC configuration device |
EP1SGX25DF676C7 676-bga fineline Pin Configuration Guide
Complete pinout information for EP1SGX25DF676C7 (676-bga fineline package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF676C7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF676C7 is suitable for 6 applications: Gigabit Ethernet Backplane Bridging, Fibre Channel SAN Line Cards, Serial RapidIO Switch Fabric Interface, PCI Express Endpoint Development, Custom Protocol Test & Measurement Equipment, Legacy ASIC Replacement and Long-Life Industrial Systems.
Gigabit Ethernet Backplane Bridging
The EP1SGX25DF676C7's 20 SERDES channels at up to 3.1875 Gbps make it suitable for bridging multi-lane Gigabit Ethernet backplanes in telecom equipment. Placed between line cards and switch fabric ASICs, each channel runs at 1.25 Gbps for tri-speed GbE or 3.125 Gbps for XAUI, with embedded CDR handling jitter tolerance per IEEE 802.3. The 676-ball BGA exposes enough user I/O for parallel data-plane routing while keeping high-speed lanes short for signal integrity.
Recommended
Fibre Channel SAN Line Cards
The transceiver data rate of 3.1875 Gbps covers 2-Gbit Fibre Channel per INCITS T11 with margin for 4-GFC preparation. The EP1SGX25DF676C7 in a 676-BGA can host the FC protocol state machine, buffer descriptors, and DMA engines in its 25,660 logic elements, while the SERDES handles FC-0/FC-1 encoding and clock recovery. This reduces ASIC NRE cost for low-volume SAN switches where full custom silicon is uneconomic.
Recommended
Serial RapidIO Switch Fabric Interface
Serial RapidIO (SRIO) at 1.25 / 2.5 / 3.125 Gbps runs natively on the Stratix GX transceivers, making the EP1SGX25DF676C7 suitable for DSP-array-to-switch fabric interconnects in wireless base stations and high-performance embedded systems. The 1.94 Mbit of embedded memory absorbs small SRIO transactions and assists packet buffering, while the logic elements implement the SRIO Logical and Transport layers above the SERDES physical interface.
Recommended
PCI Express Endpoint Development
Although the 3.1875 Gbps SERDES exceeds PCIe Gen 1's 2.5 Gbps requirement, the EP1SGX25DF676C7 can be configured as a PCIe endpoint or root complex prototype using one or more transceiver channels. The 676-BGA exposes the side-band signals (PERn, REFCLK, PRSNT) required by the PCIe specification. This makes the part popular for ASIC/ASSP validation boards where a real PCI Express root is needed but a full custom solution is premature.
Recommended
Custom Protocol Test & Measurement Equipment
Engineers designing protocol analyzers, pattern generators, and SERDES bit-error-rate testers leverage the EP1SGX25DF676C7's reprogrammable logic plus real transceivers to implement multi-standard test instruments on a single PCB. The 676-ball FineLine BGA supports the dense probe and connector arrays typical of ATE platforms, and the Quartus II toolchain enables rapid protocol updates when standards evolve.
Recommended
Legacy ASIC Replacement and Long-Life Industrial Systems
In long-life industrial systems (factory automation, military, aerospace retrofit) where the original ASIC is end-of-life, the EP1SGX25DF676C7 provides a logic-equivalent substitute with firmware reconfigurability. Its 676-ball package is footprint-compatible with sibling 672-ball designs (with PCB tweaks), letting engineers reuse most of the supply-chain documentation while gaining supply resilience through FPGA redundancy.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF676C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF676C7N | EP1SGX25DF676I7 | EP1SGX25DF676C6 | EP1SGX25DF676I6N | EP1SGX10DF672C7 |
|---|---|---|---|---|---|---|
| Package | 676-BGA FineLine | 676-BGA FineLine - same | 676-BGA FineLine - same | 676-BGA FineLine - same | 676-BGA FineLine - same | 672-BGA FineLine - different pin count |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Logic Elements | 25660 | 25660 | 25660 | 25660 | 25660 | ~10500 (-59%) |
| Memory Bits | 1944576 | 1944576 | 1944576 | 1944576 | 1944576 | 920448 (-53%) |
| Transceiver Channels | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 10 (-50%) |
| Transceiver Data Rate | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps |
| Speed Grade | C7 (commercial, fastest) | C7N (commercial, lead-free) | I7 (industrial, fastest) | C6 (commercial, slower) | I6N (industrial, lead-free, slower) | C7 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C | 0C to +85C | -40C to +100C | 0C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Embedded SERDES with CDR eliminates external transceiver ASICs (vs EP1S25F1020C6)
- Highest-speed C7 grade for maximum timing margin in commercial temperature (vs EP1SGX25DF676C6)
- 676-ball FineLine BGA preserves high I/O density for multi-protocol applications (vs EP1SGX25DF672C7)
Design Notes
The 676-ball FineLine BGA requires a multi-layer PCB (8+ layers recommended) with controlled-impedance routing for the 20 high-speed SERDES channels. Use 50 ohm differential routing (85 ohm differential for some protocols) with length matching within 0.127 mm (5 mil) for high-speed lanes. Microvia-in-pad stackups are typically required to break out the 1.0 mm pitch BGA balls. The Altera Stratix GX Development Kit reference design provides a proven layout template.
The Stratix GX part can dissipate 5-10 W in typical serial-interface applications and up to 15 W under full transceiver utilization at high ambient temperatures. Provide thermal relief through a thermal pad array under the BGA connected to internal copper planes with thermal vias. The 676-BGA package theta_JA is approximately 15-20 C/W with adequate PCB thermal design; without thermal management the device will throttle or shutdown. Use Quartus II PowerPlay for early thermal estimation.
The Stratix GX family requires multiple supply rails: VCCINT (core voltage ~1.5 V), VCCIO (I/O voltage per bank, 1.5 V to 3.3 V), VCCA_PLL (PLL analog supply), and VCCA_TX/RX (transceiver analog supply). Use low-noise LDOs (e.g., TI TPS7A4701 or equivalent) for the analog rails to meet CDR jitter specifications. Bulk decoupling of 100 uF plus 0.1 uF ceramic per pin group is mandatory per Altera's power distribution network guidelines.
Do not assume the C7 speed grade designation means commercial temperature only; verify the full part number decoder with Altera's nomenclature guide. Also, the EP1SGX25DF676C7N variant is the lead-free (Pb-free) reflow-compatible version - dropping the 'N' suffix means SnPb ball finish, which matters for RoHS-compliant end products. Stratix GX configuration requires an enhanced EPC device (EPC16/EPC64), not the older EPC2 - using the wrong config device causes silent configuration failures.
The SERDES channels operate at 3.1875 Gbps, requiring pre-emphasis and equalization for board traces longer than 5 inches. Stratix GX transceivers include programmable pre-emphasis, but PCB routing still must control impedance discontinuities at via transitions and connector breaks. Use 3D EM simulation (Ansys HFSS, Keysight ADS) or Altera's Signal Integrity toolset before tape-out. Reference clock jitter must remain below 100 fs RMS for reliable CDR operation at 3.1875 Gbps.
Compliance Information
RoHS/lead-free compliance varies by suffix variant (N suffix indicates Pb-free per Altera nomenclature). The C7 base part is SnPb ball finish; the C7N variant is Pb-free. AEC-Q100 is not applicable as this is a commercial/industrial FPGA. Verify RoHS status with franchised distributor certificate of conformance before procurement.
