EP1S25F672C7 - 25K LE Stratix FPGA, 672-BGA, 420 MHz | Intel
MPN: EP1S25F672C7 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $787.28 | $787.28 |
| 10 | $750.5 | $7,505.00 |
| 100 | $698 | $69,800.00 |
| 500 | $645 | $322,500.00 |
| 1,000 | $595 | $595,000.00 |
Drop-in alternatives for EP1S25F672C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F672C6
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View Datasheet →EP1S25F672C6N
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View Datasheet →EP1S25F672C5N
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View Datasheet →EP1S25F672I7N
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View Datasheet →EP1S25B672C7
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$175 / Unit
View Datasheet →EP1S25B672C7N
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View Datasheet →EP1S25F672C7 Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 25,660 |
| Total RAM Bits | 1,944,576 |
| Configurable Logic Blocks (CLBs) | 2,852 |
| User I/O Count | 473 |
| Package | 672-BBGA (FBGA), 35 x 35 mm, 1.27 mm pitch |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Maximum Core Frequency | 420 MHz |
| Speed Grade | C7 (-7 commercial) |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Embedded Multipliers (18x18) | 224 |
| TriMatrix Memory Blocks | Yes (MRAM / M512 / M4K) |
| DLLs | 6 |
| PLLs | 2 |
| Mounting Type | Surface Mount |
EP1S25F672C7 672-bbga (fbga), 35 x 35 mm, 1.27 mm pitch Pin Configuration Guide
Complete pinout information for EP1S25F672C7 (672-bbga (fbga), 35 x 35 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F672C7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F672C7 is suitable for 6 applications: Wired Telecom Line Cards / DSLAM Backplanes, Broadcast Video Processing & SDI Routers, Military Radar Front-End Preprocessing, Medical Imaging Pipelines (Ultrasound / CT Reconstruction), DSP Co-Processing Accelerator Cards, Industrial Machine Vision Inspection.
Wired Telecom Line Cards / DSLAM Backplanes
The EP1S25F672C7's 25,660 LEs, 1,944,576 RAM bits, and 473 user I/O make it a strong fit for wired telecom line cards and DSLAM backplane aggregation. With 420 MHz core and 224 embedded 18x18 multipliers, the device can implement ATM cell segmentation/reassembly, packet classification, and Reed-Solomon forward-error-correction blocks in a single chip. The 672-FBGA's 473 I/O lines provide ample bus width to external ZBT SRAM and DDR SDRAM companion memories used for cell buffering, while the 1.5 V core keeps standby power low across always-on telecom chassis. Designers can pair the FPGA with companion line-interface ICs and PHY transceivers for full SHDSL/VDSL front-end cards.
Recommended
Broadcast Video Processing & SDI Routers
Broadcast video routers and SDI matrix switches benefit from the EP1S25F672C7's high I/O count and on-chip memory bandwidth. With 473 user I/O the FPGA can ingest and re-route dozens of SDI/HD-SDI/3G-SDI streams while performing embedded audio de-embed, ANC processing, and frame synchronization in logic. The TriMatrix memory blocks (MRAM/M512/M4K) provide line buffers for video line delays, and the 224 DSP blocks handle color-space conversion and scaling. The 420 MHz core comfortably handles 1080p60 pixel clock domains in horizontal and vertical processing pipelines, while the LVDS-capable I/O supports high-speed parallel connections to companion serializer-deserializer ASICs.
Recommended
Military Radar Front-End Preprocessing
The military-grade variant EP1S25B672C7N (drop-in compatible with EP1S25F672C7) is widely used in radar front-end preprocessing, where the 224 embedded 18x18 multipliers implement FFT/iFFT butterfly operations and pulse-Doppler filtering. The on-chip TriMatrix memory holds windowing coefficients, range-bin accumulators, and CFAR threshold tables without external SRAM access latency. The 130 nm Stratix architecture is known for radiation tolerance by silicon process design rules, and the industrial-temperature SP package is qualified for avionics and ground-mobile radar enclosures. The 672-FBGA's thermal pad and ground structure provide adequate heat-spreading for sustained DSP utilization at 80-90 % of available multipliers.
Recommended
Medical Imaging Pipelines (Ultrasound / CT Reconstruction)
In ultrasound beamformers and CT back-projection systems, the EP1S25F672C7's parallel DSP fabric excels at running hundreds of FIR filter taps simultaneously across multiple receive channels. The 25,660 LEs implement beamforming control logic and channel multiplexing, and the 1,944,576 RAM bits buffer beamformed scan-line data between acquisition and display. The 473 user I/O support 16-bit parallel LVDS data streams from 32-64 ADC channels per FPGA, while the 1.5 V core keeps thermal dissipation manageable in enclosed scanner carts. Migration paths to EP1S40 are common for higher-channel-count scanners.
Recommended
DSP Co-Processing Accelerator Cards
PCI and cPCI accelerator cards use the EP1S25F672C7 as a co-processor that offloads heavy DSP blocks from a host CPU. The 224 18x18 multipliers and TriMatrix memory enable real-time FFT, convolution, and correlation at sample rates up to 100 MSPS per channel. The 672-FBGA's 473 I/O provide generous PCI/cPCI bus width plus auxiliary GPIO for inter-card synchronization. Designers can pair the FPGA with companion SRAM or SDRAM for working-set buffering and use the 6 DLLs / 2 PLLs for clean system-clock distribution across the card. This architecture was common in 2000s-era DSP accelerator boards.
Recommended
Industrial Machine Vision Inspection
High-speed machine vision systems use the EP1S25F672C7 to perform real-time image preprocessing, pattern matching, and defect classification on multi-Megapixel camera streams. The 25,660 LEs handle Bayer demosaicing, color correction, and blob analysis in parallel pipelines, while the on-chip TriMatrix memory buffers line-scan data from area cameras at line rates up to 80 kHz. The 473 user I/O support Camera Link Medium/Full interfaces via dedicated LVDS pairs, and the LVDS-capable I/O standards allow direct connection to high-speed image sensors. The commercial 0-85 °C temperature range covers most factory-floor enclosure environments.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F672C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F672C6 | EP1S25F672C6N | EP1S25F672C5N | EP1S25F672I7N | EP1S25B672C7 | EP1S25B672C7N |
|---|---|---|---|---|---|---|---|
| Package | 672-FBGA (35 x 35 mm, 1.27 mm pitch) | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,660 | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) |
| RAM Bits | 1,944,576 | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same) |
| Speed Grade | -7 (420 MHz max core) | -6 (~357 MHz) | -6 (~357 MHz) | -5 (slowest) | -7 (420 MHz) | -7 (420 MHz) | -7 (420 MHz) |
| Temperature Grade | Commercial 0 °C to +85 °C | Commercial | Commercial | Commercial | Industrial -40 °C to +100 °C | Military / extended | Military / extended |
| Lead-Free Finish (N suffix) | No (non-N) | No | Yes | Yes | Yes | No | Yes |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Estimated Unit Price (qty 1) | $787.28 USD | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest I/O count for the EP1S25 silicon die (vs EP1S25F780C7 (780-FBGA option does not exist; EP1S25 maxes at 672-FBGA))
- Drop-in speed-grade flexibility within 672-FBGA (vs EP1S25F672C6)
- Industrial and military drop-in grades share footprint (vs EP1S25F672I7N)
Design Notes
Estimated: A fully utilized EP1S25F672C7 at 420 MHz core and high I/O toggle activity can draw 4-5 W. The 672-FBGA's exposed-die paddle must be soldered to a 6-layer PCB with at least 4 inner power/ground planes to spread heat. Add bulk decoupling (10-47 µF tantalum) plus 0.1 µF + 0.01 µF ceramics near each VCC/VCCIO pin bank. The 1.5 V core rail should be sequenced before the I/O VCCIO rails to avoid I/O latch-up at power-up; use a separate regulator with PG (power-good) signal to gate downstream rails.
The 672-FBGA at 35 x 35 mm with 1.27 mm ball pitch requires HDI PCB stackup with microvia-in-pad (0.1 mm laser-drilled) and 4-6 mil trace/space on outer layers. Use the standard BGA escape pattern with via-in-pad filled and planarized to ensure reliable assembly. Match trace lengths within each byte-lane group if using LVDS or DDR interfaces; Quartus II's I/O Assignment Analyzer will catch length skew issues pre-route. Keep the JTAG TCK trace under 6 inches to avoid signal integrity problems with passive configuration EPROMs.
Do not use the EP1S25F672C7 in new designs - migrate to Stratix II/IV or Cyclone IV/V. The Quartus II software version must match the silicon revision - mixing tool versions can produce non-functional bitstreams. The 'C7' speed grade datasheet figures are guaranteed only at 1.5 V core and 0 °C to +85 °C ambient; derate by 10-15 % for industrial-temperature operation. Configuration EPROMs (EPC16 / EPC8) must match the Stratix I configuration scheme, not Stratix II - mixing families breaks configuration.
Compliance Information
The EP1S25F672C7 base part is non-N suffix (SnPb ball finish); the EP1S25F672C7N variant is Pb-free. RoHS / REACH compliance status was not present in the verified web data and is marked unknown - request a compliance certificate from the authorized distributor before use in RoHS-restricted regions.
