EP1SGX40F1020C6 - Stratix GX 41,250 LEs FPGA, 1020-BGA | Altera
MPN: EP1SGX40F1020C6 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142 | $142,000.00 |
Drop-in alternatives for EP1SGX40F1020C6 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX40DF1020C6
β Drop-Inβ In Stock
$1620 / Unit
View Datasheet βEP1SGX40F1020C5N
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$195 / Unit
View Datasheet βEP1SGX40F1020C7N
β Drop-Inπ Reference alternative (not in catalog)
EP1SGX40DF1020C6ES
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Contact for price
View Datasheet βEP1SGX40DF1020C6N
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$142 / Unit
View Datasheet βEP1SGX40DF1020C5
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$3650 / Unit
View Datasheet βEP1SGX40F1020C6 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Series | EP1SGX40 |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Total RAM Bits | 3,423,744 |
| Max Transceiver Data Rate | 3.1875 Gbps |
| Core Voltage (VCCINT) | 1.5 V |
| Logic Family | CMOS (SRAM-based LUT) |
| Package Type | 1020-ball FBGA (FineLine BGA) |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.00 mm |
| Operating Temperature | 0 C to 85 C (commercial) |
| Configuration Method | SRAM-based (volatile, requires boot device) |
| Speed Grade | C6 |
EP1SGX40F1020C6 Pin Configuration
| Pin 1 | VCCINT β Core supply voltage (1.5 V) |
| Pin 2 | VCCIO1 β I/O bank 1 supply voltage |
| Pin 3 | GXB_TX0p β Transceiver channel 0 transmit positive |
| Pin 4 | GXB_TX0n β Transceiver channel 0 transmit negative |
| Pin 5 | GXB_RX0p β Transceiver channel 0 receive positive |
| Pin 6 | GXB_RX0n β Transceiver channel 0 receive negative |
| Pin 7 | VCCA β Analog supply for PLLs/transceivers |
| Pin 8 | MSEL0 β Configuration mode select bit 0 |
| Pin 9 | MSEL1 β Configuration mode select bit 1 |
| Pin 10 | nCONFIG β Configuration control (active low) |
| Pin 11 | nSTATUS β Configuration status (active low) |
| Pin 12 | CONF_DONE β Configuration done indicator |
| Pin 13 | DATA0 β Configuration data input bit 0 |
| Pin 14 | TCK β JTAG clock |
| Pin 15 | TMS β JTAG mode select |
| Pin 16 | TDI β JTAG data input |
| Pin 17 | TDO β JTAG data output |
| Pin 18 | DCLK β Configuration clock input |
| Pin 19 | GND β Common ground return |
| Pin 20 | GND β Common ground return |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40F1020C6 is suitable for 6 applications: Telecom Line Card with Multi-Gigabit Backplane, Video Broadcast Format Converter, High-Performance Computing Accelerator, Signal Intelligence / SDR Platform, Industrial Imaging and Machine Vision, ASIC Prototyping Platform.
Telecom Line Card with Multi-Gigabit Backplane
The EP1SGX40F1020C6 is well suited to telecom line cards that aggregate multiple serial links onto a backplane. Its 3.1875 Gbps embedded transceivers implement protocols such as Serial RapidIO and proprietary SERDES fabrics directly in silicon, eliminating external PHY chips. The 41,250 logic elements absorb packet classification, traffic shaping, and link-layer processing, while 3,423,744 RAM bits hold route tables and packet buffers. The 1020-BGA exposes dedicated transceiver balls that simplify controlled-impedance routing across the backplane connector. Designers can place a single FPGA between the network processor and the switch fabric ASIC, reducing BOM cost and board area.
Recommended
Video Broadcast Format Converter
Broadcast studios use the EP1SGX40F1020C6 to convert between SDI, HD-SDI, and emerging high-speed serial video formats in real time. The 41,250 logic elements run color-space conversion, scaling, and frame-rate adaptation pipelines in hardware, while the embedded transceivers handle SDI at 270 Mbps through 2.97 Gbps without external reclockers. TriMatrix memory provides line buffers and lookup tables for gamma correction. The 1020-BGA package supports enough parallel I/O to drive DDR2 SDRAM companion chips for frame storage. Quarters II legacy IP cores for SDI and audio embedding accelerate integration versus discrete ASSP solutions.
Recommended
High-Performance Computing Accelerator
High-performance computing blades deploy the EP1SGX40F1020C6 as a hardware accelerator attached via PCI Express or proprietary serial links. The FPGA's dedicated DSP blocks run multiply-accumulate operations for FFT, FIR filtering, or encryption at hardware speeds, while the 41,250 logic elements host control state machines and DMA engines. 3.1875 Gbps transceivers connect directly to the host CPU over a single PCIe Gen1 lane pair or multiple custom serial lanes, eliminating protocol-bridge chips. The 1020-BGA package supports the dense power and ground pin count required for sustained GHz-class operation. Designers partition algorithms between the host CPU and the FPGA to maximize throughput per watt.
Recommended
Signal Intelligence / SDR Platform
Software-defined radio and signal-intelligence platforms exploit the EP1SGX40F1020C6's combination of high-speed ADCs companion interface logic and embedded transceivers. The 41,250 logic elements implement DDC/DUC chains, modulators, and demodulators in reconfigurable hardware, while 3.423 Mbit RAM holds sample buffers and channelization tables. The 3.1875 Gbps transceivers stream digitized RF data to downstream processors over Aurora or Serial RapidIO links. The 1020-BGA package delivers the I/O bandwidth needed to interface with multi-channel 16-bit ADC DAC converters at 200 MSPS or higher. Mission systems retarget the FPGA between waveforms by reprogramming configuration memory.
Recommended
Industrial Imaging and Machine Vision
Machine vision systems pair the EP1SGX40F1020C6 with multi-megapixel image sensors to perform real-time pixel processing, blob detection, and pattern matching. The 41,250 logic elements implement image pipelines, while the 3,423,744 RAM bits buffer full frames for inspection algorithms. Embedded transceivers transport processed image data to host PCs via single-lane serial links or to multiple cameras in a daisy chain. The 0 to 85 C commercial temperature grade suits factory floor enclosures without additional thermal management. Designers use Quartus II reference designs to accelerate Camera Link or CoaXPress interface implementation.
Recommended
ASIC Prototyping Platform
ASIC prototyping teams use the EP1SGX40F1020C6 as a flexible substrate for validating register-transfer-level designs before mask commit. Multiple FPGAs can be tiled on a prototyping board, with high-speed serial links bridging chip-to-chip boundaries. The 41,250 logic elements per device support large RTL partitions, while the 1020-BGA exposes enough user I/O for memory-bus and peripheral-pin replication. Quartus II supports incremental synthesis and incremental compilation flows, accelerating bring-up versus gate-level simulation. Reusing the prototyping platform across multiple ASIC projects maximises return on investment for legacy silicon.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40F1020C6 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40DF1020C6 | EP1SGX40F1020C5N | EP1SGX40F1020C7N | EP1SGX40DF1020C6ES | EP1SGX40DF1020C6N | EP1SGX40DF1020C5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FBGA (33x33 mm, 1 mm pitch) | 1020-ball FBGA (33x33 mm, 1 mm pitch) - same | 1020-ball FBGA (33x33 mm, 1 mm pitch) - same | 1020-ball FBGA (33x33 mm, 1 mm pitch) - same | 1020-ball FBGA (33x33 mm, 1 mm pitch) - same | 1020-ball FBGA (33x33 mm, 1 mm pitch) - same | 1020-ball FBGA (33x33 mm, 1 mm pitch) - same |
| Logic Elements | 41,250 | 41,250 - same | 41,250 - same | 41,250 - same | 41,250 - same | 41,250 - same | 41,250 - same |
| Total RAM Bits | 3,423,744 | 3,423,744 - same | 3,423,744 - same | 3,423,744 - same | 3,423,744 - same | 3,423,744 - same | 3,423,744 - same |
| Speed Grade | C6 | C6 - same | C5 (slower Fmax) | C7 (faster Fmax) | C6 - same (ES screening) | C6 - same | C5 (slower Fmax) |
| Embedded Transceiver Configuration | F variant (standard transceiver count) | DF variant (Enhanced transceiver count, more channels) | F variant (same) | F variant (same) | DF variant (Enhanced transceivers) | DF variant (Enhanced transceivers) | DF variant (Enhanced transceivers) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C - same | 0 C to 85 C - same | 0 C to 85 C - same | 0 C to 85 C - same | 0 C to 85 C - same | 0 C to 85 C - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (ES grade) | Obsolete | Obsolete |
Key Differentiators
- Lower transceiver count keeps BOM cost lower than DF variants (vs EP1SGX40DF1020C6)
- C6 speed grade balances Fmax headroom against secondary-market price (vs EP1SGX40F1020C7N)
- Standard 1020-ball FBGA shared across all EP1SGX40 variants (vs Stratix II GX family)
Design Notes
Estimated: a populated EP1SGX40F1020C6 with 41,250 LEs at moderate utilization (~70%) and active transceivers typically draws 3-5 W from the 1.5 V VCCINT rail, plus 0.5-1 A per active transceiver channel from VCCA. Provide at least four 0.1 uF ceramic capacitors per power pin group, plus bulk decoupling near the BGA. Reference plane continuity under the BGA must be uninterrupted to support the high transient currents typical of Stratix GX designs.
The 1020-ball FBGA at 1.00 mm pitch requires 4-layer minimum stack-up with microvia or via-in-pad escape. Use blind/buried vias to route out of the inner ball rows. Maintain a continuous ground reference under all transceiver lanes and provide 100 ohm differential impedance for GXB_RX/TX pairs. Thermal vias under the exposed die attach pad reduce junction-to-ambient thermal resistance.
Do not apply voltage to VCCINT before VCCA ramps, as this can latch-up the analog PLL blocks. Sequence the power supplies per the Stratix GX handbook. The MSEL pins must be tied to known logic levels to select the correct configuration scheme; floating MSELs are a common boot failure root cause. Verify JTAG chain integrity by reading the device IDCODE before attempting configuration.
Compliance Information
RoHS and REACH status not confirmed in verified web data. AEC-Q100 not applicable for FPGAs. F-suffix variants may use lead-containing bump finish typical of legacy Altera parts; check the device marking and lot trace documentation before specifying in Pb-free assemblies.
