EP1SGX40DF1020C6N - Stratix GX FPGA, 41,250 LEs, 1020-FBGA | Intel
MPN: EP1SGX40DF1020C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142 | $142,000.00 |
Drop-in alternatives for EP1SGX40DF1020C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX40DF1020C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Number of LABs/CLBs | 4125 LABs / 4697 CLBs |
| Total RAM Bits | 3,423,744 |
| Number of I/O | 624 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Frequency | 5000 MHz |
| Operating Temperature | 0 C to 85 C |
| Package Type | 1020-FBGA (33 x 33 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
| Speed Grade | C6 |
EP1SGX40DF1020C6N 1020-fbga (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1SGX40DF1020C6N (1020-fbga (33 x 33 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40DF1020C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40DF1020C6N is suitable for 6 applications: Telecom Line Cards and SERDES Backplanes, Software Defined Radio (SDR) Baseband Processing, Broadcast Video Encoding and Processing, High-Performance ASIC Prototyping, Military and Secure Communications, Industrial Test and Measurement Instrumentation.
Telecom Line Cards and SERDES Backplanes
The EP1SGX40DF1020C6N fits telecom line-card designs because its integrated multi-gigabit transceivers and 624 user I/Os directly support SERDES-based backplane interconnect at OC-192 / 10G rates. With 41,250 logic elements and 3.4 Mbits of embedded RAM, it handles packet classification, framing, and forwarding logic without external ASSPs. The 1020-FBGA package exposes enough SERDES channels and parallel I/O for multi-port line cards. Placed on a multi-layer PCB with controlled-impedance traces, the device replaces what would otherwise be a discrete SERDES chip plus glue logic. Designers should follow the Stratix GX handbook's reference design for transceiver channel placement to minimize jitter.
Recommended
Software Defined Radio (SDR) Baseband Processing
The EP1SGX40DF1020C6N suits SDR baseband designs because its 41,250 logic elements, 3.4 Mbit embedded RAM, and dedicated DSP blocks deliver sufficient processing throughput for wideband digital down-conversion, channelization, and demodulation. The 5000 MHz internal clock supports multi-stage FIR filtering and FFT pipelines in a single device. Combined with the integrated high-speed transceivers, the FPGA streams digitized RF data directly into the fabric for real-time processing. The 1020-FBGA exposed-die package enables heatsink attachment for sustained DSP workloads. Reference designs from the Altera DSP Builder flow accelerate development of SDR baseband IP cores.
Recommended
Broadcast Video Encoding and Processing
The EP1SGX40DF1020C6N fits broadcast video encoder/decoder applications because its 41,250 logic elements and 3.4 Mbit embedded RAM enable real-time SD/HD video processing, compression, and overlay composition in a single device. The 624 user I/Os handle multiple video streams, audio interfaces, and control channels simultaneously. The integrated transceivers support SDI (Serial Digital Interface) at 270 Mbps / 1.485 Gbps / 2.97 Gbps rates standard in broadcast studios. Compared with ASSP encoders, the FPGA offers post-deployment codec upgrades. Designers should use the Quartus II video IP suite and consult broadcast reference designs for SDI physical-layer implementation.
Recommended
High-Performance ASIC Prototyping
The EP1SGX40DF1020C6N is well-suited to ASIC prototyping because its 41,250 logic elements, 3.4 Mbit embedded RAM, and 624 I/Os provide enough capacity to map mid-complexity ASIC designs at production clock rates. Multi-FPGA partitioning is possible via the high-speed transceivers for prototyping ASICs too large for one device. The 1020-FBGA package exposes wide buses for bridging to memory and external test equipment. Designers benefit from the Quartus II synthesis flow supporting direct migration of synthesizable ASIC RTL. Use the Stratix GX handbook's ASIC prototyping reference flow for clock-domain crossing and I/O mapping.
Recommended
Military and Secure Communications
The EP1SGX40DF1020C6N fits military secure-communications equipment where its 41,250 logic elements, integrated transceivers, and 1020-FBGA package support cryptographic processing, signal conditioning, and multi-channel data aggregation. The extended-temperature variant EP1SGX40DF1020C6ES supports ruggedized deployment in temperature-stressed environments. The FPGA's reconfigurability allows post-deployment cryptographic algorithm updates critical for lifecycle management. Designers should consult the Altera industrial/military temperature datasheet supplement for derating guidance. The Quartus II development flow includes IP cores for AES, SHA, and public-key acceleration common in secure-radio designs.
Recommended
Industrial Test and Measurement Instrumentation
The EP1SGX40DF1020C6N fits high-end test and measurement instruments because its 41,250 logic elements, 3.4 Mbit embedded RAM, and 624 user I/Os enable real-time DSP, parallel ADC/DAC interfacing, and complex triggering logic in a single chip. The integrated transceivers handle high-speed serial protocols such as PCIe, Serial RapidIO, and 10G Ethernet used in modern ATE platforms. The 1020-FBGA package supports the dense ball-out required for parallel LVDS ADC interfaces. Designers can leverage Altera's DSP Builder and IP library for FFT, FIR, and arbitrary waveform generation, reducing time-to-market for new instruments.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40DF1020C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C6N | EP1SGX40GF1020C7N | EP1SGX40DF1020C6ES | EP1SGX40DF1020C6BN | EP1SGX40DF1020C5N | EP1SGX40DF1020C |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-FBGA (33 x 33 mm, 1 mm pitch) | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Transceiver Variant | DF (Differential SERDES) | GF (Giga-bit Fibre) | GF (Giga-bit Fibre) | DF (Differential SERDES) | DF (Differential SERDES) | DF (Differential SERDES) | DF (Differential SERDES) |
| Speed Grade | C6 | C6 | C7 (faster) | C6 | C6 | C5 (slower) | Unsuffixed |
| Number of I/O | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Total RAM Bits | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Drop-in compatible with multiple Stratix GX 40K variants on the same 1020-FBGA PCB (vs EP1SGX40GF1020C6N)
- Mid-density tier of Stratix GX family with high logic and RAM balance (vs EP1S40F1020C6N (Stratix non-GX))
- Speed grade flexibility across C5/C6/C7 with same die (vs EP1SGX40DF1020C5N (C5 speed grade))
Design Notes
The 1020-ball FC-FBGA package at 1 mm ball pitch requires a multi-layer PCB stack-up with laser-drilled microvias in the top layer and conventional through-vias in inner layers. Per the Altera Stratix GX handbook, the 33 x 33 mm footprint demands at least 4-6 PCB layers to fan out the BGA and route controlled-impedance SERDES traces. Use the manufacturer's land-pattern and via-in-pad recommendations verbatim; deviations cause solder joint defects and SERDES signal-integrity loss at multi-gigabit rates.
Estimated: at maximum toggle activity across all 41,250 logic elements running at 5000 MHz with the 1.5 V core, the device can dissipate 10-15 W. The 1020-FBGA package exposes the silicon die for direct heat-sink attachment; without a heat-spreader, junction temperature can exceed 100 C in still air. Designers should attach a thermal interface material (TIM) plus heat sink or use a PCB copper pour with thermal vias per the Stratix GX thermal design guide. Industrial variants (C6ES) extend the operating range for harsh environments.
Do not migrate a Quartus II design targeting EP1SGX40DF1020C6N to a different speed grade (e.g., C5, C7) without re-running timing analysis. Speed-grade transitions change setup/hold margins for internal paths and SERDES channels, and may require I/O standard or PLL reassignment. Also verify that the chosen transceiver variant (DF vs GF) supports the protocol you need; mixing DF and GF parts on a previously-qualified PCB layout will pass pinout but fail link training at the SERDES level.
Compliance Information
RoHS / REACH / lead-free status not in verified web data - set to unknown; consult Altera/Intel product page for the specific EP1SGX40DF1020C6N ordering code. AEC-Q100 not applicable for FPGAs in automotive; consult AEC-Q100-qualified automotive-grade parts if required.
