EP20K100CF144C8ES - APEX-20K 100k Gate FPGA 144-LQFP | Intel
MPN: EP20K100CF144C8ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $33.9 | $3,390.00 |
| 500 | $29.75 | $14,875.00 |
| 1,000 | $26.4 | $26,400.00 |
Drop-in alternatives for EP20K100CF144C8ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP20K100CF144C8ES Maximum Ratings & Electrical Characteristics
| Series | APEX-20K |
| Logic Elements | 53248 |
| Number of Gates | 100000 |
| Embedded RAM Bits | 4160 |
| Number of I/O | 93 |
| Number of Logic Array Blocks (LABs) | 4160 |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O | 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | 8 (8 ns pin-to-pin) |
| Number of PLLs | 4 |
| Mounting Type | Surface Mount |
| Package | 144-LQFP (FQFP) 20x20 mm |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG (IEEE 1532) |
EP20K100CF144C8ES 144-lqfp (fqfp) 20x20 mm Pin Configuration Guide
Complete pinout information for EP20K100CF144C8ES (144-lqfp (fqfp) 20x20 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100CF144C8ES.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100CF144C8ES is suitable for 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control System I/O Interface, ASIC Prototyping and Validation, PCI/PCI-X Bus Bridge and Interface, Legacy Gate-Array Replacement, Flat-Panel Display Controller Interface.
Telecommunications Line-Card Glue Logic
The EP20K100CF144C8ES fits telecommunications line-card glue logic because its 100,000-gate capacity and 93 user I/Os provide ample headroom for backplane interfacing, framing, and protocol conversion between TDM buses and packet fabrics. Its MultiVolt I/O (1.8V/2.5V/3.3V) directly interfaces legacy 5V-tolerant busses through external resistors while natively supporting 3.3V framers and 1.8V network processors. The four on-chip PLLs enable independent clock synthesis for backplane, framer, and processor domains, eliminating external clock-generator ICs. In a typical line card, the FPGA sits between the TDM backplane connector and the network processor, implementing HDLC controllers, ATM SAR functions, or POS-PHY interfaces.
Recommended
Industrial Control System I/O Interface
The EP20K100CF144C8ES is well matched to industrial PLC and motor-control interfaces because its 93 I/Os and embedded EABs implement dual-port RAM for high-speed data exchange between sensors, controllers, and HMI displays. The commercial 0C to +85C temperature range covers most factory-floor enclosures with derating, and the -8 speed grade supports deterministic response times below 50 ns for interrupt-driven control loops. The 144-LQFP package is hand-solderable for prototype and low-volume service work, and Quartus II development flow is mature for IEC 61131-3-style state machines. In motor drives, the FPGA implements encoder quadrature decode, PWM generation, and fieldbus protocol glue (Profibus, CANopen) in a single device.
Recommended
ASIC Prototyping and Validation
Engineers use the EP20K100CF144C8ES as an ASIC prototype target because the 100,000-gate capacity closely matches typical gate-array designs of its era, and the EAB-based embedded RAM faithfully emulates compiled SRAM blocks. The Quartus II synthesis flow produces predictable mapping from RTL to APEX-20K LUTs, enabling pre-tapeout verification of ASIC RTL against a real silicon timing model. The 93 user I/Os map to standard logic-analyzer and oscilloscope probe footprints, simplifying bench debug. Compared with modern FPGA prototyping platforms, the EP20K100CF144C8ES delivers lower per-unit cost at moderate densities but lacks the high-speed transceivers needed for multi-million-gate ASICs.
Recommended
PCI/PCI-X Bus Bridge and Interface
The EP20K100CF144C8ES implements PCI 32-bit/33 MHz bus bridges because its 53,248 logic elements easily absorb the PCI target or master state machine, parity logic, and configuration register file in a single device. The -8 speed grade meets the 30 ns decode timing requirement with 20% margin, and the 4,160 RAM bits are sufficient for small FIFOs bridging PCI to local bus. MultiVolt I/O directly interfaces 3.3V PCI signaling without external buffers. This application is the most common APEX-20K use case and is supported by Altera/Intel reference designs including PCI target, PCI master, and compact-PCI implementations.
Recommended
Legacy Gate-Array Replacement
The EP20K100CF144C8ES serves as a low-NRE replacement for masked gate arrays in production volumes under 50,000 units because it preserves the same 144-LQFP footprint as many popular gate-array footprints of the 1990s and adds reprogrammability. Engineers convert gate-array netlists to APEX-20K LUT mapping using Quartus II migration tools, and the resulting design is fully testable and field-upgradable via JTAG. The 1.8V core reduces power dissipation versus the 5V gate arrays it replaces, and MultiVolt I/O accommodates existing 3.3V peripheral interfaces. This use case is a major driver of the EP20K family adoption in industrial automation and instrumentation.
Recommended
Flat-Panel Display Controller Interface
Flat-panel display timing controllers and TCON boards use the EP20K100CF144C8ES because its 93 user I/Os support multiple LVDS/TTL display interfaces and its four PLLs synthesize independent pixel clocks for main panel and sub-display outputs. The embedded EABs implement frame-buffer line buffers and color-space conversion look-up tables without external SRAM. The -8 speed grade is adequate for XGA (1024x768) and SXGA (1280x1024) panel timing at 60 Hz refresh. The 144-LQFP package exposes sufficient pins to drive both the panel source driver interface and the host graphics-controller interface simultaneously.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100CF144C8ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100CF144C7ES | EP20K100CF144C8 | EP20K100CF144C7 |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Speed Grade | 8 (8 ns) | 7 (7 ns) - 1 ns faster | 8 (8 ns) - identical | 7 (7 ns) - 1 ns faster |
| Logic Elements | 53248 | 53248 - identical | 53248 - identical | 53248 - identical |
| Number of Gates | 100000 | 100000 - identical | 100000 - identical | 100000 - identical |
| User I/O Pins | 93 | 93 - identical | 93 - identical | 93 - identical |
| Embedded RAM Bits | 4160 | 4160 - identical | 4160 - identical | 4160 - identical |
| Core Voltage | 1.8 V | 1.8 V - identical | 1.8 V - identical | 1.8 V - identical |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- Higher I/O count in LQFP package vs competing densities (vs EP20K100CB356C8ES)
- MultiVolt I/O across 1.8V/2.5V/3.3V without level shifters (vs EP20K100CF144C7ES (same speed grade same package))
- Embedded Array Blocks (EABs) for dual-port RAM and ROM (vs CPLD alternatives like EPM7128S)
Design Notes
The EP20K100CF144C8ES requires a stable 1.8V core supply capable of delivering up to 500 mA during configuration and full-speed operation. Each VCCINT pin must be bypassed with a 0.1 uF ceramic capacitor placed within 5 mm of the pin, and a 10 uF bulk capacitor is recommended on each side of the package. I/O banks can operate at 1.8V, 2.5V, or 3.3V independently; each VCCIO pin group requires its own decoupling network. Estimated: at 100% toggle rate and 50% utilization, the I/O banks can draw an additional 200-400 mA collectively.
The 144-LQFP package (20x20 mm body, 0.5 mm pitch) requires a 4-layer PCB minimum with continuous power and ground planes under the device. Critical signals - CLK, DCLK, nSTATUS, CONF_DONE - must be length-matched and routed on inner layers to avoid reflections. The exposed thermal pad is not present on the LQFP variant (unlike the BGA), so thermal performance depends entirely on internal power dissipation versus ambient. Keep all 144-LQFP traces on the top layer only when possible to minimize via inductance and maintain signal integrity at 33 MHz PCI frequencies.
Do not confuse the EP20K100CF144C8ES (144-LQFP, 93 I/O) with the EP20K100CB356C8ES (356-BGA, ~200 I/O) - they share the same die but are NOT pin-compatible drop-in replacements. Ensure MSEL[2:0] pins are correctly configured for the desired configuration mode (passive serial, passive parallel, or JTAG) per APEX-20K datasheet Table 12. The nSTATUS and CONF_DONE pins require external 10 kohm pull-ups to VCCIO of the configuration bank. Do not leave JTAG pins floating - they must be tied to a defined logic level to avoid unintentional boundary-scan operation.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status not present in verified web data - marked as unknown per data authenticity rules. AEC-Q100 not applicable - this is a commercial-grade FPGA not qualified for automotive use.